MCIMX6D5EZK08AE

IC MPU I.MX6D 800MHZ 569MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 569-MAPBGA (12x12)

Quantity 1,543 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package569-MAPBGA (12x12)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case569-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package569-MAPBGA (12×12)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EZK08AE – IC MPU I.MX6D 800MHZ 569MAPBGA

The MCIMX6D5EZK08AE is an NXP i.MX 6D series microprocessor IC based on dual ARM® Cortex®-A9 cores, running at 800 MHz. It targets embedded multimedia applications that require integrated processing, graphics and peripheral connectivity.

Designed for multimedia-focused embedded designs, the device integrates 2D and 3D graphics processors, 1080p video processing capability and on-chip power management while offering a broad set of interfaces for networking, storage and display subsystems.

Key Features

  • Core and Performance  Dual ARM® Cortex®-A9 cores, 32-bit architecture, operating at up to 800 MHz for balanced multi-threaded processing.
  • Multimedia Acceleration  Integrated 2D and 3D graphics processors and 1080p video processing for demanding display and video tasks; NEON™ SIMD multimedia support for optimized media algorithms.
  • Memory Support  Memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory types to accommodate a range of system memory configurations.
  • Storage and Networking  Single SATA interface (3 Gbps) and single Gigabit Ethernet (10/100/1000 Mbps) for local storage and high-speed network connectivity.
  • USB and Peripheral I/O  Four USB 2.0 ports with integrated PHY plus additional interfaces including CAN, keypad and LCD display controllers.
  • Security and Boot  Hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection for layered device protection.
  • Package and Assembly  Supplier device package: 569‑MAPBGA (12 × 12); package case listed as 569‑LFBGA. Surface-mount device suitable for board-level assembly.
  • Operating Range  Rated for an operating temperature range of −20 °C to 105 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial HMI and Control  Drive graphical user interfaces and local processing for industrial control panels and human-machine interfaces using integrated graphics and display controllers.
  • Multimedia Devices  Enable video processing and media playback tasks with 1080p-capable video engines and NEON SIMD acceleration.
  • Networked Edge Appliances  Provide networking and storage connectivity for edge devices and gateways with Gigabit Ethernet and SATA interfaces.
  • Embedded Connectivity Nodes  Support peripheral-rich designs requiring multiple USB ports, CAN and other serial interfaces for sensors, peripherals and expansion.

Unique Advantages

  • Balanced dual-core processing: Dual ARM Cortex‑A9 cores at 800 MHz provide a multi-core embedded compute foundation suitable for concurrent multimedia and I/O tasks.
  • Integrated multimedia subsystem: On-chip 2D/3D graphics and 1080p video processing reduce the need for external acceleration components.
  • Broad memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 enables designers to select memory types that match cost, performance and power targets.
  • Comprehensive I/O set: Built-in Gigabit Ethernet, SATA, multiple USB ports and CAN simplify system architecture for connected embedded products.
  • Hardware security primitives: TrustZone, secure boot and cryptography features help architects implement layered device security and protected boot flows.
  • Industrial temperature capability: Specification to −20 °C to 105 °C supports deployment in a wide range of ambient conditions.

Why Choose MCIMX6D5EZK08AE?

The MCIMX6D5EZK08AE positions itself as a highly integrated multimedia-capable processor for embedded designs needing a balance of compute, graphics and peripheral connectivity. Its combination of dual Cortex‑A9 cores, integrated graphics/video processing, multiple memory options and a broad set of interfaces makes it suitable for industrial HMIs, multimedia appliances and connected edge systems.

With on-chip power management and hardware security features, the device supports designs that require energy-aware operation and secure boot/cryptography capabilities. The package options and RoHS compliance make it amenable to standard surface-mount production workflows.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX6D5EZK08AE and support for integration into your next embedded design.

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