MCIMX6D4AVT08AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 120 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 852MHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D4AVT08AC – IC MPU I.MX6D 852MHZ 624FCBGA
The MCIMX6D4AVT08AC is an NXP i.MX 6D series dual-core ARM® Cortex®-A9 microprocessor operating at 852 MHz, supplied in a 624-FCBGA (21 × 21 mm) package. It targets embedded and industrial multimedia applications that require a combination of processing performance, graphics/video acceleration, and a broad set of peripheral interfaces.
Designed for multimedia-focused embedded systems, the device integrates NEON™ SIMD multimedia acceleration, multiple memory controller options, and a rich set of I/O including Gigabit Ethernet, SATA, USB, and CAN to support connected, display-driven products.
Key Features
- Core Dual ARM® Cortex®-A9 cores, 32-bit, running at 852 MHz for balanced multiprocessing and control tasks.
- Multimedia Acceleration Includes NEON™ SIMD and multimedia/DSP capabilities plus 2D/3D graphics and 1080p-class video processing as described in the device family documentation.
- Memory Support Flexible external memory controller support for LPDDR2, LVDDR3 and DDR3 to match system performance and power requirements.
- High-speed Interfaces Integrated Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, and four USB 2.0 ports with PHY enable a range of connectivity and storage options.
- Peripheral and Display I/O Display interface controllers for LCD and keypad interfaces plus additional peripheral support including CAN for control networks.
- Security On-chip security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory and secure RTC, and tamper detection for improved system integrity.
- Package & Mounting 624-FBGA (624-FCBGA) package, 21 × 21 mm, surface-mount for compact board-level integration.
- Operating Range Specified operating temperature from −40 °C to 125 °C for deployment in wide-temperature environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Human-Machine Interfaces (HMI) Drives graphical displays and touchscreen interfaces with integrated 2D/3D graphics and display controllers.
- Multimedia Gateways and Set‑Top Devices Supports video processing and multimedia acceleration for streaming, decoding, and local media playback.
- Imaging and Camera Systems Interfaces to camera sensors and display pipelines for embedded vision or monitoring applications.
- Connected Embedded Controllers Gigabit Ethernet, SATA, USB and CAN enable networking, storage and control functions in connected appliances and equipment.
Unique Advantages
- Broad I/O Integration: Multiple high-speed interfaces (Gigabit Ethernet, SATA, USB, CAN) reduce external bridge components and simplify system design.
- Multimedia-Capable Processor: NEON™ SIMD and family-level support for 2D/3D graphics and 1080p video processing provide hardware acceleration for rich UIs and video applications.
- Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 allows designers to select memory technology that balances performance, power and cost.
- Security Building Blocks: Integrated security features (TrustZone, cryptography, secure boot options and tamper detection) help protect IP and system integrity.
- Extended Temperature Capability: −40 °C to 125 °C operating range supports deployment in demanding thermal environments.
- Compact, High‑Density Packaging: 624-FCBGA (21 × 21 mm) package enables high pin density in a compact footprint for space-constrained designs.
Why Choose MCIMX6D4AVT08AC?
The MCIMX6D4AVT08AC combines dual ARM® Cortex®-A9 processing with multimedia acceleration, comprehensive I/O and memory flexibility to address embedded applications that need both compute and rich media capabilities. Its integrated security features and extended operating temperature range make it suitable for robust, industrial-style deployments.
Backed by NXP Semiconductors documentation and package-level details, the device is positioned for designers seeking a balanced, well-documented processor platform with extensive peripheral integration and clear electrical and package specifications.
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