MCIMX6DP7CVT8AB

IC MPU I.MX6DP 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 869 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP7CVT8AB – IC MPU I.MX6DP 800MHZ 624FCBGA

The MCIMX6DP7CVT8AB is an ARM® Cortex®-A9 based microprocessor featuring two 32‑bit cores running at 800 MHz. It delivers integrated multimedia and graphics processing, broad memory interface support, and an extensive set of peripheral interfaces tailored for embedded and industrial applications.

Designed for graphics‑intensive and display-focused systems, this industrial‑qualified device combines performance, connectivity and on‑chip security features to support Human Machine Interfaces, video processing, and other embedded multimedia use cases.

Key Features

  • Core  Dual ARM® Cortex®‑A9 cores, 32‑bit, operating at 800 MHz for responsive application and multimedia processing.
  • Co‑processors  Multimedia acceleration and NEON™ SIMD support for enhanced signal and media processing workloads.
  • Memory Interfaces  Supports LPDDR2, DDR3L and DDR3 memory controllers for flexible system memory choices.
  • Display and Video  Multiple display interface controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces to drive a wide range of screens.
  • Connectivity  Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), multiple USB 2.0 + PHY ports (3) plus USB 2.0 OTG + PHY (1), and CAN for broad peripheral and network connectivity.
  • Security Features  Includes ARM TrustZone, A‑HAB, CAAM, CSU, SJC and SNVS to support device and data protection requirements.
  • Package and Mounting  624‑FCBGA package (21 × 21 mm, 0.8 mm pitch), surface mount for compact board designs.
  • Industrial Qualification & Temperature Range  Industrial qualification with an operating temperature range of −40 °C to 105 °C for reliable operation in demanding environments.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Human Machine Interfaces (HMI)  Drive rich graphical interfaces and touch panels using the integrated graphics and multiple display outputs.
  • Video Processing and Display  Support 1080p video processing and rendering for digital signage, media players, and visualization systems.
  • Industrial Embedded Systems  Industrial control and automation platforms that require robust temperature performance and industrial qualification.
  • Multimedia‑enabled Devices  Devices requiring accelerated media processing, NEON SIMD support, and multiple I/O options for sensors and storage.

Unique Advantages

  • Integrated Multimedia Subsystem: Combines ARM Cortex‑A9 cores with multimedia co‑processors and NEON SIMD to handle advanced media and signal tasks on a single chip.
  • Comprehensive I/O: Gigabit Ethernet, SATA, multiple USB ports, CAN and a broad set of display interfaces reduce external controller requirements.
  • Flexible Memory Support: Native controllers for LPDDR2, DDR3L and DDR3 enable designers to choose memory solutions that match performance and cost targets.
  • Industrial Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh and temperature‑sensitive environments.
  • On‑chip Security Building Blocks: ARM TrustZone, A‑HAB and CAAM, plus dedicated security modules provide multiple layers for device and data protection.
  • Compact Surface‑Mount Package: 624‑FCBGA (21 × 21 mm) offers a small footprint for space‑constrained embedded designs.

Why Choose MCIMX6DP7CVT8AB?

The MCIMX6DP7CVT8AB positions itself as a performance‑oriented, highly integrated MPU for embedded designs that demand multimedia capability, broad connectivity and industrial reliability. As part of the i.MX 6DualPlus family, it targets graphics‑intensive and display applications while providing flexible memory and I/O options to match diverse system architectures.

This device is suitable for engineers building HMIs, video and display systems, and industrial controllers who need a compact, secure and well‑connected processor solution backed by NXP Semiconductors' i.MX series technology.

Request a quote or submit a pricing inquiry to get availability and lead‑time information for the MCIMX6DP7CVT8AB.

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