MCIMX6DP6AVT8ABR

IC MPU I.MX6DP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 456 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT8ABR – IC MPU I.MX6DP 852MHz 624-FCBGA

The MCIMX6DP6AVT8ABR is a dual-core ARM® Cortex®-A9 microprocessor IC operating at 852 MHz in a 624-FCBGA (21 x 21 mm) package. It implements the i.MX 6DualPlus series architecture and targets graphics- and multimedia-focused embedded designs that require broad peripheral integration and system-level features.

Designed for embedded systems with demanding display and multimedia requirements, the device combines dual 32-bit cores, dedicated multimedia/NEON SIMD acceleration and a rich set of I/O to simplify platform design and integration.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit architecture running at 852 MHz with multimedia/NEON SIMD coprocessor support for accelerated media processing.
  • Memory Interfaces 64-bit external memory interfaces supporting LPDDR2, DDR3L and DDR3 to accommodate a range of memory performance and power trade-offs.
  • Graphics & Video Graphics acceleration and video processing capabilities from the i.MX 6DualPlus family (including 1080p video processing as described in the series datasheet) for display-rich applications.
  • Display Interfaces Multiple display controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces plus keypad support for flexible HMI designs.
  • High-Speed Connectivity Integrated networking and storage interfaces: 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 ports with PHYs (three host ports and one OTG), and CAN for vehicle/industrial networks.
  • Security & Trust On-chip security features including ARM TrustZone (TZ), A‑HAB, CAAM, CSU, SJC and SNVS for secure boot and system protection functions.
  • Power & System Integration Includes integrated power management and PLL/clocking features described in the i.MX 6DualPlus series documentation to support efficient board-level power design.
  • Package & Reliability 624-FCBGA package (21 x 21 mm, 0.8 mm pitch) in a surface-mount form factor with an extended operating temperature range of −40 °C to 125 °C.
  • Compliance RoHS compliant.

Typical Applications

  • High-performance infotainment systems — Leveraging dual-core processing, graphics acceleration and multiple display interfaces for advanced multimedia user interfaces.
  • Graphics-intensive embedded displays — Suitable for systems requiring HDMI, LVDS or MIPI/DSI connectivity and 1080p-capable video processing.
  • Multimedia devices and digital signage — Integrated storage (SATA), Gigabit Ethernet and USB connectivity for content delivery and playback platforms.
  • Camera and sensor interface hubs — Support for camera sensors and peripheral connectivity to aggregate and process imaging data.

Unique Advantages

  • Dual-core processing with SIMD acceleration: Delivers parallel compute capacity and NEON multimedia acceleration to handle demanding media and signal-processing tasks.
  • Broad display and peripheral integration: Multiple native display controllers and a wide range of high-speed interfaces reduce external bridge and controller requirements.
  • Comprehensive security feature set: Hardware security building blocks (TrustZone, A‑HAB, CAAM, CSU, SJC, SNVS) support secure boot and runtime protection strategies.
  • Flexible memory support: 64-bit memory interface compatible with LPDDR2, DDR3L and DDR3 offers design flexibility across power and performance points.
  • Industrial temperature capability: Rated operation from −40 °C to 125 °C for deployments requiring extended temperature resilience.
  • Proven i.MX 6 series architecture: Series-level features such as integrated power management and 1080p video processing help accelerate platform development.

Why Choose MCIMX6DP6AVT8ABR?

The MCIMX6DP6AVT8ABR combines dual ARM® Cortex®-A9 cores, multimedia acceleration and a wide array of high-speed interfaces in a compact 624-FCBGA package, making it suitable for embedded designs that demand integrated display, storage and connectivity capabilities. Its extended operating temperature range and comprehensive on-chip security features address robustness and system protection needs.

This device is well suited to developers building display-driven, multimedia-rich embedded platforms who need a validated i.MX 6 series implementation with clear hardware interfaces and system-level features documented in the technical datasheet.

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