MCIMX6DP5EVT2AB

IC MPU I.MX6DP 1.2GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.2GHz 624-FCBGA (21x21)

Quantity 831 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.2GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP5EVT2AB – IC MPU I.MX6DP 1.2GHZ 624FCBGA

The MCIMX6DP5EVT2AB is an NXP i.MX 6DP-series microprocessor featuring dual ARM® Cortex®-A9 cores running at up to 1.2 GHz. Designed for graphics- and multimedia-oriented embedded systems, this device integrates advanced graphics and video processing capabilities alongside a broad set of peripheral interfaces and memory options.

Typical use cases include graphics-intensive Human Machine Interfaces (HMI), video processing and display applications, and consumer multimedia products that require a balance of processing performance, display support, and peripheral connectivity.

Key Features

  • Processor Core  Dual ARM® Cortex®-A9 cores, 32-bit, up to 1.2 GHz for responsive application and multimedia processing.
  • Multimedia Acceleration  Integrated 2D/3D graphics and 1080p video processing elements to support rich user interfaces and video playback (series capability).
  • SIMD/DSP  NEON™ SIMD and multimedia coprocessor support to accelerate signal and media processing tasks.
  • Memory Interfaces  Supports LPDDR2, DDR3L and DDR3 memory controllers for flexible memory subsystem design.
  • Display Interfaces  Multiple display controllers including HDMI, LCD, LVDS, MIPI/DSI and parallel interfaces to connect a wide range of panels and display modules.
  • High‑Speed Connectivity  Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), and multiple USB 2.0 ports (3 × USB 2.0 + PHY, 1 × USB 2.0 OTG + PHY) for storage and networked applications.
  • Additional Interfaces  CAN and other peripheral interfaces to support automotive-grade peripherals and industrial communications (interface presence as listed).
  • Security Features  Hardware security blockset including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC, and SNVS for platform-level security integration.
  • Power Management  Integrated power management features (series capability) to support optimized power states for embedded applications.
  • Package & Mounting  624-FCBGA surface-mount package, 21 × 21 mm (0.8 mm pitch) for compact board integration.
  • Operating Range  Rated for operation from −20 °C to 105 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Human Machine Interfaces (HMI)  Drives rich graphical UIs and responsive touch displays using integrated 2D/3D graphics and display interfaces.
  • Video Processing & Display  Supports 1080p video processing and multiple display outputs for set-top, media players, and signage systems.
  • Consumer Multimedia Devices  Enables multimedia playback and peripheral connectivity (Ethernet, SATA, USB) in consumer electronics.

Unique Advantages

  • Dual-core ARM® performance: Two Cortex‑A9 cores at up to 1.2 GHz provide balanced multi-threaded application and media processing.
  • Broad display support: Multiple display controllers (HDMI, LVDS, MIPI/DSI, parallel) simplify integration with diverse panel technologies.
  • Flexible memory options: Support for LPDDR2, DDR3L and DDR3 enables designers to choose memory types that match cost and performance targets.
  • Comprehensive connectivity: Integrated Gigabit Ethernet, SATA 3 Gbps and multiple USB ports reduce external component count for networked and storage-capable designs.
  • Hardware security primitives: Built‑in TrustZone, A‑HAB, CAAM and related security modules support platform-level security architectures.
  • Compact, surface-mount package: 624-FCBGA (21×21 mm) offers a space-efficient footprint for embedded boards.

Why Choose MCIMX6DP5EVT2AB?

The MCIMX6DP5EVT2AB delivers a balanced combination of dual-core Cortex‑A9 processing, advanced multimedia/graphics capabilities, and a rich set of on-chip interfaces suited for graphics-intensive embedded applications. Its flexible memory support, integrated connectivity (Ethernet, SATA, USB), and hardware security features make it well suited for HMIs, video display systems, and consumer multimedia products that require integrated functionality in a compact package.

The device is backed by comprehensive technical documentation within the i.MX 6 series datasheet and is RoHS compliant. With an operational range from −20 °C to 105 °C and an industry-standard 624-FCBGA package, it fits designs that demand robust performance and compact board integration.

Request a quote or submit a procurement inquiry to get pricing and availability for the MCIMX6DP5EVT2AB.

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