MCIMX6DP4AVT1AAR

IC MPU I.MX6DP 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 480 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP4AVT1AAR – IC MPU I.MX6DP 1.0GHZ 624FCBGA

The MCIMX6DP4AVT1AAR is a dual-core ARM® Cortex®-A9 microprocessor from NXP Semiconductors' i.MX 6DP series, delivering up to 1.0 GHz per core in a 32-bit implementation. It targets graphics- and multimedia-focused embedded designs that require integrated display, video processing and a broad set of peripheral interfaces.

Designed for system-level integration, the device combines processing performance with multimedia accelerators, multiple memory controller options and a comprehensive set of high-speed and legacy interfaces to simplify connectivity in embedded applications.

Key Features

  • Core and Performance — Dual ARM® Cortex®-A9 cores operating up to 1 GHz, providing parallel processing capability for responsive embedded applications.
  • Multimedia and DSP — Multimedia co-processors and NEON™ SIMD acceleration plus 1080p video processing for advanced graphics and video workflows.
  • Memory Support — Integrated memory controllers supporting LPDDR2, DDR3L and DDR3 to match a range of system memory requirements.
  • Display and Camera Interfaces — Multiple display interfaces including HDMI, LCD parallel, LVDS and MIPI/DSI, plus keypad support for rich human‑machine interfaces.
  • High-speed Connectivity — On-chip Gigabit Ethernet (10/100/1000 Mbps) and SATA 3 Gbps for networked and storage-attached applications.
  • USB and Peripheral I/O — Three USB 2.0 ports with PHY plus one USB 2.0 OTG with PHY, and additional CAN interface for flexible peripheral integration.
  • Security and System Management — Integrated security features such as ARM TrustZone (ARM TZ), A-HAB, CAAM, CSU, SJC and SNVS to support secure boot and cryptographic functions.
  • Power and Integration — Integrated power management elements referenced in the product documentation to streamline supply regulation and system design.
  • Package and Thermal Range — 624‑FCBGA (21 × 21 mm) surface-mount package and operating temperature range from −40 °C to 125 °C for deployment in temperature-challenging environments.

Typical Applications

  • Graphics-intensive embedded systems — Use the dual Cortex‑A9 cores and multimedia accelerators for advanced user interfaces, 1080p video playback and graphical displays.
  • Human‑Machine Interfaces (HMI) — Multiple display interfaces (HDMI, LVDS, MIPI/DSI, parallel LCD) and keypad support enable rich HMI designs.
  • Networked and storage-enabled devices — Integrated Gigabit Ethernet and SATA 3 Gbps support connected appliances, media gateways and storage‑attached modules.
  • Embedded connectivity and control — USB ports, CAN and broad peripheral I/O make the device suitable for connected embedded controllers and communication gateways.

Unique Advantages

  • Dual-core processing for multitasking: Two 32-bit Cortex‑A9 cores at up to 1 GHz enable concurrent handling of UI, multimedia and background tasks.
  • Comprehensive multimedia subsystem: 1080p video processing plus NEON™ SIMD and multimedia co-processors reduce external accelerator requirements and simplify system architecture.
  • Extensive I/O consolidation: Ethernet, SATA, multiple USB ports, CAN and versatile display/camera interfaces reduce BOM and board complexity.
  • Robust security primitives: Hardware security modules and secure boot elements provide building blocks for protected systems and trusted execution.
  • Wide temperature support and compact package: −40 °C to 125 °C operating range and a 624‑FCBGA 21×21 mm footprint support dense designs in thermally demanding environments.
  • Scalable within the i.MX 6 family: Being part of NXP’s i.MX 6 series enables design scalability across related processors in the same product family.

Why Choose MCIMX6DP4AVT1AAR?

The MCIMX6DP4AVT1AAR pairs dual Cortex‑A9 performance with integrated multimedia and a broad complement of interfaces to streamline complex embedded designs. Its combination of display engines, video processing and high-speed peripherals is tailored for systems that demand media-rich user experiences alongside robust connectivity.

As a member of NXP’s i.MX 6 series, the device offers a clear migration path within the family and a set of documented architectural and package details to accelerate development, prototyping and production for embedded product lines.

Request a quote or submit an inquiry to obtain pricing, availability and to discuss quantity options for the MCIMX6DP4AVT1AAR.

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