MCIMX6D7CVT08AE

IC MPU I.MX6D 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 23 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D7CVT08AE – IC MPU I.MX6D 800MHZ 624FCBGA

The MCIMX6D7CVT08AE is an NXP Semiconductors i.MX 6D series microprocessor IC featuring dual ARM® Cortex®-A9 cores at 800 MHz. Designed for embedded and industrial applications, it combines general-purpose processing with multimedia and connectivity interfaces for integrated system designs.

As a member of the i.MX 6D family, the device targets multimedia-focused embedded systems that require display, storage and network connectivity while offering industrial temperature qualification and on-chip security features.

Key Features

  • CPU Cores — Dual ARM® Cortex®-A9 cores, 32-bit architecture running at 800 MHz for parallel application and system tasks.
  • Multimedia & Acceleration — Multimedia/DSP capabilities with NEON™ SIMD and graphics acceleration; i.MX 6D series documentation describes integrated 2D/3D graphics and 1080p video processing.
  • Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory, enabling flexible system memory choices.
  • Display & UI — Display interface controllers include LCD and keypad support for human‑machine interface (HMI) designs.
  • High-speed Peripherals — Single SATA 3 Gbps interface and Gigabit Ethernet (10/100/1000 Mbps) for local storage and networking.
  • USB & I/O — Four USB 2.0 ports with PHYs and additional CAN interface for peripheral connectivity and vehicle/industrial networks.
  • Security — Hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting — 624‑FCBGA (21 × 21 mm) package, surface mount.
  • Industrial Qualification & Temperature Range — Industrial qualification with operating temperature range from −40 °C to 105 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Multimedia Systems — Embedded video and graphics platforms leveraging NEON™ SIMD and graphics acceleration for display and media playback.
  • Human‑Machine Interfaces (HMI) — Industrial HMIs and control panels using the LCD and keypad interfaces alongside robust temperature qualification.
  • Networking & Storage Appliances — Networked devices and storage gateways using Gigabit Ethernet and SATA 3 Gbps connectivity.
  • Imaging & Sensor Systems — Camera and sensor integration supported by the series’ peripheral set for embedded imaging applications.

Unique Advantages

  • Balanced Processing Performance: Dual ARM Cortex‑A9 cores at 800 MHz provide parallel compute capability for application and system tasks.
  • Integrated Multimedia Engine: NEON™ SIMD and on‑chip graphics acceleration simplify multimedia system design and reduce external component needs.
  • Comprehensive Connectivity: Built‑in USB, Gigabit Ethernet, SATA and CAN interfaces minimize additional controller requirements and shorten BOM.
  • Industrial-Grade Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in demanding environments.
  • Hardware Security Suite: Multiple on‑chip security mechanisms protect boot, runtime and sensitive assets without relying solely on software.
  • Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to optimize cost and performance.

Why Choose MCIMX6D7CVT08AE?

The MCIMX6D7CVT08AE positions itself as a versatile, industrially qualified embedded processor that combines dual Cortex‑A9 performance with a rich set of multimedia and connectivity features. Its integrated memory controllers, hardware security, and peripheral set make it suitable for systems requiring both compute and I/O integration.

This part is well suited to engineering teams building industrial HMIs, multimedia appliances, networked storage or imaging devices that demand rugged operation and a consolidated component set backed by the i.MX 6D series documentation from NXP Semiconductors.

Request a quote or submit your project requirements to receive pricing and availability for the MCIMX6D7CVT08AE. Our team can provide volume pricing, lead‑time details and technical support to help you move from design to production.

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