MCIMX6DP6AVT1ABR

IC MPU I.MX6DP 1GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1GHz 624-FCBGA (21x21)

Quantity 1,520 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSIECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level1 (Unlimited)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT1ABR – IC MPU I.MX6DP 1GHZ 624FCBGA

The MCIMX6DP6AVT1ABR is an ARM® Cortex®-A9 based microprocessor from the i.MX 6DP series, offering dual-core 32-bit processing at up to 1 GHz. It targets embedded designs that require multimedia and graphics-capable processing along with extensive peripheral integration.

Designed for graphics-intensive and multimedia applications, this device combines dual-core compute, updated 2D/3D graphics processors and 1080p video processing with a broad set of interfaces for displays, cameras, storage and networking.

Key Features

  • Core Dual ARM® Cortex®-A9 cores running at up to 1 GHz, providing symmetric multiprocessing for embedded workloads.
  • Multimedia and SIMD Integrated multimedia DSP support and NEON™ SIMD acceleration for enhanced media and signal-processing performance.
  • Graphics and Video Updated 2D and 3D graphics processors and 1080p video processing as described in the i.MX6 series datasheet.
  • Memory Controllers Supports DDR3, DDR3L and LPDDR2 memory interfaces for flexible system memory choices.
  • Display and Camera Interfaces Includes HDMI, LCD, LVDS, MIPI/CSI and MIPI/DSI interfaces plus keypad support to connect displays and image sensors.
  • Connectivity and Storage Integrated Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps interface, three USB 2.0 ports with PHY and one USB 2.0 OTG with PHY.
  • Additional I/O CANbus support and other general-purpose interfaces for embedded system integration.
  • Security Features Hardware security building blocks including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS.
  • Package and Mounting Supplied in a 624-FCBGA package (21 × 21 mm), designed for surface-mount assembly.
  • Operating Temperature Rated for operation from −40 °C to 125 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • High-performance infotainment — Multimedia playback and user-interface processing using integrated graphics and 1080p video capability.
  • Reconfigurable displays and HMIs — Drive complex displays and touch-based interfaces via HDMI, LVDS, MIPI/DSI and LCD controllers.
  • Camera and imaging systems — Support for image sensors through MIPI/CSI and on-chip media processing for video applications.
  • Embedded networking and storage — Combine Gigabit Ethernet and SATA with multiple USB ports for connected embedded appliances and systems.

Unique Advantages

  • Balanced dual-core performance: Two Cortex-A9 cores at 1 GHz deliver multicore compute for concurrent UI and media tasks.
  • Rich multimedia subsystem: Updated 2D/3D graphics and 1080p video processing simplify implementation of graphics-intensive applications.
  • Comprehensive display and camera I/O: HDMI, LVDS, MIPI/DSI and MIPI/CSI provide flexible options for displays and sensors.
  • Robust connectivity and storage: Gigabit Ethernet, SATA 3 Gbps and multiple USB ports support high-throughput data and peripheral connectivity.
  • Integrated security building blocks: ARM TrustZone, A-HAB, CAAM and related modules enable hardware-assisted security functions.
  • Industrial thermal range and RoHS compliance: −40 °C to 125 °C rating and RoHS-compliant construction for demanding embedded environments.

Why Choose MCIMX6DP6AVT1ABR?

The MCIMX6DP6AVT1ABR positions itself as a highly integrated embedded application processor that pairs dual-core ARM® Cortex®-A9 performance with extensive multimedia, display and connectivity options. Its combination of memory flexibility, graphics/video capabilities and rich I/O makes it suitable for designs that require simultaneous user-interface, media and networking functionality.

Available in a 624-FCBGA (21 × 21 mm) surface-mount package and supplied by NXP Semiconductors, this device is intended for engineers seeking a compact, feature-rich MPU to accelerate embedded multimedia development while leveraging on-chip security and broad peripheral support.

Request a quote or submit a request for pricing and availability to start integrating the MCIMX6DP6AVT1ABR into your next embedded multimedia design.

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