MCIMX6DP4AVT8ABR

IC MPU I.MX6DP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 191 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP4AVT8ABR – IC MPU I.MX6DP 852MHZ 624FCBGA

The MCIMX6DP4AVT8ABR from NXP Semiconductors is a dual-core ARM® Cortex®-A9 microprocessor running at 852 MHz in a 624-FCBGA (21 × 21 mm) package. It combines a dual 32-bit core architecture with multimedia acceleration and a broad set of peripheral interfaces to address graphics-intensive embedded applications.

Designed for systems that require integrated display, storage and high-speed connectivity, the i.MX 6DualPlus family provides a balance of processing performance, graphics/video capabilities and flexible memory support to simplify system design and integration.

Key Features

  • Core  Dual ARM® Cortex®-A9 cores, 32-bit, operating at up to 852 MHz, with NEON™ SIMD multimedia acceleration and multimedia DSP support.
  • Memory and Bus  Integrated 64-bit memory interface supporting LPDDR2, DDR3L and DDR3 memory controllers for flexible system memory selection.
  • Graphics and Display  Graphics acceleration and multiple display interface controllers including HDMI, LVDS, MIPI/DSI, parallel LCD and keypad support for rich HMI implementations.
  • Connectivity and Storage  Single 10/100/1000 Mbps Ethernet MAC, SATA 3 Gbps port, three USB 2.0 ports with PHY and one USB 2.0 OTG with PHY for diverse I/O and storage options.
  • Vehicle/Control Interfaces  Integrated CAN interface for robust controller-area-network connectivity in embedded control systems.
  • Security and System Integrity  Hardware security features including ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS for secure boot and runtime protection mechanisms.
  • Power and Integration  On-chip power management and integrated system features help reduce external components and simplify board-level power design.
  • Package and Temperature  624-FCBGA surface-mount package (21 × 21 mm) with an operating temperature range of −40 °C to 125 °C for a wide-range of environmental conditions.

Typical Applications

  • Human‑Machine Interfaces (HMI)  Drive rich graphical user interfaces and multi-panel displays using integrated graphics acceleration and multiple display outputs.
  • Multimedia and Infotainment  Support video playback, audio and multimedia processing with NEON SIMD and dedicated multimedia DSP capabilities.
  • Industrial Control and Automation  Combine real-time control connectivity (CAN), Ethernet and USB with robust processing for factory HMIs and automation gateways.
  • Networked Storage and Gateway  Utilize the Gigabit Ethernet, SATA and multiple USB interfaces for compact network storage nodes and media gateways.

Unique Advantages

  • Dual‑core performance with multimedia acceleration: Dual ARM® Cortex®-A9 cores at 852 MHz plus NEON SIMD enable responsive UI and media workloads without excessive system complexity.
  • Broad peripheral integration: Built-in Ethernet, SATA, multiple USB ports, CAN and diverse display controllers reduce external controllers and lower BOM.
  • Flexible memory options: 64-bit memory interface supporting LPDDR2, DDR3L and DDR3 enables selection of memory technology to match system cost and performance targets.
  • Comprehensive security feature set: ARM TrustZone, A-HAB and CAAM provide on-chip mechanisms for secure boot and cryptographic acceleration to protect system integrity.
  • Wide operating temperature: Rated from −40 °C to 125 °C for deployment in demanding thermal environments.
  • Compact, surface-mount package: 624-FCBGA (21 × 21 mm) simplifies board layout for space-constrained embedded designs.

Why Choose MCIMX6DP4AVT8ABR?

The MCIMX6DP4AVT8ABR positions itself as a capable, integrated MPU option for embedded designs that demand multimedia performance, extensive I/O and hardware security. Its dual ARM® Cortex®-A9 cores, multimedia acceleration and broad peripheral set make it suitable for developers targeting advanced HMI, multimedia systems, industrial controls and networked storage or gateway applications.

Backed by NXP Semiconductors and accompanied by detailed technical documentation, this i.MX 6DualPlus-class device provides a combination of processing capability, memory flexibility and connectivity to accelerate time-to-market for complex embedded systems.

If you would like pricing or availability, request a quote or submit an inquiry to receive a prompt response and detailed purchasing information.

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