MCIMX6D6AVT08AE

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 734 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT08AE – IC MPU I.MX6D 852MHZ 624FCBGA

The MCIMX6D6AVT08AE is a dual-core ARM® Cortex®-A9 microprocessor IC from the i.MX 6D series, running at 852 MHz in a 32-bit architecture. This device targets embedded multimedia and display-centric designs that require integrated processing, graphics acceleration, and a broad set of peripheral interfaces.

With on-chip multimedia acceleration, extensive memory interface support, and a wide operating temperature range, the MCIMX6D6AVT08AE is suited for systems that combine user interfaces, networked connectivity, and storage in a compact surface-mount package.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores at 852 MHz delivering balanced processing for embedded multimedia and control tasks.
  • Co-Processing & Acceleration Integrated multimedia DSP and NEON™ SIMD support for enhanced media and signal-processing workloads; graphics acceleration included for 2D/3D rendering and video handling.
  • Memory Interfaces Built-in controllers for LPDDR2, LVDDR3 and DDR3 memory types to support flexible system memory configurations.
  • Display & HMI Display interface controllers supporting keypad and LCD connections for modern human-machine interfaces and infotainment screens.
  • Network & Communication 10/100/1000 Mbps Ethernet (1) and CAN interfaces enable wired networking and vehicle/industrial fieldbus connectivity.
  • Storage & USB Single SATA 3 Gbps interface plus four USB 2.0 ports with PHY provide local storage and peripheral connectivity options.
  • Security Features Comprehensive hardware security including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting 624-FCBGA surface-mount package (21 × 21 mm, 0.8 mm pitch) for compact board-level integration.
  • Operating Range Rated for operation from −40 °C to 125 °C to accommodate demanding thermal environments.
  • Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • Embedded Multimedia Systems Ideal for systems requiring integrated video and graphics acceleration combined with general-purpose processing.
  • Human-Machine Interfaces (HMI) Suited for display-driven control panels and touchscreen interfaces using the LCD and keypad display controllers.
  • Networked Appliances and Gateways Ethernet and CAN support enable deployment in networked and industrial gateway applications.
  • Storage-Enabled Devices SATA and multiple USB ports allow integration of local storage, media playback, and peripheral expansion.

Unique Advantages

  • Balanced Dual-Core Processing: Dual ARM Cortex-A9 cores at 852 MHz provide a mid-range processing platform suitable for concurrent UI and background tasks.
  • Integrated Multimedia Engine: Multimedia DSP and NEON SIMD reduce off-chip acceleration needs and simplify media pipeline design.
  • Broad I/O Set: Built-in Ethernet, CAN, SATA, and multiple USB ports minimize external controller count and reduce BOM complexity.
  • Comprehensive Hardware Security: Multiple on-chip security primitives (TrustZone, secure boot, cryptography, secure JTAG, etc.) enable secure system architectures.
  • Compact, High-Density Package: 624-FCBGA (21 × 21 mm) provides a small footprint for space-constrained boards while supporting complex signal routing.
  • Wide Temperature Capability: Operating range from −40 °C to 125 °C supports deployment in thermally challenging embedded environments.

Why Choose MCIMX6D6AVT08AE?

The MCIMX6D6AVT08AE combines dual-core Cortex-A9 performance with integrated multimedia acceleration, extensive memory and I/O options, and a compact FCBGA package—delivering a versatile platform for embedded systems that need processing, display, storage and security in a single device. Its comprehensive security features and broad peripheral set simplify architecture decisions and help accelerate time to market.

This device is well suited for engineering teams designing multimedia-rich HMIs, networked appliances, storage-enabled devices, and other embedded platforms that require a tightly integrated MPU with robust security and a wide operating temperature envelope.

Request a quote or submit a product inquiry for the MCIMX6D6AVT08AE to receive pricing and availability details for your design requirements.

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