MCIMX6D4AVT10AE

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 376 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT10AE – IC MPU I.MX6D 1.0GHZ 624FCBGA

The MCIMX6D4AVT10AE is a dual-core ARM® Cortex®-A9 microprocessor running at 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It integrates multimedia acceleration, NEON™ SIMD support, multiple memory controllers, and a broad set of peripheral interfaces targeted at embedded multimedia and display-driven applications.

With integrated graphics acceleration, video and display controllers, multi-protocol I/O and wide operating temperature range, this device is designed for high-integration embedded designs that require processing performance alongside rich peripheral connectivity.

Key Features

  • Core — Dual ARM® Cortex®-A9 cores operating at 1 GHz, 32-bit architecture for general-purpose application processing.
  • Multimedia and DSP — Multimedia co-processors and NEON™ SIMD support for accelerated signal and media processing.
  • Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory designs.
  • Graphics and Display — Graphics acceleration with LCD and keypad display interface controllers for HMI and multimedia displays.
  • Networking and Storage — Integrated Gigabit Ethernet (10/100/1000 Mbps) and one SATA 3 Gbps port for networked and storage applications.
  • USB and Peripheral I/O — Four USB 2.0 ports with PHY and additional interfaces including CAN for flexible peripheral connectivity.
  • Security — Hardware features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC along with tamper detection.
  • Package and Mounting — 624-FCBGA surface-mount package with 21 × 21 mm footprint suitable for compact board designs.
  • Temperature Range — Specified operating range from −40 °C to 125 °C for deployment in thermally demanding environments.

Typical Applications

  • Multimedia Systems — Processing and playback for embedded video and graphical user interfaces that use integrated graphics acceleration and display controllers.
  • Human-Machine Interfaces (HMI) — LCD and keypad controller support for instrument panels, control displays and interactive operator screens.
  • Networked Embedded Devices — Devices requiring Gigabit Ethernet and USB connectivity alongside local storage using SATA.
  • Industrial and Communications — Systems using CAN and multiple USB ports for device control, diagnostics and peripheral interfacing.

Unique Advantages

  • Balanced processing and multimedia acceleration: Dual Cortex‑A9 cores plus NEON and multimedia co-processors provide compute resources with dedicated media acceleration.
  • Comprehensive memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 enable flexible choices for memory cost, performance and power trade-offs.
  • Broad I/O and connectivity: Integrated Gigabit Ethernet, SATA, multiple USB ports and CAN reduce external components and simplify system board design.
  • Layered hardware security: Multiple security mechanisms including TrustZone, cryptography and secure boot features help protect system integrity and sensitive assets.
  • Rugged thermal envelope: Rated for −40 °C to 125 °C operation to address applications with extended temperature requirements.
  • Compact system footprint: 624‑FCBGA (21 × 21 mm) packaging supports high integration in space-constrained embedded boards.

Why Choose MCIMX6D4AVT10AE?

The MCIMX6D4AVT10AE positions itself as a highly integrated embedded MPU that combines dual-core Cortex‑A9 processing with multimedia acceleration, extensive memory interface options and a wide set of peripheral interfaces. Its hardware security features and broad connectivity make it suitable for designs that require media processing, display control and networked operation within a compact package.

Engineers and procurement teams will find the device appropriate for embedded designs that demand a balance of processing, multimedia capability and system-level integration, while supporting operation across a wide temperature range for challenging deployments.

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