MCIMX6D5EYM10ACR

IC MPU I.MX6D 1.0GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21)

Quantity 468 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM10ACR – IC MPU I.MX6D 1.0GHZ 624FCPBGA

The MCIMX6D5EYM10ACR is a dual-core ARM® Cortex®-A9 microprocessor IC from NXP Semiconductors’ i.MX 6D series. It delivers 32-bit, dual-core processing at 1.0 GHz and is aimed at embedded, multimedia-focused applications where integration and peripheral support are important.

Designed for industrial and multimedia applications, this device combines graphics acceleration, multimedia extensions (NEON™ SIMD), a broad set of on-chip interfaces and comprehensive security features to support connected, display- and storage-enabled embedded systems.

Key Features

  • Core and Performance Dual ARM® Cortex®-A9 cores, 32-bit, operating up to 1 GHz for concurrent application and media processing.
  • Multimedia and DSP Multimedia co-processor support including NEON™ SIMD and on-chip graphics acceleration; datasheet references 2D/3D graphics and 1080p-capable multimedia features for the i.MX 6Dual/6Quad family.
  • Memory Interfaces Integrated memory controllers for LPDDR2, LVDDR3 and DDR3 to support a range of system memory options.
  • Display and HMI Display interface controllers including LCD and keypad support for human-machine interface designs.
  • Connectivity Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gb/s (1), four USB 2.0 ports with PHY, and CAN – enabling networking, storage and peripheral connectivity.
  • Security and Boot Hardware security features including ARM TrustZone (ARM TZ), Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory and Secure RTC, plus tamper detection.
  • Power and Timing Integrated power management and on-chip oscillators and PLLs are documented in the device family datasheet to support system power sequencing and clocking.
  • Package and Mounting 624-ball FCPBGA package (21 × 21 mm) / 624-LFBGA package options, surface-mount placement for compact embedded boards.
  • Operating Range Specified operating temperature from −20 °C to 105 °C for use in a range of industrial environments.
  • Standards and Documentation Detailed technical documentation is provided at the i.MX 6Dual/6Quad family level covering electrical characteristics, package information, boot configuration and module timing.

Typical Applications

  • Industrial HMI and Control Drive graphical human-machine interfaces and local control functions using integrated display controllers and graphics acceleration.
  • Multimedia Embedded Devices Implement multimedia playback, camera and display pipelines leveraging NEON SIMD and the family’s video/graphics capabilities.
  • Networked and Storage Appliances Use built-in Gigabit Ethernet and SATA to enable connected devices with local storage and networking functions.
  • Secure Embedded Systems Deploy secure boot, cryptography and tamper detection for designs that require hardware-enforced security and trusted boot flows.

Unique Advantages

  • Highly integrated multimedia platform: Dual Cortex‑A9 cores plus NEON SIMD and graphics acceleration reduce the need for external media processors.
  • Broad peripheral set: Gigabit Ethernet, SATA, multiple USB 2.0 ports, CAN and display interfaces simplify system design for connected, multimedia applications.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 enable designers to choose memory architectures that match performance and cost targets.
  • Comprehensive hardware security: TrustZone, secure boot, cryptography and secure JTAG help enforce device integrity and protect sensitive data.
  • Integrated power and timing resources: On-chip power-management elements, LDO-related parameters and oscillators aid system power sequencing and clocking strategies.
  • Industrial temperature capability: −20 °C to 105 °C operating range supports deployment in a variety of industrial environments.

Why Choose MCIMX6D5EYM10ACR?

The MCIMX6D5EYM10ACR positions itself as a capable, integrated embedded application processor for designs requiring multimedia processing, secure boot and a wide set of connectivity options. As part of the i.MX 6Dual/6Quad family from NXP Semiconductors, it benefits from family-level technical documentation that covers electrical characteristics, package details and boot configuration.

This part is well suited to developers building industrial HMIs, networked appliances and secure embedded systems that demand a balance of processing performance, peripheral integration and documented system-level behavior.

Request a quote or submit an RFQ to evaluate MCIMX6D5EYM10ACR for your next embedded design.

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