MCIMX6DP7CVT8AA

IC MPU I.MX6DP 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 1,105 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time0 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCNPENDING ECCNEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code0000.00.0000Moisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP7CVT8AA – IC MPU I.MX6DP 800MHZ 624FCBGA

The MCIMX6DP7CVT8AA is an NXP Semiconductors i.MX 6DP-series microprocessor featuring dual ARM® Cortex®-A9 cores at 800 MHz in a 32-bit implementation. It integrates multimedia acceleration and a wide set of peripheral interfaces aimed at embedded applications.

Designed for industrial-grade use, this device combines processing performance, extensive display and I/O options, and on-chip security features to support embedded designs that require multimedia capability, rich connectivity, and extended temperature operation.

Key Features

  • Core  Dual ARM® Cortex®-A9 cores running at 800 MHz, 32-bit architecture for multithreaded embedded processing.
  • Co-processors  Multimedia co-processing and NEON™ SIMD support for accelerated media and signal processing tasks.
  • Memory support  Integrated controllers supporting LPDDR2, DDR3L and DDR3 memory types for flexible system memory configurations.
  • Display and Graphics  Multiple display interface controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces, plus graphics acceleration.
  • Connectivity  On-chip Ethernet 10/100/1000 Mbps (1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHY and one USB 2.0 OTG with PHY, and CAN interface for system networking.
  • Security  Hardware security features including ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS for system integrity and secure boot capabilities.
  • Package & Mounting  624-FCBGA (21×21) package, surface-mount construction suitable for compact embedded board designs.
  • Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.

Typical Applications

  • Industrial control systems  Dual-core processing, industrial qualification and wide operating temperature make this device suitable for embedded controllers and automation equipment.
  • Human-machine interfaces (HMI) and displays  HDMI, LVDS, MIPI/DSI and parallel LCD support combined with graphics acceleration enable rich user interfaces and panel displays.
  • Multimedia devices  On-chip multimedia co-processors and NEON™ SIMD support media playback and processing tasks for embedded media players and kiosks.
  • Networking and storage gateways  Integrated Gigabit Ethernet, SATA 3 Gbps, multiple USB ports and CAN provide connectivity options for networked embedded appliances and edge gateways.

Unique Advantages

  • Highly integrated multimedia platform: Combines dual ARM® Cortex®-A9 cores, multimedia co-processor and graphics acceleration to reduce external component count.
  • Extensive display support: Multiple display interfaces (HDMI, LVDS, MIPI/DSI, parallel) enable flexible HMI designs across product lines.
  • Robust connectivity: Gigabit Ethernet, SATA and multiple USB ports with PHYs provide a broad set of I/O options for networking and storage.
  • Industrial-ready: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh and temperature-variable environments.
  • Built-in security primitives: ARM TrustZone, A-HAB, CAAM and related security modules provide a foundation for secure boot and system integrity.
  • Flexible memory options: Support for LPDDR2, DDR3L and DDR3 allows designers to choose memory technology that matches performance and power requirements.

Why Choose MCIMX6DP7CVT8AA?

The MCIMX6DP7CVT8AA positions itself as a compact, industrially qualified embedded processor that pairs dual ARM® Cortex®-A9 performance with multimedia acceleration and a wide array of interfaces. It is appropriate for designs that demand integrated display capabilities, secure boot and broad connectivity while operating across an extended temperature range.

For engineers targeting embedded HMIs, industrial controllers, multimedia appliances or networked gateways, this i.MX 6DP-series device offers a balanced combination of processing, I/O and security features in a 624-FCBGA package from NXP Semiconductors.

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