MCIMX6DP6AVT8ABR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 456 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6DP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6DP6AVT8ABR – IC MPU I.MX6DP 852MHz 624-FCBGA
The MCIMX6DP6AVT8ABR is a dual-core ARM® Cortex®-A9 microprocessor IC operating at 852 MHz in a 624-FCBGA (21 x 21 mm) package. It implements the i.MX 6DualPlus series architecture and targets graphics- and multimedia-focused embedded designs that require broad peripheral integration and system-level features.
Designed for embedded systems with demanding display and multimedia requirements, the device combines dual 32-bit cores, dedicated multimedia/NEON SIMD acceleration and a rich set of I/O to simplify platform design and integration.
Key Features
- Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit architecture running at 852 MHz with multimedia/NEON SIMD coprocessor support for accelerated media processing.
- Memory Interfaces 64-bit external memory interfaces supporting LPDDR2, DDR3L and DDR3 to accommodate a range of memory performance and power trade-offs.
- Graphics & Video Graphics acceleration and video processing capabilities from the i.MX 6DualPlus family (including 1080p video processing as described in the series datasheet) for display-rich applications.
- Display Interfaces Multiple display controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces plus keypad support for flexible HMI designs.
- High-Speed Connectivity Integrated networking and storage interfaces: 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHYs (three host ports and one OTG), and CAN for vehicle/industrial networks.
- Security & Trust On-chip security features including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS for secure boot and system protection functions.
- Power & System Integration Includes integrated power management and PLL/clocking features described in the i.MX 6DualPlus series documentation to support efficient board-level power design.
- Package & Reliability 624-FCBGA package (21 x 21 mm, 0.8 mm pitch) in a surface-mount form factor with an extended operating temperature range of −40 °C to 125 °C.
- Compliance RoHS compliant.
Typical Applications
- High-performance infotainment systems — Leveraging dual-core processing, graphics acceleration and multiple display interfaces for advanced multimedia user interfaces.
- Graphics-intensive embedded displays — Suitable for systems requiring HDMI, LVDS or MIPI/DSI connectivity and 1080p-capable video processing.
- Multimedia devices and digital signage — Integrated storage (SATA), Gigabit Ethernet and USB connectivity for content delivery and playback platforms.
- Camera and sensor interface hubs — Support for camera sensors and peripheral connectivity to aggregate and process imaging data.
Unique Advantages
- Dual-core processing with SIMD acceleration: Delivers parallel compute capacity and NEON multimedia acceleration to handle demanding media and signal-processing tasks.
- Broad display and peripheral integration: Multiple native display controllers and a wide range of high-speed interfaces reduce external bridge and controller requirements.
- Comprehensive security feature set: Hardware security building blocks (TrustZone, A‑HAB, CAAM, CSU, SJC, SNVS) support secure boot and runtime protection strategies.
- Flexible memory support: 64-bit memory interface compatible with LPDDR2, DDR3L and DDR3 offers design flexibility across power and performance points.
- Industrial temperature capability: Rated operation from −40 °C to 125 °C for deployments requiring extended temperature resilience.
- Proven i.MX 6 series architecture: Series-level features such as integrated power management and 1080p video processing help accelerate platform development.
Why Choose MCIMX6DP6AVT8ABR?
The MCIMX6DP6AVT8ABR combines dual ARM® Cortex®-A9 cores, multimedia acceleration and a wide array of high-speed interfaces in a compact 624-FCBGA package, making it suitable for embedded designs that demand integrated display, storage and connectivity capabilities. Its extended operating temperature range and comprehensive on-chip security features address robustness and system protection needs.
This device is well suited to developers building display-driven, multimedia-rich embedded platforms who need a validated i.MX 6 series implementation with clear hardware interfaces and system-level features documented in the technical datasheet.
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