MCIMX6DP4AVT1AAR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 480 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6DP |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, DDR3L, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6DP4AVT1AAR – IC MPU I.MX6DP 1.0GHZ 624FCBGA
The MCIMX6DP4AVT1AAR is a dual-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors' i.MX 6DP series, delivering up to 1.0 GHz per core in a 32-bit implementation. It targets graphics- and multimedia-focused embedded designs that require integrated display, video processing and a broad set of peripheral interfaces.
Designed for system-level integration, the device combines processing performance with multimedia accelerators, multiple memory controller options and a comprehensive set of high-speed and legacy interfaces to simplify connectivity in embedded applications.
Key Features
- Core and Performance — Dual ARM® Cortex®-A9 cores operating up to 1 GHz, providing parallel processing capability for responsive embedded applications.
- Multimedia and DSP — Multimedia co-processors and NEON™ SIMD acceleration plus 1080p video processing for advanced graphics and video workflows.
- Memory Support — Integrated memory controllers supporting LPDDR2, DDR3L and DDR3 to match a range of system memory requirements.
- Display and Camera Interfaces — Multiple display interfaces including HDMI, LCD parallel, LVDS and MIPI/DSI, plus keypad support for rich human‑machine interfaces.
- High-speed Connectivity — On-chip Gigabit Ethernet (10/100/1000 Mbps) and SATA 3 Gbps for networked and storage-attached applications.
- USB and Peripheral I/O — Three USB 2.0 ports with PHY plus one USB 2.0 OTG with PHY, and additional CAN interface for flexible peripheral integration.
- Security and System Management — Integrated security features such as ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and cryptographic functions.
- Power and Integration — Integrated power management elements referenced in the product documentation to streamline supply regulation and system design.
- Package and Thermal Range — 624‑FCBGA (21 × 21 mm) surface-mount package and operating temperature range from −40 °C to 125 °C for deployment in temperature-challenging environments.
Typical Applications
- Graphics-intensive embedded systems — Use the dual Cortex‑A9 cores and multimedia accelerators for advanced user interfaces, 1080p video playback and graphical displays.
- Human‑Machine Interfaces (HMI) — Multiple display interfaces (HDMI, LVDS, MIPI/DSI, parallel LCD) and keypad support enable rich HMI designs.
- Networked and storage-enabled devices — Integrated Gigabit Ethernet and SATA 3 Gbps support connected appliances, media gateways and storage‑attached modules.
- Embedded connectivity and control — USB ports, CAN and broad peripheral I/O make the device suitable for connected embedded controllers and communication gateways.
Unique Advantages
- Dual-core processing for multitasking: Two 32-bit Cortex‑A9 cores at up to 1 GHz enable concurrent handling of UI, multimedia and background tasks.
- Comprehensive multimedia subsystem: 1080p video processing plus NEON™ SIMD and multimedia co-processors reduce external accelerator requirements and simplify system architecture.
- Extensive I/O consolidation: Ethernet, SATA, multiple USB ports, CAN and versatile display/camera interfaces reduce BOM and board complexity.
- Robust security primitives: Hardware security modules and secure boot elements provide building blocks for protected systems and trusted execution.
- Wide temperature support and compact package: −40 °C to 125 °C operating range and a 624‑FCBGA 21×21 mm footprint support dense designs in thermally demanding environments.
- Scalable within the i.MX 6 family: Being part of NXP’s i.MX 6 series enables design scalability across related processors in the same product family.
Why Choose MCIMX6DP4AVT1AAR?
The MCIMX6DP4AVT1AAR pairs dual Cortex‑A9 performance with integrated multimedia and a broad complement of interfaces to streamline complex embedded designs. Its combination of display engines, video processing and high-speed peripherals is tailored for systems that demand media-rich user experiences alongside robust connectivity.
As a member of NXP’s i.MX 6 series, the device offers a clear migration path within the family and a set of documented architectural and package details to accelerate development, prototyping and production for embedded product lines.
Request a quote or submit an inquiry to obtain pricing, availability and to discuss quantity options for the MCIMX6DP4AVT1AAR.

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