MCIMX6DP4AVT8AA
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 1,019 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6DP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6DP4AVT8AA – IC MPU I.MX6DP 852MHZ 624FCBGA
The MCIMX6DP4AVT8AA is an ARM® Cortex®-A9 dual-core 32-bit microprocessor running at 852 MHz, offered in a 624-FCBGA (21×21) surface-mount package. It delivers integrated multimedia and graphics capabilities alongside a broad set of peripheral interfaces, making it suitable for embedded applications that require responsive user interfaces and rich connectivity.
Designed as part of the i.MX 6 family, this device targets embedded markets such as digital signage, human‑machine interfaces, IoT gateways and portable devices, combining processing performance, interface integration and on-chip security features for robust system designs.
Key Features
- Core & Performance Dual ARM® Cortex®-A9 cores at 852 MHz delivering 32-bit application processing for responsive embedded workloads.
- Multimedia Acceleration Integrated graphics acceleration plus NEON™ SIMD and multimedia co-processor support for enhanced 2D/3D and signal processing tasks.
- Memory Support On-chip controllers supporting LPDDR2, DDR3L and DDR3 memory types to match system performance and power requirements.
- Display Interfaces Multiple display options including HDMI, LVDS, MIPI/DSI and parallel LCD plus keypad support for flexible UI implementations.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, multiple USB 2.0 ports with PHY and USB 2.0 OTG with PHY, and CAN provide extensive I/O for networked and storage-enabled systems.
- Security Features On-chip security primitives including ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS to enable hardware-backed secure boot, crypto and system protection building blocks.
- Package & Mounting 624‑FBGA (624‑FCBGA) 21×21 package in a surface mount form factor for compact board integration.
- Operating Environment Rated for an operating temperature range of −40 °C to 125 °C to support deployment in wide-temperature environments.
Typical Applications
- Digital Signage Drives multimedia-rich displays and video playback with integrated graphics acceleration and HDMI output.
- Human‑Machine Interface (HMI) Supports responsive touch and display systems using MIPI/DSI, LVDS or parallel LCD interfaces and dedicated UI peripherals.
- IoT Gateways Provides network and storage connectivity (Gigabit Ethernet, SATA, USB) for edge aggregation and gateway functions.
- Point‑of‑Sale (POS) Devices Enables secure transaction systems with multiple USB ports, Ethernet connectivity and hardware security features.
- Portable Medical & Handheld Devices Balances processing and multimedia capabilities in a compact package for portable instrumentation and consumer health products.
Unique Advantages
- Integrated multimedia processing: Dual Cortex‑A9 cores with NEON and graphics acceleration enable smooth UI and media playback without extensive external logic.
- Flexible memory options: Support for LPDDR2, DDR3L and DDR3 lets designers choose memory that matches performance and power targets.
- Comprehensive I/O and storage: Gigabit Ethernet, SATA 3 Gbps and multiple USB ports provide ready connectivity for networked and storage-rich applications.
- Built-in security building blocks: ARM TrustZone, A-HAB and CAAM among other modules support hardware-based security and trusted boot architectures.
- Compact, production-ready package: 624‑FCBGA surface-mount package offers high pin count in a compact footprint for space-constrained boards.
- Wide temperature operation: −40 °C to 125 °C rating supports deployment in demanding and varied thermal environments.
Why Choose MCIMX6DP4AVT8AA?
The MCIMX6DP4AVT8AA positions itself as a balanced embedded processor option that combines dual-core Cortex‑A9 performance with integrated multimedia, broad peripheral connectivity and hardware security features. It is well suited for engineers designing compact, interface-rich embedded systems that require both responsive user experiences and robust I/O.
As part of the i.MX 6 family, the device benefits from a scalable architecture and companion power-management support described in the series documentation, helping teams align system power, memory and display choices while leveraging a consistent processor platform.
Request a quote or submit your RFQ to obtain pricing and availability for MCIMX6DP4AVT8AA and to discuss volume options and lead times.

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