Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6DP6AVT8AAMCIMX6DP6AVT8AANXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
643
N/AMCIMX6DP6AVT8AARNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
260
MCIMX6DP6AVT8ABMCIMX6DP6AVT8ABNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
596
MCIMX6DP6AVT8ABRMCIMX6DP6AVT8ABRNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
1,971
N/AMCIMX6DP7CVT8AANXP SemiconductorsIC MPU I.MX6DP 800MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
250
MCIMX6DP7CVT8ABMCIMX6DP7CVT8ABNXP SemiconductorsIC MPU I.MX6DP 800MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
527
MCIMX6G0DVM05AAMCIMX6G0DVM05AANXP SemiconductorsI.MX 32-BIT MPU, ARM CORTEX-A7 CMicroprocessorsN/AN/AN/A
Speed:
528 MHz
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
SATA:
SATA 3Gbps (1)
Qualification:
Consumer
317
MCIMX6G0DVM05ABMCIMX6G0DVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,331
MCIMX6G0DVM05ABRMCIMX6G0DVM05ABRNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
860
MCIMX6G1AVM05AAMCIMX6G1AVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,067
MCIMX6G1AVM05ABMCIMX6G1AVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
620
MCIMX6G1AVM05ABRMCIMX6G1AVM05ABRNXP SemiconductorsIC MPU I.MX6G 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,052
MCIMX6G1AVM07AAMCIMX6G1AVM07AANXP SemiconductorsIC MPU I.MX6UL 696MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
696MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
832
MCIMX6G1AVM07ABMCIMX6G1AVM07ABNXP SemiconductorsIC MPU I.MX6UL 696MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
696MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,583
N/AMCIMX6G1AVM07ABRNXP SemiconductorsI.MX 32-BIT MPU, ARM CORTEX-A7 CMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
696MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
877
MCIMX6G1CVM05AAMCIMX6G1CVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,931
MCIMX6G1CVM05ABMCIMX6G1CVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,527
MCIMX6G1CVM05ABRMCIMX6G1CVM05ABRNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
58
MCIMX6G2AVM05AAMCIMX6G2AVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
717
MCIMX6G2AVM05ABMCIMX6G2AVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
1,579

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