MCIMX6D4AVT10ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 746 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D4AVT10ACR – IC MPU I.MX6D 1.0GHZ 624FCBGA
The MCIMX6D4AVT10ACR is an NXP I.MX 6D series microprocessor IC with dual ARM® Cortex®-A9 cores running at 1.0 GHz in a 624-FCBGA (21 × 21 mm) package. It combines general-purpose 32-bit processing with multimedia acceleration and a rich set of peripheral interfaces targeted at embedded and multimedia-focused applications.
Designed for integration into space- and performance-constrained designs, this device delivers on-chip memory controller support, hardware security features, and multiple high-speed interfaces to simplify system architecture and reduce external component count.
Key Features
- Core & Performance — Dual ARM® Cortex®-A9, 32-bit processors running at 1 GHz for responsive application and multimedia processing.
- Multimedia Acceleration — Integrated graphics acceleration and multimedia DSP support with NEON™ SIMD to enable efficient media handling and compute offload.
- Memory Support — Built-in memory controllers for LPDDR2, LVDDR3 and DDR3 to support a variety of system memory options and bandwidth requirements.
- Display & HMI — On-chip display interface controllers supporting LCD and keypad interfaces for human‑machine interface designs.
- High-Speed Connectivity — Integrated 10/100/1000 Mbps Ethernet interface and CAN for wired networking and vehicle/bus communication use cases.
- Storage & USB — Single SATA 3 Gbps interface and four USB 2.0 ports with PHY for mass-storage and peripheral connectivity.
- Security & Trust — Comprehensive security features including ARM TrustZone, boot security, cryptography blocks, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection to support protected boot and runtime operation.
- Package & Mounting — 624-FCBGA package with 21 × 21 mm footprint and 0.8 mm pitch; surface-mount for compact board integration.
- Extended Operating Range — Rated for operation from −40 °C to 125 °C to accommodate thermally demanding embedded environments.
Typical Applications
- Multimedia Systems — Playback, display and media acceleration tasks leveraging the dual Cortex‑A9 cores and NEON™ SIMD processing.
- Industrial Embedded Devices — Control and HMI applications using LCD/keypad interfaces, robust I/O and an extended operating temperature range.
- Networked Gateways and Routers — Ethernet and CAN connectivity combined with SATA and multiple USB ports for data aggregation and peripheral connectivity.
- Human-Machine Interfaces (HMIs) — Graphics acceleration plus keypad and display controllers enable responsive, visually rich operator interfaces.
Unique Advantages
- Integrated multimedia and compute: Dual Cortex‑A9 cores with NEON™ SIMD and graphics acceleration reduce need for separate co‑processors.
- Flexible memory options: Support for LPDDR2, LVDDR3 and DDR3 allows designers to choose memory technology that matches performance, cost and power targets.
- Comprehensive connectivity: On-chip Gigabit Ethernet, SATA 3 Gbps, USB 2.0 (with PHY) and CAN simplify system BOM and layout for connected products.
- Built-in device security: Multiple hardware security primitives and secure boot features help protect code and data at rest and in transit.
- Compact, manufacturable package: 624‑FCBGA (21 × 21 mm, 0.8 mm pitch) surface‑mount package supports dense board layouts and automated assembly.
- Wide temperature capability: −40 °C to 125 °C operation supports deployment in thermally challenging embedded environments.
Why Choose MCIMX6D4AVT10ACR?
The MCIMX6D4AVT10ACR positions itself as a balanced, highly integrated processor for embedded multimedia and connected systems. Combining dual ARM® Cortex®‑A9 cores, multimedia acceleration, comprehensive I/O and a broad set of hardware security features, it helps reduce external components while delivering application-level performance and connectivity.
This device is suited for engineers building compact, robust embedded platforms that require display support, storage and network interfaces alongside hardware-backed security. Backed by NXP’s product documentation and packaging information, it is designed for streamlined integration into production systems.
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