MCIMX537CVV8C2R2
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19) |
|---|---|
| Quantity | 1,166 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 537 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-FBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 529-FBGA | RAM Controllers | LPDDR2, DDR2, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 1.5Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 800MHz | Supplier Device Package | 529-FBGA (19×19) | ||
| USB | USB 2.0 (2), USB 2.0 + PHY (2) | Voltage – I/O | 1.3V, 1.8V, 2.775V, 3.3V |
Overview of MCIMX537CVV8C2R2 – IC MPU I.MX53 800MHz 529FBGA
The MCIMX537CVV8C2R2 is an NXP i.MX 537 series microprocessor based on a single ARM® Cortex®-A8 core running at 800 MHz. It combines a general-purpose 32-bit application core with integrated multimedia engines and broad peripheral support to address embedded and infotainment-style designs where performance, integration, and industrial qualification matter.
Designed for graphics‑rich HMI and video-capable systems, the device integrates 2D/3D graphics and video processing, multiple memory controller options, and a comprehensive set of interfaces including Ethernet, SATA and USB to simplify system design and accelerate time to market.
Key Features
- CPU Core — ARM® Cortex®-A8 single 32-bit core operating at 800 MHz for sustained application processing.
- Multimedia & DSP — Integrated multimedia co-processors with NEON™ SIMD support and dedicated 2D/3D graphics acceleration plus 1080i/p video processing and dual-display capability as described in the device documentation.
- Memory Controllers — Support for LPDDR2, DDR2 and DDR3 memory types to match a range of system memory performance and power targets.
- Display & UI — On-chip display interface support including LCD and keypad controllers for HMI and infotainment front-ends.
- High-speed Storage & Networking — Integrated SATA 1.5 Gbps (1) and 10/100 Mbps Ethernet (1) for storage and network connectivity.
- USB Connectivity — Multiple USB 2.0 interfaces, listed as USB 2.0 (2) and USB 2.0 + PHY (2), providing flexible host/device and PHY options.
- Security Features — Comprehensive security capabilities including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- Package & Mounting — 529-FBGA supplier device package, 19 × 19 mm footprint with surface-mount mounting for compact board designs.
- Temperature & Compliance — Industrial operating temperature from −40 °C to 85 °C and RoHS compliant.
- Additional Interfaces — Support for 1‑Wire and other peripheral interfaces to accommodate sensors and auxiliary devices.
Typical Applications
- Human Machine Interfaces (HMI) — Drive graphic-rich LCD and keypad-based interfaces using integrated 2D/3D acceleration and display controllers.
- Infotainment and Media Playback — Handle video processing and 1080i/p content with onboard multimedia engines and external storage via SATA.
- Embedded Networking Appliances — Provide wired network connectivity with integrated 10/100 Mbps Ethernet and multiple USB ports for peripherals.
- Industrial Control & Monitoring — Industrial-grade temperature range and rich I/O make it suitable for display-centric industrial applications and HMI controllers.
Unique Advantages
- Integrated Multimedia Subsystem: 2D/3D graphics and video processing reduce the need for external accelerators and simplify system architecture.
- Flexible Memory Support: Native LPDDR2, DDR2 and DDR3 controller options let designers select memory that balances performance, cost and power.
- Comprehensive I/O Mix: Built-in SATA, Ethernet, multiple USB ports and 1‑Wire support an extensive set of peripherals with fewer external components.
- Hardware Security Primitives: On-chip TrustZone, cryptography and secure boot features help implement robust device security and protected boot flows.
- Industrial Temperature Range: Rated for −40 °C to 85 °C operation, enabling deployment in temperature-challenging embedded environments.
- Compact FBGA Package: 529-FBGA (19 × 19 mm) enables dense board integration while maintaining a broad I/O count.
Why Choose MCIMX537CVV8C2R2?
The MCIMX537CVV8C2R2 positions itself as a balanced embedded processor for designs that require application-level CPU performance together with integrated multimedia, graphics and a wide peripheral set. Its single ARM® Cortex®-A8 core at 800 MHz, combined with on-chip graphics and video processing, reduces system complexity for HMI, infotainment-like and other display-centric embedded products.
With industrial temperature qualification, extensive security features and multiple memory and interface options, this device offers a scalable platform for engineers and procurement teams seeking a compact, RoHS-compliant MPU solution for mid-range embedded applications.
Request a quote or submit a parts inquiry today to evaluate MCIMX537CVV8C2R2 for your next embedded design.

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