MCIMX6D5EYM10AER

IC MPU I.MX6D 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 569 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM10AER – IC MPU I.MX6D 1.0GHz 624-FCPBGA

The MCIMX6D5EYM10AER is an NXP i.MX 6D series multimedia application processor featuring dual ARM® Cortex®-A9 cores running at 1.0 GHz. It is designed for embedded and industrial multimedia applications that require balanced processing performance, graphics acceleration and a broad set of peripheral interfaces.

Built for systems that integrate displays, storage and network connectivity, this device combines dual-core compute, 2D/3D graphics and video processing capabilities with a wide range of I/O and security features to support industrial HMIs, multimedia appliances and connected embedded devices.

Key Features

  • Processor Core  Dual ARM® Cortex®-A9 cores, 32-bit, 1.0 GHz clock speed for multicore application processing.
  • Multimedia & Acceleration  On-chip graphics acceleration with 2D and 3D graphics processors and video processing capabilities suitable for multimedia applications (series-level feature).
  • Memory Interface  64-bit memory interface supporting LPDDR2, LVDDR3 and DDR3 memory controllers to meet diverse system memory requirements.
  • Connectivity & Storage  Integrated Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1) and four USB 2.0 ports with PHY for networking and storage connectivity.
  • Peripheral Interfaces  Display and input controllers (LCD, keypad) plus additional interfaces such as CAN for flexible peripheral integration.
  • Security  Hardware security features including ARM TrustZone, boot security, cryptography, secure JTAG, secure fusebox, secure memory and tamper detection.
  • Package & Mounting  Supplied in a 624-FCPBGA (21 × 21 mm) package (624-LFBGA/FCBGA family), surface-mount package for compact board designs.
  • Operating Range & Compliance  Industrial temperature range of −20°C to 105°C and RoHS-compliant status for regulatory alignment.

Typical Applications

  • Industrial Human‑Machine Interfaces (HMIs)  Dual-core processing with graphics acceleration and LCD/keypad controllers enables responsive operator displays and control panels.
  • Multimedia Players & Set‑top Devices  On-chip 2D/3D graphics and video processing support 1080p-class multimedia playback and user interfaces.
  • Networked Embedded Systems  Gigabit Ethernet, multiple USB ports and SATA support networked appliances, gateways and storage-enabled devices.
  • Imaging & Sensor Gateways  Peripheral interfaces and ample memory bandwidth make the device suitable for camera sensor integration and edge preprocessing.

Unique Advantages

  • Highly integrated multimedia platform: Dual ARM® Cortex®-A9 cores combined with 2D/3D graphics and video processing reduce system complexity for multimedia designs.
  • Comprehensive I/O and storage: Gigabit Ethernet, SATA 3Gbps and four USB 2.0 ports with PHY provide broad connectivity options out of the box.
  • Flexible memory support: 64-bit memory interface compatible with LPDDR2, LVDDR3 and DDR3 enables designers to choose the memory technology that fits cost and performance targets.
  • Hardware security suite: TrustZone, secure boot and cryptography features help protect boot integrity, critical assets and runtime operations.
  • Industrial temperature and packaging: −20°C to 105°C operating range and compact 624-FCPBGA (21×21 mm) package support robust, space-efficient designs.
  • RoHS compliant: Meets RoHS requirements for environmentally conscious product design and manufacturing.

Why Choose MCIMX6D5EYM10AER?

The MCIMX6D5EYM10AER positions itself as a balanced, integrated solution for embedded systems that demand multimedia capability, secure boot and broad peripheral connectivity. Its dual ARM® Cortex®-A9 cores at 1.0 GHz, combined with graphics acceleration and a wide suite of interfaces, make it well suited to industrial HMIs, multimedia appliances and connected embedded platforms.

As part of the i.MX 6 family, this device delivers a proven feature set—memory flexibility, storage and networking interfaces, and on-chip security—allowing designers to reduce BOM complexity while addressing performance and reliability targets for mid-range embedded designs.

Request a quote or submit a parts inquiry to receive pricing and availability for the MCIMX6D5EYM10AER. Our team can provide lead-time and ordering information to support your design schedule.

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