MCIMX6D4AVT10ADR

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 582 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT10ADR – IC MPU I.MX6D 1.0GHz 624FCBGA

The MCIMX6D4AVT10ADR is a dual-core ARM® Cortex®-A9 microprocessor operating at 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. Designed for embedded and industrial multimedia applications, it combines a dual 32-bit core architecture with integrated multimedia and security features to support rich user interfaces, networking and storage peripherals, and robust system-level protection.

Built for integration and industrial-temperature operation, this device targets designs that require graphics acceleration, high-speed I/O and flexible memory options while providing power-optimized operation across demanding environmental ranges.

Key Features

  • Core and Performance  Dual ARM® Cortex®-A9 32-bit cores running at 1 GHz to support responsive application and multimedia workloads.
  • Multimedia and SIMD  Integrated multimedia DSP capabilities with NEON™ SIMD acceleration for enhanced media processing and compute tasks.
  • Memory Interfaces  Support for LPDDR2, LVDDR3 and DDR3 memory controllers to enable flexible system memory configurations.
  • Graphics and Display  Graphics acceleration plus display interface controllers for LCD and keypad connectivity to drive advanced human‑machine interfaces.
  • High-Speed Connectivity  Single Gigabit Ethernet (10/100/1000 Mbps), SATA 3 Gbps, and four USB 2.0 ports with PHY provide wired network, storage and peripheral connectivity.
  • Additional Interfaces  CAN interface support expands applicability to industrial control and communication subsystems.
  • Security & Trust  Hardware security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection for strengthened system integrity.
  • Package & Mounting  624-FCBGA package (21 × 21 mm, 0.8 mm pitch) for surface-mount assembly and compact board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 125 °C to meet demanding environmental requirements.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Automation  Use as a processing and communications hub where graphics, CAN and Gigabit Ethernet connectivity support HMI and machine control functions.
  • Embedded Networking and Storage  Ideal for gateways and appliances requiring SATA 3 Gbps, Gigabit Ethernet and multiple USB ports for mass-storage and peripheral attachment.
  • Human‑Machine Interfaces  Drives LCD displays and keypad interfaces with onboard graphics acceleration for responsive user interfaces in kiosks and control panels.
  • Digital Signage and Media Devices  Multimedia processing and NEON acceleration support media playback and rendering for signage and embedded entertainment systems.

Unique Advantages

  • Integrated Multimedia Processing  On-chip multimedia DSP and NEON SIMD reduce the need for external accelerators and simplify board-level design.
  • Flexible Memory Support  Multiple supported memory types (LPDDR2, LVDDR3, DDR3) allow designers to choose cost or performance-optimized memory architectures.
  • Broad I/O Suite  Built-in Gigabit Ethernet, SATA, USB and CAN provide a wide range of connectivity options from a single processor, lowering BOM and board complexity.
  • Robust Security Stack  Comprehensive hardware security blocks (TrustZone, secure boot, cryptography and tamper detection) facilitate secure system designs.
  • Industrial-Grade Operation  Specified −40 °C to 125 °C operation supports deployment in harsh or temperature‑sensitive environments.
  • Compact, Manufacturable Package  624-FCBGA (21 × 21 mm, 0.8 mm pitch) supports high-density board layouts while remaining assembly-friendly for surface-mount processes.

Why Choose MCIMX6D4AVT10ADR?

The MCIMX6D4AVT10ADR positions itself as a capable dual-core embedded processor that balances multimedia performance, extensive I/O and a strong hardware security feature set in a compact FCBGA package. Its support for multiple memory types and broad peripheral integration simplifies system design for embedded and industrial applications that demand display capabilities, networked storage and reliable operation across a wide temperature range.

This part is appropriate for designers seeking an integrated solution that reduces external component count while providing the processing and connectivity needed for modern embedded systems. The combination of graphics acceleration, secure boot and comprehensive interfaces offers long-term flexibility and robustness for deployed products.

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