MCIMX6D6AVT08AER

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,219 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT08AER – IC MPU I.MX6D 852MHz 624-FCBGA

The MCIMX6D6AVT08AER is a dual-core ARM® Cortex®-A9 microprocessor from NXP's i.MX 6D family, running at 852 MHz in a 624‑FCBGA (21 × 21 mm) surface-mount package. It integrates multimedia co-processing (NEON™ SIMD) and a broad set of peripheral interfaces to address multimedia-focused embedded and display-based systems.

With memory controller support for LPDDR2, LVDDR3 and DDR3, plus on-chip graphics acceleration and multiple high-speed interfaces, this device delivers a balanced combination of processing, graphics and I/O integration for compact embedded designs.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32‑bit architecture operating at 852 MHz with multimedia co-processor (NEON™ SIMD) for enhanced data and signal processing.
  • Memory Support Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 to match a range of system memory architectures.
  • Graphics & Display On-chip graphics acceleration with dedicated display interface controllers for LCD and keypad-driven user interfaces.
  • Connectivity & Storage Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), four USB 2.0 ports with PHY and CAN interface for diverse connectivity and storage needs.
  • Security & Boot Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting 624‑FCBGA supplier device package (21 × 21 mm), surface mount for dense board integration; RoHS compliant.
  • Operating Range Extended operating temperature range from −40 °C to 125 °C for thermally demanding environments.

Typical Applications

  • Multimedia and display systems — Leverages graphics acceleration and LCD interface support for video playback and rich on-screen interfaces.
  • Human‑machine interfaces (HMI) — Dual-core processing and NEON SIMD enable responsive control panels and interactive displays.
  • Networking and storage gateways — Integrated Gigabit Ethernet and SATA allow local storage and high-throughput data connectivity.
  • Industrial control and instrumentation — CAN interface and wide temperature range support robust communication and deployment in industrial environments.

Unique Advantages

  • High-performance dual-core processing: Two ARM® Cortex®-A9 cores at 852 MHz with NEON™ SIMD accelerate multimedia and compute tasks.
  • Comprehensive multimedia integration: On-chip graphics acceleration plus display controllers reduce external component count and simplify board design.
  • Broad, high-speed I/O: Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CAN deliver flexible connectivity for diverse system architectures.
  • Robust security feature set: TrustZone, secure boot and cryptography features enable implementation of layered runtime and boot protections.
  • Compact, manufacturable package: 624‑FCBGA (21 × 21 mm) surface-mount package enables dense layouts while remaining RoHS compliant.
  • Wide thermal capability: −40 °C to 125 °C operating range supports deployment in challenging thermal environments.

Why Choose MCIMX6D6AVT08AER?

The MCIMX6D6AVT08AER positions itself as a highly integrated embedded processor option within the i.MX 6D family, delivering dual-core ARM® Cortex®-A9 performance, multimedia acceleration and a comprehensive peripheral set in a compact package. It is well suited to designs that require balanced compute and graphics capability alongside extensive connectivity and strong security primitives.

As part of the i.MX 6D series, this device offers a path for designers seeking a scalable multimedia-capable processor with established package options and detailed technical documentation to support system integration and deployment.

Request a quote or submit an inquiry to obtain pricing and availability for the MCIMX6D6AVT08AER and to discuss volume requirements or lead times.

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