MCIMX537CVV8C2R2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 1,166 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVV8C2R2 – IC MPU I.MX53 800MHz 529FBGA

The MCIMX537CVV8C2R2 is an NXP i.MX 537 series microprocessor based on a single ARM® Cortex®-A8 core running at 800 MHz. It combines a general-purpose 32-bit application core with integrated multimedia engines and broad peripheral support to address embedded and infotainment-style designs where performance, integration, and industrial qualification matter.

Designed for graphics‑rich HMI and video-capable systems, the device integrates 2D/3D graphics and video processing, multiple memory controller options, and a comprehensive set of interfaces including Ethernet, SATA and USB to simplify system design and accelerate time to market.

Key Features

  • CPU Core — ARM® Cortex®-A8 single 32-bit core operating at 800 MHz for sustained application processing.
  • Multimedia & DSP — Integrated multimedia co-processors with NEON™ SIMD support and dedicated 2D/3D graphics acceleration plus 1080i/p video processing and dual-display capability as described in the device documentation.
  • Memory Controllers — Support for LPDDR2, DDR2 and DDR3 memory types to match a range of system memory performance and power targets.
  • Display & UI — On-chip display interface support including LCD and keypad controllers for HMI and infotainment front-ends.
  • High-speed Storage & Networking — Integrated SATA 1.5 Gbps (1) and 10/100 Mbps Ethernet (1) for storage and network connectivity.
  • USB Connectivity — Multiple USB 2.0 interfaces, listed as USB 2.0 (2) and USB 2.0 + PHY (2), providing flexible host/device and PHY options.
  • Security Features — Comprehensive security capabilities including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package & Mounting — 529-FBGA supplier device package, 19 × 19 mm footprint with surface-mount mounting for compact board designs.
  • Temperature & Compliance — Industrial operating temperature from −40 °C to 85 °C and RoHS compliant.
  • Additional Interfaces — Support for 1‑Wire and other peripheral interfaces to accommodate sensors and auxiliary devices.

Typical Applications

  • Human Machine Interfaces (HMI) — Drive graphic-rich LCD and keypad-based interfaces using integrated 2D/3D acceleration and display controllers.
  • Infotainment and Media Playback — Handle video processing and 1080i/p content with onboard multimedia engines and external storage via SATA.
  • Embedded Networking Appliances — Provide wired network connectivity with integrated 10/100 Mbps Ethernet and multiple USB ports for peripherals.
  • Industrial Control & Monitoring — Industrial-grade temperature range and rich I/O make it suitable for display-centric industrial applications and HMI controllers.

Unique Advantages

  • Integrated Multimedia Subsystem: 2D/3D graphics and video processing reduce the need for external accelerators and simplify system architecture.
  • Flexible Memory Support: Native LPDDR2, DDR2 and DDR3 controller options let designers select memory that balances performance, cost and power.
  • Comprehensive I/O Mix: Built-in SATA, Ethernet, multiple USB ports and 1‑Wire support an extensive set of peripherals with fewer external components.
  • Hardware Security Primitives: On-chip TrustZone, cryptography and secure boot features help implement robust device security and protected boot flows.
  • Industrial Temperature Range: Rated for −40 °C to 85 °C operation, enabling deployment in temperature-challenging embedded environments.
  • Compact FBGA Package: 529-FBGA (19 × 19 mm) enables dense board integration while maintaining a broad I/O count.

Why Choose MCIMX537CVV8C2R2?

The MCIMX537CVV8C2R2 positions itself as a balanced embedded processor for designs that require application-level CPU performance together with integrated multimedia, graphics and a wide peripheral set. Its single ARM® Cortex®-A8 core at 800 MHz, combined with on-chip graphics and video processing, reduces system complexity for HMI, infotainment-like and other display-centric embedded products.

With industrial temperature qualification, extensive security features and multiple memory and interface options, this device offers a scalable platform for engineers and procurement teams seeking a compact, RoHS-compliant MPU solution for mid-range embedded applications.

Request a quote or submit a parts inquiry today to evaluate MCIMX537CVV8C2R2 for your next embedded design.

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