MCIMX6D4AVT08AE

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 667 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT08AE – IC MPU I.MX6D 852MHz 624‑FCBGA

The MCIMX6D4AVT08AE is a 32‑bit ARM® Cortex®‑A9 dual‑core microprocessor running at 852 MHz, packaged in a 624‑FBGA (21 × 21 mm) FCBGA. It targets embedded multimedia applications and implements the i.MX 6D dual‑core architecture with integrated acceleration and a broad set of peripheral interfaces.

Designed for systems that require balanced processing performance and extensive I/O integration, this device combines NEON™ SIMD multimedia capabilities, graphics acceleration, and multiple high‑speed interfaces to support complex human‑machine interfaces, multimedia playback and high‑bandwidth peripherals.

Key Features

  • Core  Dual ARM® Cortex®‑A9 32‑bit cores operating at 852 MHz, providing symmetric multiprocessing for multitask embedded workloads.
  • Multimedia and Acceleration  Integrated multimedia DSP and NEON™ SIMD support plus graphics acceleration and series‑level support for 1080p video processing in i.MX 6Dual/6Quad documentation, enabling rich UI and video applications.
  • Memory Subsystem  Memory controller support for LPDDR2, LVDDR3 and DDR3; series documentation references a 64‑bit DDR3/DDR3L/LPDDR2 memory interface for high bandwidth system memory.
  • High‑Speed Interfaces  Single Gigabit Ethernet MAC (10/100/1000 Mbps), one SATA 3 Gbps port and four USB 2.0 controllers with PHY, providing connectivity for networking, storage and peripherals.
  • Peripheral and Display  On‑chip display interface controllers including LCD support and keypad interface, plus integrated CAN and additional interfaces for sensors and system I/O.
  • Security and Boot  Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to support protected boot and runtime operations.
  • Package and Thermal  624‑FBGA (624‑FCBGA) surface‑mount package, 21 × 21 mm, 0.8 mm pitch; operating temperature range −40 °C to 125 °C; RoHS compliant.

Typical Applications

  • Infotainment and Multimedia Systems  Use the integrated multimedia engines, NEON SIMD and graphics acceleration to drive rich display GUIs and video playback.
  • Telematics and HMI  Dual cores and multiple interfaces enable responsive human‑machine interfaces and data connectivity for telematics modules and advanced HMIs.
  • Networked Embedded Storage  Gigabit Ethernet and SATA 3 Gbps support enable applications requiring networked data access and local high‑speed storage.
  • Industrial Control and Connectivity  CAN plus numerous USB ports and other peripheral interfaces make the device suitable for complex control nodes and sensor aggregation.

Unique Advantages

  • Balanced dual‑core processing: Dual ARM Cortex‑A9 cores at 852 MHz provide concurrency for UI, communication and background tasks without excessive complexity.
  • Integrated multimedia and graphics: NEON SIMD and graphics acceleration reduce the need for external accelerators and simplify multimedia system design.
  • Rich on‑chip connectivity: Gigabit Ethernet, SATA, multiple USB 2.0 ports and CAN consolidate common system interfaces and reduce BOM count.
  • Comprehensive security suite: Built‑in TrustZone, secure boot and cryptographic support help protect firmware, data and system integrity.
  • Production‑ready thermal range and packaging: 624‑FCBGA package with −40 °C to 125 °C operating range and RoHS compliance supports deployment in a wide range of embedded environments.

Why Choose MCIMX6D4AVT08AE?

The MCIMX6D4AVT08AE positions itself as a highly integrated dual‑core application processor for embedded multimedia designs that require a combination of processing performance, extensive peripheral integration and built‑in security. Its support for common memory types (LPDDR2, LVDDR3, DDR3), combined with high‑speed I/O such as Gigabit Ethernet, SATA and multiple USB ports, makes it well suited for designers building connected multimedia and control systems.

Featuring a compact 624‑FBGA package and an extended operating temperature range, the device delivers system‑level integration and long‑term design stability for a variety of embedded product lines where multimedia, connectivity and secure boot are priorities.

Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6D4AVT08AE. Our team can provide lead‑time information and support for your design evaluation and volume planning.

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