MCIMX6DP6AVT1AA

IC MPU I.MX6DP 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 154 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP6AVT1AA – IC MPU I.MX6DP 1.0GHZ 624FCBGA

The MCIMX6DP6AVT1AA is an NXP Semiconductors i.MX 6DP dual-core ARM® Cortex®-A9 applications processor running at 1.0 GHz in a 624-FCBGA (21×21) package. It combines dual 32-bit Cortex-A9 cores with multimedia acceleration and a broad set of interfaces to address embedded consumer, industrial and IoT use cases.

Designed for multimedia-rich human interfaces and connected embedded systems, the device delivers integrated display controllers, high-speed connectivity and on-chip security features while supporting multiple memory types for flexible system integration.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores at 1 GHz providing 32-bit processing for responsive application and multimedia workloads.
  • Multimedia Acceleration NEON™ SIMD and multimedia co-processor support for enhanced 2D/3D graphics and media processing.
  • Memory Support Integrated controllers for LPDDR2, DDR3L and DDR3 to match a range of system memory designs.
  • Display Interfaces Multiple display interface controllers including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad support for flexible UI implementations.
  • High-Speed Connectivity Single 10/100/1000 Mbps Ethernet port, SATA 3 Gbps, three USB 2.0 ports with PHY and one USB 2.0 OTG with PHY for device and host connectivity.
  • Additional I/O CAN interface and other peripheral interfaces to support system-level integration.
  • Security Features On-chip ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS security blocks for platform-level security functions.
  • Package and Thermal 624-FCBGA (21×21) package, surface-mount, rated for an operating temperature range of -40 °C to 125 °C.
  • Power Management Support Part of the i.MX 6 series supported by companion power management ICs to ease system power design.

Typical Applications

  • Digital Signage Drives high-resolution displays and multimedia playback for kiosks and signage with HDMI and MIPI/DSI support.
  • Human–Machine Interfaces (HMI) Enables responsive touch displays and graphical user interfaces using integrated display controllers and graphics acceleration.
  • Industrial Control Systems Provides connectivity (Ethernet, CAN, USB, SATA) and wide operating temperature range for robust industrial deployments.
  • IoT Gateways Acts as an edge application processor with multiple network and peripheral interfaces for data aggregation and local processing.
  • Point-of-Sale and IP Phones Supports multimedia, networking and peripheral connectivity required for POS terminals and IP telephony devices.

Unique Advantages

  • Balanced Dual-Core Performance: Dual Cortex-A9 cores at 1 GHz deliver a balance of application responsiveness and power efficiency for embedded multimedia tasks.
  • Comprehensive Connectivity Suite: Integrated Gigabit Ethernet, SATA 3 Gbps, multiple USB ports and CAN reduce the need for external controllers and simplify BOM.
  • Flexible Memory Options: Support for LPDDR2, DDR3L and DDR3 allows designers to choose memory technologies matching cost and performance targets.
  • Multimedia-Ready: NEON SIMD and multimedia acceleration plus multiple display interfaces enable rich UI and media playback designs.
  • Integrated Security Blocks: Built-in TrustZone, CAAM and related security modules provide hardware anchors for secure boot and runtime protection.
  • Wide Temperature Range: Rated from -40 °C to 125 °C for deployment in demanding thermal environments.

Why Choose MCIMX6DP6AVT1AA?

The MCIMX6DP6AVT1AA positions itself as a highly integrated dual-core applications processor that blends multimedia capability, extensive peripheral connectivity and on-chip security to simplify embedded system design. Its support for multiple memory types and comprehensive I/O makes it suitable for diverse designs from HMIs to industrial controllers and IoT gateways.

Backed by NXP’s i.MX 6 series platform and companion power management support, this device offers a scalable hardware foundation and proven ecosystem components to help accelerate development and provide long-term supply continuity.

Request a quote or submit a purchase inquiry to evaluate MCIMX6DP6AVT1AA for your next embedded design.

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