MCIMX6D4AVT08ACR
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 315 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D4AVT08ACR – IC MPU I.MX6D 852MHZ 624FCBGA
The MCIMX6D4AVT08ACR is a dual-core ARM® Cortex®-A9 32-bit microprocessor running at 852 MHz, offered in a 624-FCBGA (21×21 mm) surface-mount package. It targets multimedia-focused and industrial embedded applications that require integrated graphics acceleration, a broad set of peripherals, and flexible memory support.
Designed as part of the NXP i.MX 6D family, the device delivers a balance of processing performance, multimedia capabilities (including 2D/3D graphics and video processing as described in the series documentation), and extensive I/O to simplify platform design and integration.
Key Features
- Core and SIMD — Dual ARM® Cortex®-A9 cores, 32-bit, up to 852 MHz with NEON™ SIMD and multimedia co-processor support for accelerated media processing.
- Memory — Multi-format memory controller supporting LPDDR2, LVDDR3, and DDR3 devices for flexible system memory choices.
- Graphics and Video — On-chip graphics acceleration and multimedia processing capabilities referenced in the series documentation for display and video applications.
- Connectivity — Integrated Ethernet MAC supporting 10/100/1000 Mbps (1), plus CAN for vehicle/network control and communications.
- Storage Interfaces — SATA 3 Gbps interface (1) for direct attachment of storage devices and media.
- USB — Four USB 2.0 ports with integrated PHY for host/device connectivity.
- Display and HMI — Display interface controllers including support for LCD and keypad interfaces to enable rich human–machine interfaces.
- Security and Boot — Comprehensive security feature set including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC, RTIC, and tamper detection.
- Package and Mounting — 624-FCBGA (21×21 mm) package, surface-mount, suitable for compact embedded board designs.
- Operating Range — Extended operating temperature from −40 °C to 125 °C for demanding environments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial HMI and control — Use the integrated graphics, display interfaces, and extended temperature range for human–machine interfaces and industrial control panels.
- Multimedia platforms — Dual-core processing with NEON SIMD and on-chip graphics accelerators supports multimedia playback and user interface tasks.
- Networked storage and gateways — Gigabit Ethernet and SATA 3 Gbps enable media servers, storage appliances, and network gateway designs.
- Embedded vision and camera systems — Interfaces described in the series documentation facilitate connection to camera sensors and display subsystems.
- Connectivity modules — Multiple USB ports and CAN support a range of peripheral and communication modules.
Unique Advantages
- Highly integrated multimedia SoC: Dual Cortex‑A9 cores with NEON SIMD and graphics acceleration reduce external component count for multimedia systems.
- Flexible memory support: LPDDR2, LVDDR3, and DDR3 controller options allow designers to choose memory technology that fits performance and cost targets.
- Rich peripheral set: Gigabit Ethernet, SATA, multiple USB ports, CAN, and display interfaces provide broad connectivity for diverse embedded applications.
- Comprehensive on-chip security: Built-in TrustZone, boot security, cryptography, secure JTAG, and tamper detection enhance device and system-level protection.
- Wide operating temperature: −40 °C to 125 °C support for deployment in environments requiring extended thermal range.
- Compact BGA package: 624-FCBGA (21×21 mm) enables high-density board designs while maintaining robust routing for high-pin-count I/O.
Why Choose MCIMX6D4AVT08ACR?
MCIMX6D4AVT08ACR delivers a balanced combination of dual-core processing performance, multimedia acceleration, and a broad peripheral set in a compact FCBGA package. Its flexible memory support and comprehensive security features make it suitable for embedded designs that require media processing, connectivity, and secure boot capabilities.
As a member of the NXP i.MX 6D family, this device is supported by extensive series-level documentation and technical detail to help engineers design and validate industrial and multimedia-focused products.
Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the MCIMX6D4AVT08ACR. Our team can provide the documentation and ordering information you need to move your design forward.

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