MCIMX6D5EYM12AD

IC MPU I.MX6D 1.2GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21)

Quantity 1,656 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.2GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM12AD – IC MPU I.MX6D 1.2GHZ 624FCPBGA

The MCIMX6D5EYM12AD is a dual-core ARM® Cortex®-A9 microprocessor operating at up to 1.2 GHz, part of the i.MX 6D family from NXP Semiconductors. It delivers a balance of processor performance and system integration targeted at embedded multimedia and general-purpose processing tasks.

Designed for a range of embedded markets, the device supports multimedia acceleration, broad memory options and extensive connectivity, enabling applications from human-machine interfaces and digital signage to IoT gateways and portable medical devices.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit, running up to 1.2 GHz for responsive application and multimedia processing.
  • Multimedia & Acceleration Integrated graphics acceleration and NEON™ SIMD multimedia co-processor to support advanced 2D/3D and signal processing tasks.
  • Memory Support Flexible memory controller support for LPDDR2, LVDDR3 and DDR3 providing design options for performance and power tradeoffs.
  • Interfaces & Connectivity On-chip networking and storage interfaces including one 10/100/1000 Mbps Ethernet, one SATA 3 Gbps, four USB 2.0 ports with PHY and CAN for vehicle and industrial networks.
  • Display & I/O Display interface controllers with LCD and keypad support for embedded HMI and signage applications.
  • Security Extensive security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection.
  • Package & Mounting 624-ball FCPBGA package (21 × 21 mm), surface-mount for compact, high-density board designs.
  • Operating Range & Compliance Operating temperature range −20°C to 105°C and RoHS compliance for materials and manufacturing.

Typical Applications

  • Automotive Infotainment — Suitable for infotainment systems that require multimedia processing and multiple I/O connections.
  • Digital Signage — Drives LCD-based displays and multimedia content with integrated graphics acceleration.
  • Human‑Machine Interfaces (HMI) — Powers responsive touchscreen and keypad-based control panels for industrial and consumer equipment.
  • IoT Gateways — Provides network connectivity and local processing for edge gateway applications.
  • Portable Medical Devices — Enables compact, connected devices requiring secure boot and cryptographic features.

Unique Advantages

  • High-performance dual-core processing: Two Cortex-A9 cores at up to 1.2 GHz deliver multi-threaded responsiveness for embedded applications.
  • Integrated multimedia acceleration: Graphics acceleration and NEON SIMD offload media workloads for smoother UI and video handling.
  • Broad memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 lets designers choose memory that fits cost, power and performance targets.
  • Comprehensive security suite: Hardware-supported TrustZone, secure boot and multiple secure subsystems help protect critical data and platform integrity.
  • Extensive connectivity: Gigabit Ethernet, SATA, multiple USB ports and CAN enable a wide range of networking and storage topologies.
  • Industrial temperature capability: −20°C to 105°C operation supports deployment in demanding embedded environments.

Why Choose MCIMX6D5EYM12AD?

The MCIMX6D5EYM12AD positions itself as a balanced embedded application processor combining dual-core Cortex-A9 performance, multimedia acceleration and a broad set of integrated interfaces. Its memory flexibility, security features and connectivity options make it suitable for designs that require multimedia capability alongside secure, networked operation.

As part of the i.MX 6 series from NXP, the device benefits from the platform’s scalable family architecture and vendor support, including companion power management options referenced for the series, helping simplify system-level integration and long-term product planning.

Request a quote or submit an inquiry to obtain pricing and availability for MCIMX6D5EYM12AD. Our team can provide lead-time and procurement support for your design needs.

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