MCIMX6DP4AVT8AA

IC MPU I.MX6DP 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,019 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP4AVT8AA – IC MPU I.MX6DP 852MHZ 624FCBGA

The MCIMX6DP4AVT8AA is an ARM® Cortex®-A9 dual-core 32-bit microprocessor running at 852 MHz, offered in a 624-FCBGA (21×21) surface-mount package. It delivers integrated multimedia and graphics capabilities alongside a broad set of peripheral interfaces, making it suitable for embedded applications that require responsive user interfaces and rich connectivity.

Designed as part of the i.MX 6 family, this device targets embedded markets such as digital signage, human‑machine interfaces, IoT gateways and portable devices, combining processing performance, interface integration and on-chip security features for robust system designs.

Key Features

  • Core & Performance  Dual ARM® Cortex®-A9 cores at 852 MHz delivering 32-bit application processing for responsive embedded workloads.
  • Multimedia Acceleration  Integrated graphics acceleration plus NEON™ SIMD and multimedia co-processor support for enhanced 2D/3D and signal processing tasks.
  • Memory Support  On-chip controllers supporting LPDDR2, DDR3L and DDR3 memory types to match system performance and power requirements.
  • Display Interfaces  Multiple display options including HDMI, LVDS, MIPI/DSI and parallel LCD plus keypad support for flexible UI implementations.
  • Connectivity  Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, multiple USB 2.0 ports with PHY and USB 2.0 OTG with PHY, and CAN provide extensive I/O for networked and storage-enabled systems.
  • Security Features  On-chip security primitives including ARM TrustZone, A-HAB, CAAM, CSU, SJC and SNVS to enable hardware-backed secure boot, crypto and system protection building blocks.
  • Package & Mounting  624‑FBGA (624‑FCBGA) 21×21 package in a surface mount form factor for compact board integration.
  • Operating Environment  Rated for an operating temperature range of −40 °C to 125 °C to support deployment in wide-temperature environments.

Typical Applications

  • Digital Signage  Drives multimedia-rich displays and video playback with integrated graphics acceleration and HDMI output.
  • Human‑Machine Interface (HMI)  Supports responsive touch and display systems using MIPI/DSI, LVDS or parallel LCD interfaces and dedicated UI peripherals.
  • IoT Gateways  Provides network and storage connectivity (Gigabit Ethernet, SATA, USB) for edge aggregation and gateway functions.
  • Point‑of‑Sale (POS) Devices  Enables secure transaction systems with multiple USB ports, Ethernet connectivity and hardware security features.
  • Portable Medical & Handheld Devices  Balances processing and multimedia capabilities in a compact package for portable instrumentation and consumer health products.

Unique Advantages

  • Integrated multimedia processing: Dual Cortex‑A9 cores with NEON and graphics acceleration enable smooth UI and media playback without extensive external logic.
  • Flexible memory options: Support for LPDDR2, DDR3L and DDR3 lets designers choose memory that matches performance and power targets.
  • Comprehensive I/O and storage: Gigabit Ethernet, SATA 3 Gbps and multiple USB ports provide ready connectivity for networked and storage-rich applications.
  • Built-in security building blocks: ARM TrustZone, A-HAB and CAAM among other modules support hardware-based security and trusted boot architectures.
  • Compact, production-ready package: 624‑FCBGA surface-mount package offers high pin count in a compact footprint for space-constrained boards.
  • Wide temperature operation: −40 °C to 125 °C rating supports deployment in demanding and varied thermal environments.

Why Choose MCIMX6DP4AVT8AA?

The MCIMX6DP4AVT8AA positions itself as a balanced embedded processor option that combines dual-core Cortex‑A9 performance with integrated multimedia, broad peripheral connectivity and hardware security features. It is well suited for engineers designing compact, interface-rich embedded systems that require both responsive user experiences and robust I/O.

As part of the i.MX 6 family, the device benefits from a scalable architecture and companion power-management support described in the series documentation, helping teams align system power, memory and display choices while leveraging a consistent processor platform.

Request a quote or submit your RFQ to obtain pricing and availability for MCIMX6DP4AVT8AA and to discuss volume options and lead times.

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