MCIMX6D5EYM10CE

IC MPU I.MX6D 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 152 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM10CE – IC MPU I.MX6D 1.0GHz 624-FCPBGA

The MCIMX6D5EYM10CE is an NXP i.MX 6D series microprocessor featuring a dual ARM® Cortex®-A9 core architecture running at 1.0 GHz. It is designed for embedded and industrial applications that require multimedia processing, wired networking, and robust security features.

With integrated graphics acceleration, multiple high-speed interfaces and flexible memory controller support, this MPU is suited for compact, surface-mount designs requiring a balance of processing performance and system integration.

Key Features

  • CPU Core — Dual ARM® Cortex®-A9, 32-bit cores at 1 GHz for concurrent application and multimedia workloads.
  • Multimedia / DSP — Multimedia co-processor support and NEON™ SIMD for accelerated media and signal processing tasks; graphics acceleration and 1080p-capable processing referenced in the series datasheet.
  • Memory Interfaces — Memory controller support for LPDDR2, LVDDR3, and DDR3 to match a range of system memory architectures.
  • Display and HMI — Integrated display interface controllers including LCD and keypad support for human‑machine interface applications.
  • High-Speed Connectivity — Gigabit Ethernet (10/100/1000 Mbps) and SATA 3 Gbps for networked and storage applications; four USB 2.0 ports with PHY for peripheral connectivity.
  • Additional Interfaces — CAN support for industrial control and vehicle-bus connectivity.
  • Security — Comprehensive security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting — 624-FCPBGA package (624-LFBGA/FCBGA family) in a 21 × 21 mm footprint with surface mount mounting; package details reference a 0.8 mm pitch in the series datasheet.
  • Operating Range — Rated for operation from −20 °C to 105 °C, suitable for many embedded and industrial environments.
  • Environmental — RoHS compliant.
  • Power Management — Integrated power management features referenced in the series documentation to support efficient system-level power design.

Typical Applications

  • Industrial HMI and Control Panels — Display and keypad controllers plus graphics acceleration enable rich user interfaces and system control functions.
  • Multimedia Devices — NEON SIMD and multimedia processing capabilities support video playback and 2D/3D graphics for embedded multimedia products.
  • Networked Embedded Systems — Gigabit Ethernet and multiple USB ports provide the connectivity needed for gateways, thin clients, and communication modules.
  • Storage-Enabled Appliances — SATA 3 Gbps and robust I/O make the part suitable for embedded storage and NAS-style applications.

Unique Advantages

  • Highly Integrated Feature Set: Combines dual-core processing, graphics acceleration, multiple high-speed interfaces and security features to reduce external component count.
  • Flexible Memory Support: Compatible with LPDDR2, LVDDR3 and DDR3 memory options to match performance and cost targets.
  • Comprehensive Security: On-chip security elements (TrustZone, secure boot, cryptography and tamper detection) help protect IP and data at system level.
  • Industrial Temperature Capability: Specified operation from −20 °C to 105 °C for deployment in a wide range of embedded environments.
  • Compact, Surface-Mount Package: 624-FCPBGA (21 × 21 mm) supports dense, space-constrained board designs.
  • System Power Management: Series documentation references integrated power management to assist in achieving efficient system power profiles.

Why Choose MCIMX6D5EYM10CE?

The MCIMX6D5EYM10CE positions itself as a balanced, integrated solution for embedded and industrial applications that need dual-core ARM Cortex-A9 performance, multimedia capability and a wide range of peripheral connectivity. Its security features and flexible memory support make it suitable for designs where data protection and scalable performance are important.

This MPU is well suited to engineers designing compact, surface-mounted systems requiring Ethernet, SATA, multiple USB ports and display interfaces, offering a path to reduce board-level complexity while leveraging the documented features of the i.MX 6Dual/6Quad family.

If you would like pricing or availability, request a quote or submit an inquiry to our sales team for a formal quote and lead-time information.

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