MCIMX6DP6AVT8AB

IC MPU I.MX6DP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 932 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT8AB – IC MPU I.MX6DP 852MHz 624-FCBGA

The MCIMX6DP6AVT8AB is an i.MX 6DualPlus-series microprocessor featuring dual ARM® Cortex®-A9 32-bit cores running at 852 MHz in a 624-FCBGA (21 × 21 mm) package. It combines dual-core processing, multimedia acceleration and a broad set of peripheral interfaces to address graphics‑intensive embedded designs.

Datasheet details highlight use in graphics-rich systems such as reconfigurable instrument clusters and high‑performance infotainment, with on‑chip video and display capabilities plus extensive memory and I/O options for system integration.

Key Features

  • Core Dual ARM® Cortex®-A9, 32‑bit architecture running at 852 MHz for responsive application and multimedia processing.
  • Multimedia Acceleration Integrated graphics acceleration and NEON™ SIMD support for enhanced multimedia and signal-processing tasks.
  • Memory Interfaces Supports LPDDR2, DDR3L and DDR3 memory controllers to match a range of system memory designs and performance targets.
  • Display & Video I/O Multiple display interface controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces for flexible display subsystem designs.
  • Connectivity Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 ports (3 host + PHY and 1 OTG + PHY), and CAN for vehicle/networked applications.
  • Security On‑chip security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS to support secure boot and system protection architectures.
  • Package & Mounting 624‑FBGA / 624‑FCBGA surface‑mount package supplied in a 21 × 21 mm footprint with 0.8 mm pitch package information in datasheet.
  • Operating Range Wide operating temperature range from -40 °C to 125 °C for deployment across challenging environments.

Typical Applications

  • Infotainment Systems High‑performance multimedia processing, display output and multiple audio/video interfaces make it suited for advanced in‑vehicle or standalone infotainment platforms.
  • Instrument Clusters Designed for graphics‑intensive instrument clusters and reconfigurable displays where dual‑core processing and display interfaces are required.
  • Multimedia & Vision On‑chip graphics acceleration and camera/display interfaces support multimedia playback and image sensor integration.
  • Networked Embedded Systems Gigabit Ethernet, SATA and multiple USB ports enable connectivity for storage, networking and peripheral expansion.

Unique Advantages

  • Balanced Dual‑Core Performance: Two ARM Cortex‑A9 cores at 852 MHz provide parallel processing capacity for responsive UI and multimedia workloads.
  • Comprehensive I/O Suite: Gigabit Ethernet, SATA, multiple USB ports, CAN and extensive display interfaces reduce external controller requirements and simplify BOM.
  • Flexible Memory Support: Native LPDDR2, DDR3L and DDR3 controller support allows designers to choose memory technology that fits capacity and power targets.
  • Integrated Security Building Blocks: Multiple on‑chip security engines and trust features support secure boot and data protection strategies.
  • Wide Thermal Range: -40 °C to 125 °C operating range enables use in thermally demanding embedded applications.
  • Compact, Surface‑Mount Package: 624‑FCBGA (21 × 21 mm) layout supports high‑density system designs while retaining extensive I/O.

Why Choose MCIMX6DP6AVT8AB?

The MCIMX6DP6AVT8AB positions dual ARM® Cortex®‑A9 processing, multimedia acceleration, and a broad peripheral set in a compact 624‑FCBGA package, making it well suited for embedded systems that demand display, multimedia and connectivity integration. Its memory flexibility and integrated security features help designers streamline system architecture and reduce external component count.

This part is appropriate for engineers developing graphics‑rich embedded platforms such as infotainment and reconfigurable instrument clusters, or any application requiring a combination of multimedia performance, diverse I/O and an extended operating temperature range.

Request a quote for MCIMX6DP6AVT8AB or submit your requirements to receive pricing and availability information from our team.

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