MCIMX6D5EYM10AD

IC MPU I.MX6D 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 685 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM10AD – IC MPU I.MX6D 1.0GHZ 624FCPBGA

The MCIMX6D5EYM10AD is an NXP Semiconductors i.MX 6D series dual‑core ARM® Cortex®‑A9 microprocessor device running at 1.0 GHz, offered in a 624‑FCPBGA (21 × 21 mm) package. It is designed for embedded and multimedia applications that require balanced compute performance, integrated peripherals and hardware security features.

As part of the i.MX 6Dual/6Quad family, the device targets multimedia‑focused embedded systems and industrial designs that benefit from integrated interfaces, graphics acceleration and a flexible memory subsystem.

Key Features

  • Core and Processing 2 × ARM® Cortex®‑A9 cores, 32‑bit architecture, operating at 1 GHz for multicore application processing.
  • Multimedia and DSP Integrated multimedia capabilities with NEON™ SIMD support and graphics acceleration suitable for display and media processing.
  • Memory Subsystem Multi‑mode memory controller supporting LPDDR2, LVDDR3 and DDR3; datasheet series documentation references a 64‑bit DDR/LPDDR memory interface implementation.
  • Display and HMI Built‑in display interface controllers including LCD and keypad support for user interface designs.
  • High‑speed Interfaces Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, and four USB 2.0 ports with integrated PHYs provide broad peripheral connectivity.
  • Vehicle and Field Networking Additional CAN interface support for control and embedded networking applications.
  • Security Features Comprehensive hardware security including ARM TrustZone (TZ), boot security, cryptography accelerators, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC with tamper detection.
  • Package and Mounting 624‑FCPBGA package (21 × 21 mm, 0.8 mm pitch), surface mount for compact board designs; package information available in the series datasheet.
  • Operating Range and Compliance Operating temperature range of −20 °C to 105 °C and RoHS compliance for environmental and regulatory requirements.

Typical Applications

  • Industrial HMI and Control Integrated display controllers, graphics acceleration and security features make the device suitable for human‑machine interfaces and industrial control panels.
  • Multimedia Players and Set‑top Devices Dual‑core processing, NEON SIMD and display support enable multimedia content playback and UI rendering in embedded media systems.
  • Networked Embedded Systems Gigabit Ethernet, multiple USB ports and SATA enable use in gateways, appliances and storage‑enabled embedded platforms.
  • Connected Devices and Sensor Hubs Peripheral interfaces such as CAN and multiple high‑speed I/Os support connectivity for sensor aggregation and connected modules.

Unique Advantages

  • Highly integrated multimedia platform: Combines dual ARM® Cortex®‑A9 cores, NEON SIMD and graphics acceleration to reduce external component needs for media‑rich applications.
  • Broad peripheral set: On‑chip Gigabit Ethernet, SATA, multiple USB 2.0 PHYs and CAN provide flexible I/O for diverse embedded designs.
  • Robust hardware security: Multi‑layer security features including TrustZone, secure boot and cryptography help protect system integrity and sensitive data.
  • Flexible memory support: Multi‑mode memory controller supports LPDDR2, LVDDR3 and DDR3 to match system performance and BOM targets.
  • Industrial temperature capability: −20 °C to 105 °C operating range supports deployment in a wide range of field environments.
  • Proven vendor family: Part of the NXP i.MX 6Dual/6Quad series with detailed package and system documentation for design and qualification.

Why Choose MCIMX6D5EYM10AD?

MCIMX6D5EYM10AD delivers a balanced combination of dual‑core processing, multimedia acceleration and an extensive peripheral set in a compact 624‑FCPBGA package. Its integrated security features and flexible memory interfaces make it well suited to embedded systems that require performance, connectivity and secure operation.

Designed for engineers building industrial, multimedia and networked embedded products, this NXP i.MX 6D device provides a scalable option within the i.MX 6Dual/6Quad family and is supported by comprehensive technical documentation for system integration.

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