MCIMX6D4AVT10AE
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 376 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D4AVT10AE – IC MPU I.MX6D 1.0GHZ 624FCBGA
The MCIMX6D4AVT10AE is a dual-core ARM® Cortex®-A9 microprocessor running at 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It integrates multimedia acceleration, NEON™ SIMD support, multiple memory controllers, and a broad set of peripheral interfaces targeted at embedded multimedia and display-driven applications.
With integrated graphics acceleration, video and display controllers, multi-protocol I/O and wide operating temperature range, this device is designed for high-integration embedded designs that require processing performance alongside rich peripheral connectivity.
Key Features
- Core — Dual ARM® Cortex®-A9 cores operating at 1 GHz, 32-bit architecture for general-purpose application processing.
- Multimedia and DSP — Multimedia co-processors and NEON™ SIMD support for accelerated signal and media processing.
- Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory designs.
- Graphics and Display — Graphics acceleration with LCD and keypad display interface controllers for HMI and multimedia displays.
- Networking and Storage — Integrated Gigabit Ethernet (10/100/1000 Mbps) and one SATA 3 Gbps port for networked and storage applications.
- USB and Peripheral I/O — Four USB 2.0 ports with PHY and additional interfaces including CAN for flexible peripheral connectivity.
- Security — Hardware features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC along with tamper detection.
- Package and Mounting — 624-FCBGA surface-mount package with 21 × 21 mm footprint suitable for compact board designs.
- Temperature Range — Specified operating range from −40 °C to 125 °C for deployment in thermally demanding environments.
Typical Applications
- Multimedia Systems — Processing and playback for embedded video and graphical user interfaces that use integrated graphics acceleration and display controllers.
- Human-Machine Interfaces (HMI) — LCD and keypad controller support for instrument panels, control displays and interactive operator screens.
- Networked Embedded Devices — Devices requiring Gigabit Ethernet and USB connectivity alongside local storage using SATA.
- Industrial and Communications — Systems using CAN and multiple USB ports for device control, diagnostics and peripheral interfacing.
Unique Advantages
- Balanced processing and multimedia acceleration: Dual Cortex‑A9 cores plus NEON and multimedia co-processors provide compute resources with dedicated media acceleration.
- Comprehensive memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 enable flexible choices for memory cost, performance and power trade-offs.
- Broad I/O and connectivity: Integrated Gigabit Ethernet, SATA, multiple USB ports and CAN reduce external components and simplify system board design.
- Layered hardware security: Multiple security mechanisms including TrustZone, cryptography and secure boot features help protect system integrity and sensitive assets.
- Rugged thermal envelope: Rated for −40 °C to 125 °C operation to address applications with extended temperature requirements.
- Compact system footprint: 624‑FCBGA (21 × 21 mm) packaging supports high integration in space-constrained embedded boards.
Why Choose MCIMX6D4AVT10AE?
The MCIMX6D4AVT10AE positions itself as a highly integrated embedded MPU that combines dual-core Cortex‑A9 processing with multimedia acceleration, extensive memory interface options and a wide set of peripheral interfaces. Its hardware security features and broad connectivity make it suitable for designs that require media processing, display control and networked operation within a compact package.
Engineers and procurement teams will find the device appropriate for embedded designs that demand a balance of processing, multimedia capability and system-level integration, while supporting operation across a wide temperature range for challenging deployments.
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