MCIMX6D6AVT08AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 1,626 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D6AVT08AC – IC MPU I.MX6D 852MHZ 624FCBGA
The MCIMX6D6AVT08AC is a dual-core ARM® Cortex®-A9 embedded applications processor running at up to 852 MHz, designed for multimedia-focused and connected embedded systems. It combines CPU performance with dedicated multimedia processing and a broad set of on-chip interfaces to support displays, storage, networking and sensor connectivity.
With integrated memory controllers, high-speed interfaces and comprehensive security blocks, this 624-FCBGA (21 × 21 mm) surface-mount device targets designs that require consolidated system integration, extended operating temperature range and hardware security features.
Key Features
- Core & Architecture — Dual ARM® Cortex®-A9 cores, 32-bit, up to 852 MHz provide a balanced mix of application processing and real-time handling for embedded multimedia tasks.
- Multimedia & Acceleration — Multimedia co-processors including NEON™ SIMD and graphics acceleration support advanced media processing and UI rendering.
- Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 enable flexible memory choices for performance and cost trade-offs.
- Display & User I/O — Display interface controllers for LCD and keypad facilitate human-machine interface designs and embedded displays.
- Networking & Connectivity — On-chip Ethernet 10/100/1000 Mbps (1) and CAN support wired networking and vehicle/industrial bus integration.
- Storage & USB — Single SATA 3 Gbps interface and four USB 2.0 ports with PHY provide options for local storage and peripheral connectivity.
- Security Features — Hardware security includes ARM TrustZone, boot security, cryptography engines, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection to harden platform security.
- Package & Thermal — 624-FBGA / 624-FCBGA (21×21 mm) package in a surface-mount form factor; specified operating temperature range −40 °C to 125 °C.
- Compliance — RoHS compliant to support environmentally conscious designs.
Typical Applications
- Human-Machine Interfaces (HMI) — Drive LCD displays and keypad-based control panels with integrated graphics acceleration and display controllers.
- Industrial Control — Dual-core processing, CAN connectivity and wide temperature range suit embedded control, monitoring and automation systems.
- Multimedia Systems & Digital Signage — NEON SIMD and graphics acceleration enable media playback and rich user interfaces for signage and media players.
- Networked Storage & NAS — Integrated SATA 3 Gbps and Gigabit Ethernet support compact network-attached storage and local storage appliances.
- Imaging & Camera Systems — Multimedia co-processors and broad I/O options support camera sensor interfacing and connected imaging applications.
Unique Advantages
- Highly Integrated Peripheral Set: Built-in Ethernet, SATA, multiple USB ports, CAN and display controllers reduce external component count and simplify board design.
- Balanced Compute with Multimedia Acceleration: Dual Cortex‑A9 cores plus NEON™ SIMD and graphics acceleration deliver application processing alongside dedicated media handling.
- Flexible Memory Support: Native controllers for LPDDR2, LVDDR3 and DDR3 allow designers to match memory type to performance and cost targets.
- Comprehensive Hardware Security: A suite of security features (ARM TZ, boot security, cryptography, secure fusebox, secure JTAG, secure memory/RTC, tamper detection) helps protect system integrity and assets.
- Designed for Robust Environments: Specified operating range of −40 °C to 125 °C supports deployment in thermally demanding embedded applications.
- Compact Surface-Mount Package: 624-FCBGA (21×21 mm) footprint provides a high pin-count solution in a compact area for dense system designs.
Why Choose MCIMX6D6AVT08AC?
The MCIMX6D6AVT08AC positions itself as a versatile, integration-focused embedded processor for designs that need multimedia capability, broad peripheral connectivity and on-chip security. Its dual Cortex‑A9 cores, multimedia accelerators and a comprehensive set of interfaces make it suitable for display-driven systems, connected storage and embedded control platforms.
For projects demanding consolidated functionality in a compact package and long-term platform scalability, this device offers a clear combination of processing, I/O and security features that streamline BOM and system design while supporting extended temperature operation.
Request a quote or submit a procurement inquiry for MCIMX6D6AVT08AC to begin evaluation and sourcing for your embedded application needs.

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