MCIMX6D6AVT10ADR

The MCIMX6D6AVT10ADR from NXP Semiconductors is a dual-core ARM® Cortex®-A9 microprocessor operating at 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It is targeted at embedded designs that require multicore processing, multimedia acceleration, extensive I/O and hardware security features.

With integrated memory controllers, display interfaces, multiple high-speed connectivity ports and a wide operating temperature range, this device supports a range of embedded applications where performance, interface integration and system-level security are required.

Key Features

• Core and Performance — Dual ARM® Cortex®-A9 cores, 32-bit, running at 1 GHz to support parallel application workloads.
• Multimedia and Acceleration — Multimedia co-processors with NEON™ SIMD and graphics acceleration for media processing and UI rendering; display controllers for LCD and keypad interfaces.
• Memory Support — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match system memory requirements.
• High-Speed Connectivity — Single Gigabit Ethernet port (10/100/1000 Mbps), one SATA 3 Gbps interface and four USB 2.0 ports with PHY for diverse connectivity and storage options.
• Vehicle and Field Bus Interface — CAN interface available for field-bus or vehicle network integration.
• Security Features — Hardware security support including ARM TrustZone (ARM TZ), boot security, cryptography engines, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
• Package and Mounting — 624-FCBGA (21 × 21 mm) surface-mount package; package information in datasheet cites 21 × 21 mm with 0.8 mm pitch.
• Operating Range — Specified operating temperature from −40 °C to 125 °C for thermal robustness in challenging environments.
• Compliance — RoHS compliant.

Typical Applications

• Human–Machine Interfaces (HMIs) — Use the graphics acceleration and LCD display controller to drive advanced operator displays and touchscreen interfaces.
• Industrial Control and Automation — Dual-core processing, CAN and Ethernet support make the device suitable for control nodes, protocol gateways and automation controllers.
• Multimedia Embedded Devices — Multimedia co-processors and NEON SIMD enable media processing tasks for compact multimedia players or vision pre-processing.
• Networking and Storage Gateways — Gigabit Ethernet, SATA and multiple USB 2.0 ports support networked appliances, edge gateways and storage-connected embedded systems.

Unique Advantages

• Dual-Core ARM® Compute: Enables parallel application and I/O task distribution for responsive embedded systems.
• Broad Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types lets designers optimize cost, performance and power trade-offs.
• Integrated High-Speed Interfaces: On-chip Gigabit Ethernet, SATA 3 Gbps and four USB 2.0 ports reduce external bridge requirements and simplify board-level design.
• Comprehensive Hardware Security: Multiple on-chip security features (TrustZone, cryptography, secure JTAG, secure memory and tamper detection) help protect boot and runtime integrity.
• Wide Thermal Range: −40 °C to 125 °C operating range supports deployment in thermally demanding environments.
• Compact FCBGA Packaging: 624-ball FCBGA in a 21 × 21 mm footprint provides a high-integration solution for space-constrained designs.

Why Choose MCIMX6D6AVT10ADR?

The MCIMX6D6AVT10ADR combines dual ARM® Cortex®-A9 processing, multimedia acceleration and a comprehensive set of high-speed I/O to form a versatile embedded application platform. Its integrated memory controllers and broad peripheral set reduce external components and simplify BOM and board design.

This device is suited to designers who need a balanced combination of compute, multimedia capability, hardware security and wide operating temperature performance for embedded systems requiring reliable, integrated solutions.

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