MCIMX6D6AVT10AER

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 437 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT10AER – IC MPU I.MX6D 1.0GHZ 624FCBGA

The MCIMX6D6AVT10AER is an NXP Semiconductors i.MX 6D-series microprocessor based on dual ARM® Cortex®-A9 cores operating at up to 1.0 GHz. It combines dual 32-bit application cores with multimedia acceleration and a broad set of integrated peripheral interfaces to support display-rich and connected embedded systems.

Designed for embedded infotainment, telematics, HMI and display-based cluster applications, the device delivers a balance of processing performance, multimedia capabilities and system integration for complex embedded designs.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit, running up to 1 GHz for responsive application processing and multitasking.
  • Multimedia & SIMD Integrated multimedia co-processors with NEON™ SIMD support and graphics acceleration to handle 2D/3D graphics and media processing tasks.
  • Memory Interfaces Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible memory subsystem design.
  • Display & UI Display interface controllers including LCD and keypad interfaces to support sophisticated human–machine interfaces.
  • High‑Speed Connectivity Integrated Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, and four USB 2.0 ports with PHY provide a comprehensive set of wired connectivity options.
  • Additional Peripherals On-chip CAN interface and multiple peripheral controllers simplify integration with vehicle networks and industrial subsystems.
  • Security & Trust Hardware features including ARM TrustZone, boot security, cryptographic engines, secure fusebox, secure JTAG and tamper detection provide a layered approach to system security.
  • Package & Mounting 624-FCBGA package (21 × 21 mm) designed for surface-mount assembly, suitable for compact embedded board designs.
  • Extended Operating Range Rated for operation from −40 °C to 125 °C to accommodate demanding environmental conditions.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment systems — Provides the processing and multimedia acceleration needed for modern in-cabin infotainment and entertainment applications.
  • Telematics — Integrates networking, storage and processing for connected telematics units and data gateways.
  • Human–Machine Interfaces (HMI) — Drives graphical displays and input interfaces for touchscreens, clusters and operator consoles.
  • Display-based clusters — Supports display controllers and graphics acceleration for instrument clusters and information displays.

Unique Advantages

  • Balanced processing and multimedia — Dual Cortex‑A9 cores plus NEON SIMD and graphics acceleration enable concurrent application and media workloads.
  • Comprehensive on-chip I/O — Built-in Gigabit Ethernet, SATA, multiple USB ports, and CAN reduce external component count and simplify system design.
  • Robust security feature set — Multiple hardware security mechanisms help protect boot, runtime and sensitive data without extensive external security ICs.
  • Flexible memory support — LPDDR2, LVDDR3 and DDR3 controller support allows designers to select memory technology that matches cost, power and performance targets.
  • High-temperature operation — −40 °C to 125 °C operating range supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6D6AVT10AER?

The MCIMX6D6AVT10AER positions itself as a highly integrated application processor that combines dual ARM® Cortex®-A9 performance with multimedia acceleration, broad peripheral connectivity and a comprehensive security feature set. It is suited to embedded designs requiring balanced compute, media handling and wired interfaces in a compact 624-FCBGA package.

Supported by NXP Semiconductors’ i.MX 6D family documentation and product datasheet material, this device is appropriate for engineers designing infotainment, telematics, HMI and display-centric systems that need scalable processing, integrated I/O and extended temperature operation.

Request a quote or submit an inquiry to obtain pricing, availability and support for MCIMX6D6AVT10AER and to start your parts procurement process.

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