MCIMX6D4AVT08AC

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 120 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT08AC – IC MPU I.MX6D 852MHZ 624FCBGA

The MCIMX6D4AVT08AC is an NXP i.MX 6D series dual-core ARM® Cortex®-A9 microprocessor operating at 852 MHz, supplied in a 624-FCBGA (21 × 21 mm) package. It targets embedded and industrial multimedia applications that require a combination of processing performance, graphics/video acceleration, and a broad set of peripheral interfaces.

Designed for multimedia-focused embedded systems, the device integrates NEON™ SIMD multimedia acceleration, multiple memory controller options, and a rich set of I/O including Gigabit Ethernet, SATA, USB, and CAN to support connected, display-driven products.

Key Features

  • Core  Dual ARM® Cortex®-A9 cores, 32-bit, running at 852 MHz for balanced multiprocessing and control tasks.
  • Multimedia Acceleration  Includes NEON™ SIMD and multimedia/DSP capabilities plus 2D/3D graphics and 1080p-class video processing as described in the device family documentation.
  • Memory Support  Flexible external memory controller support for LPDDR2, LVDDR3 and DDR3 to match system performance and power requirements.
  • High-speed Interfaces  Integrated Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, and four USB 2.0 ports with PHY enable a range of connectivity and storage options.
  • Peripheral and Display I/O  Display interface controllers for LCD and keypad interfaces plus additional peripheral support including CAN for control networks.
  • Security  On-chip security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory and secure RTC, and tamper detection for improved system integrity.
  • Package & Mounting  624-FBGA (624-FCBGA) package, 21 × 21 mm, surface-mount for compact board-level integration.
  • Operating Range  Specified operating temperature from −40 °C to 125 °C for deployment in wide-temperature environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Human-Machine Interfaces (HMI)  Drives graphical displays and touchscreen interfaces with integrated 2D/3D graphics and display controllers.
  • Multimedia Gateways and Set‑Top Devices  Supports video processing and multimedia acceleration for streaming, decoding, and local media playback.
  • Imaging and Camera Systems  Interfaces to camera sensors and display pipelines for embedded vision or monitoring applications.
  • Connected Embedded Controllers  Gigabit Ethernet, SATA, USB and CAN enable networking, storage and control functions in connected appliances and equipment.

Unique Advantages

  • Broad I/O Integration: Multiple high-speed interfaces (Gigabit Ethernet, SATA, USB, CAN) reduce external bridge components and simplify system design.
  • Multimedia-Capable Processor: NEON™ SIMD and family-level support for 2D/3D graphics and 1080p video processing provide hardware acceleration for rich UIs and video applications.
  • Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 allows designers to select memory technology that balances performance, power and cost.
  • Security Building Blocks: Integrated security features (TrustZone, cryptography, secure boot options and tamper detection) help protect IP and system integrity.
  • Extended Temperature Capability: −40 °C to 125 °C operating range supports deployment in demanding thermal environments.
  • Compact, High‑Density Packaging: 624-FCBGA (21 × 21 mm) package enables high pin density in a compact footprint for space-constrained designs.

Why Choose MCIMX6D4AVT08AC?

The MCIMX6D4AVT08AC combines dual ARM® Cortex®-A9 processing with multimedia acceleration, comprehensive I/O and memory flexibility to address embedded applications that need both compute and rich media capabilities. Its integrated security features and extended operating temperature range make it suitable for robust, industrial-style deployments.

Backed by NXP Semiconductors documentation and package-level details, the device is positioned for designers seeking a balanced, well-documented processor platform with extensive peripheral integration and clear electrical and package specifications.

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