MCIMX6D5EYM10AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21) |
|---|---|
| Quantity | 963 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 624-LFBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1.0GHz | Supplier Device Package | 624-FCPBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D5EYM10AC – IC MPU I.MX6D 1.0GHz 624-FCPBGA
The MCIMX6D5EYM10AC is an NXP i.MX 6D series microprocessor IC featuring two ARM® Cortex®-A9 cores operating at 1.0 GHz. Designed as a multimedia-focused applications processor, it delivers integrated processing, graphics acceleration and a broad set of peripherals for embedded and industrial designs.
As part of the i.MX 6 family, this dual-core MPU targets industrial and embedded applications that require video and graphics capabilities, robust connectivity and secure boot and runtime protections while benefiting from integrated memory interfaces and on-chip power management.
Key Features
- CPU Core Dual ARM® Cortex®-A9 cores, 32-bit architecture, 1 GHz operating speed for parallel application and multimedia processing.
- Multimedia & Acceleration Multimedia co-processor support and NEON™ SIMD enable accelerated media and signal-processing workloads; graphics acceleration and 1080p-class processing are provided by the series architecture.
- Memory Interfaces Supports LPDDR2, LVDDR3 and DDR3 memory controllers with a wide external memory interface as specified for the i.MX 6 series.
- Display & Input Integrated display interface controllers including LCD and keypad support for human-machine interface applications.
- High-Speed Connectivity Integrated Ethernet 10/100/1000 Mbps (1), SATA 3 Gbps (1), and up to four USB 2.0 ports with PHY for networking, storage and peripheral connectivity.
- Additional Interfaces CAN interface and multiple peripheral interfaces to connect sensors, radios and other system components.
- Security Hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection.
- Package & Mounting 624-FCPBGA surface-mount package; 21 × 21 mm FCPBGA with 0.8 mm pitch as specified for the series package option.
- Environmental & Compliance RoHS compliant; operating temperature range −20 °C to 105 °C suitable for a range of embedded and industrial environments.
Typical Applications
- Industrial HMI and Control Drives LCD displays and keypad interfaces while providing the processing headroom for control logic and multimedia content in industrial operator panels.
- Connected Multimedia Devices Supports 1080p-class video processing, graphics acceleration and USB/Ethernet connectivity for set-top, media gateway and display applications.
- Networking and Storage Appliances Integrated Gigabit Ethernet and SATA 3 Gbps make it suitable for networked devices and compact storage controllers that require onboard processing.
- Imaging and Sensor Gateways Interfaces for camera sensors and wireless peripherals enable use in embedded vision, camera preprocessing and sensor aggregation systems.
Unique Advantages
- Integrated multimedia processing: Hardware acceleration and NEON SIMD support reduce software complexity for media and signal-processing tasks.
- Comprehensive I/O set: Gigabit Ethernet, SATA, multiple USB 2.0 ports, CAN and display controllers reduce external bridge components and simplify board design.
- Hardware security suite: Built-in TrustZone, cryptography, secure boot and tamper detection provide layered device security for protected applications.
- Industrial temperature capability: Rated for operation from −20 °C to 105 °C to meet a wide range of embedded and industrial environmental conditions.
- Compact BGA footprint: 624-FCPBGA 21 × 21 mm package provides a high-pin-count solution in a compact surface-mount form factor.
- Part of the i.MX 6 family: Leverages the i.MX 6 series architecture and documentation set for design continuity within the product family.
Why Choose MCIMX6D5EYM10AC?
The MCIMX6D5EYM10AC positions itself as a balanced dual-core embedded MPU combining Cortex-A9 processing, multimedia acceleration and a broad peripheral set in a single surface-mount BGA package. Its security features, integrated memory interfaces and wired connectivity options make it suitable for industrial and embedded designs that require processing, display and storage connectivity in a compact footprint.
Engineers designing industrial HMIs, multimedia gateways, networked storage or imaging systems will find this part useful where verified series-level documentation, integrated peripherals and industrial-temperature operation are required for reliable long-term deployment.
Request a quote or submit an inquiry for MCIMX6D5EYM10AC to check availability, lead times and pricing for your design requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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