MCIMX6D5EYM10AE

The MCIMX6D5EYM10AE from NXP Semiconductors is an ARM® Cortex®-A9 based microprocessor IC featuring a dual-core, 32-bit architecture running at 1.0 GHz in a 624‑FCPBGA package (21×21 mm). It is part of the i.MX 6D family designed for embedded multimedia and industrial applications.

As described in the i.MX6Dual/6Quad documentation, the device combines high-performance processing with integrated power management and multimedia capabilities (including 2D/3D graphics and 1080p video processing), making it suitable for systems that require responsive UI, display and camera support, and robust connectivity.

Key Features

• Core and Performance  Dual ARM® Cortex®-A9 cores, 32-bit, running at 1.0 GHz for parallel processing of application and multimedia tasks.
• Co-Processors  Multimedia offload and NEON™ SIMD acceleration to support media processing and optimized signal operations.
• Memory and Memory Interface  Integrated memory controllers for LPDDR2, LVDDR3 and DDR3; the i.MX6 family provides a 64‑bit DDR3/DDR3L/LPDDR2 memory interface as documented in the datasheet.
• Graphics and Video  On-chip graphics acceleration with 2D and 3D processing and 1080p video processing support as detailed for the i.MX6Dual/6Quad family.
• Connectivity and Peripherals  Broad peripheral set including 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), four USB 2.0 ports with PHY, CAN, and display interfaces (LCD, keypad).
• Security  Hardware security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
• Power Management  Integrated power management and on-chip LDO regulator support as indicated by the device documentation to simplify power sequencing and system design.
• Package and Mounting  624‑ball FCPBGA package, 21×21 mm with 0.8 mm pitch; surface-mount package suitable for compact embedded designs.
• Operating Temperature  Rated for operation from -20 °C to 105 °C for use in a wide range of industrial and commercial environments.

Typical Applications

• Industrial multimedia systems  Use for display-rich control panels and camera-equipped monitoring where 2D/3D graphics and video processing are required.
• Human–machine interfaces (HMIs)  Drives LCD displays and keypad interfaces for responsive operator panels and interactive control units.
• Embedded networking and storage  Integrates Gigabit Ethernet and SATA 3 Gbps for networked appliances and storage-enabled embedded systems.
• Connected devices with peripheral radios  Suitable for embedded platforms that pair WLAN, Bluetooth®, GPS and other sensors via available peripheral interfaces.

Unique Advantages

• Highly integrated multimedia-capable processor: Combines dual Cortex‑A9 cores with dedicated multimedia engines and graphics acceleration to handle UI and video tasks on a single device.
• Wide connectivity: On-chip Ethernet, SATA, multiple USB ports with PHY and CAN enable a broad range of system architectures without extensive external controllers.
• Flexible memory support: Controllers for LPDDR2, LVDDR3 and DDR3 plus a documented 64‑bit memory interface allow designers to match memory performance and cost to application needs.
• Comprehensive on-chip security: Multiple hardware security mechanisms (TrustZone, secure boot, cryptography and tamper detection) help protect device integrity and sensitive data.
• Industrial-ready thermal range: Rated from -20 °C to 105 °C to meet the environmental demands of many commercial and industrial deployments.
• Compact BGA package: 624‑ball FCPBGA (21×21 mm) enables dense, space-efficient designs while supporting surface-mount assembly.

Why Choose MCIMX6D5EYM10AE?

The MCIMX6D5EYM10AE positions itself as a balanced embedded processor for multimedia-focused and industrial applications, offering dual‑core Cortex‑A9 compute, integrated multimedia and graphics engines, a broad set of high-speed interfaces, and on-chip security and power management. Its documented memory interface and peripheral set make it suitable for designs that require display, camera, networking and storage capabilities in a compact package.

Designed and documented by NXP Semiconductors, this device is appropriate for engineers developing embedded systems that need a combination of processing performance, integrated peripherals and industrial temperature capability. The available technical documentation provides the electrical, package and timing details required for robust system integration.

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