MCIMX6D5EZK08AE
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 569-MAPBGA (12x12) |
|---|---|
| Quantity | 1,543 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 569-MAPBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 569-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 800MHz | Supplier Device Package | 569-MAPBGA (12×12) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D5EZK08AE – IC MPU I.MX6D 800MHZ 569MAPBGA
The MCIMX6D5EZK08AE is an NXP i.MX 6D series microprocessor IC based on dual ARM® Cortex®-A9 cores, running at 800 MHz. It targets embedded multimedia applications that require integrated processing, graphics and peripheral connectivity.
Designed for multimedia-focused embedded designs, the device integrates 2D and 3D graphics processors, 1080p video processing capability and on-chip power management while offering a broad set of interfaces for networking, storage and display subsystems.
Key Features
- Core and Performance Dual ARM® Cortex®-A9 cores, 32-bit architecture, operating at up to 800 MHz for balanced multi-threaded processing.
- Multimedia Acceleration Integrated 2D and 3D graphics processors and 1080p video processing for demanding display and video tasks; NEON™ SIMD multimedia support for optimized media algorithms.
- Memory Support Memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory types to accommodate a range of system memory configurations.
- Storage and Networking Single SATA interface (3 Gbps) and single Gigabit Ethernet (10/100/1000 Mbps) for local storage and high-speed network connectivity.
- USB and Peripheral I/O Four USB 2.0 ports with integrated PHY plus additional interfaces including CAN, keypad and LCD display controllers.
- Security and Boot Hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection for layered device protection.
- Package and Assembly Supplier device package: 569‑MAPBGA (12 × 12); package case listed as 569‑LFBGA. Surface-mount device suitable for board-level assembly.
- Operating Range Rated for an operating temperature range of −20 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- Industrial HMI and Control Drive graphical user interfaces and local processing for industrial control panels and human-machine interfaces using integrated graphics and display controllers.
- Multimedia Devices Enable video processing and media playback tasks with 1080p-capable video engines and NEON SIMD acceleration.
- Networked Edge Appliances Provide networking and storage connectivity for edge devices and gateways with Gigabit Ethernet and SATA interfaces.
- Embedded Connectivity Nodes Support peripheral-rich designs requiring multiple USB ports, CAN and other serial interfaces for sensors, peripherals and expansion.
Unique Advantages
- Balanced dual-core processing: Dual ARM Cortex‑A9 cores at 800 MHz provide a multi-core embedded compute foundation suitable for concurrent multimedia and I/O tasks.
- Integrated multimedia subsystem: On-chip 2D/3D graphics and 1080p video processing reduce the need for external acceleration components.
- Broad memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 enables designers to select memory types that match cost, performance and power targets.
- Comprehensive I/O set: Built-in Gigabit Ethernet, SATA, multiple USB ports and CAN simplify system architecture for connected embedded products.
- Hardware security primitives: TrustZone, secure boot and cryptography features help architects implement layered device security and protected boot flows.
- Industrial temperature capability: Specification to −20 °C to 105 °C supports deployment in a wide range of ambient conditions.
Why Choose MCIMX6D5EZK08AE?
The MCIMX6D5EZK08AE positions itself as a highly integrated multimedia-capable processor for embedded designs needing a balance of compute, graphics and peripheral connectivity. Its combination of dual Cortex‑A9 cores, integrated graphics/video processing, multiple memory options and a broad set of interfaces makes it suitable for industrial HMIs, multimedia appliances and connected edge systems.
With on-chip power management and hardware security features, the device supports designs that require energy-aware operation and secure boot/cryptography capabilities. The package options and RoHS compliance make it amenable to standard surface-mount production workflows.
Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6D5EZK08AE and support for integration into your next embedded design.

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