MCIMX537CVV8B
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19) |
|---|---|
| Quantity | 1,097 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 537 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A8 | Device Package | 529-FBGA (19x19) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C – 85°C | Package / Case | Tray | ||
| Speed | 800MHz | Voltage | 1.3V, 1.8V, 2.775V, 3.3V |
Overview of MCIMX537CVV8B – IC MPU I.MX53 800MHz 529FBGA
The MCIMX537CVV8B is an NXP i.MX53 series microprocessor IC built around a single ARM® Cortex®-A8 core running at up to 800 MHz. It is designed for embedded and industrial applications that require balanced compute performance, broad peripheral integration and robust security functionality.
With support for multiple DRAM types, rich I/O including Ethernet, SATA and USB, and integrated multimedia acceleration, the device targets industrial HMI, connectivity gateways, imaging and storage-enabled embedded systems where performance, integration and secure boot capabilities matter.
Key Features
- Core – ARM® Cortex®-A8 single 32‑bit core at 800 MHz with NEON™ SIMD multimedia acceleration for improved media and signal-processing throughput.
- Memory – Integrated memory controllers supporting LPDDR2, DDR2 and DDR3, plus a multilevel memory subsystem with L1 and L2 caches for responsive system performance.
- Display and HMI – On-chip display interface controllers for LCD and keypad support to enable modern human‑machine interfaces.
- Connectivity – Built-in Ethernet 10/100 Mbps (1), USB 2.0 ports (2) with USB 2.0 + PHY (2) support for peripheral and network connectivity.
- Storage – Integrated SATA 1.5 Gbps (1) interface for direct connection to storage devices such as hard drives.
- Security – Comprehensive security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection for hardened systems.
- Power Management – Dynamic Voltage and Frequency Scaling (DVFS) capability to reduce power consumption by lowering voltage and frequency when full performance is not required.
- Package & Mounting – 529‑FBGA (19 × 19 mm) surface‑mount package; supplied in tray format for production assembly.
- Qualification & Environment – Industrial qualification with an operating temperature range of −40 °C to 85 °C suitable for demanding embedded environments.
Typical Applications
- Industrial HMI and Control – Drives LCD and keypad-based interfaces with industrial temperature range and secure boot for reliable control panels and operator displays.
- Imaging and Camera Systems – Integrates with camera sensors and provides multimedia acceleration for image processing and display.
- Connectivity Gateways – Supports Ethernet, USB and additional wireless peripherals to serve as a communication hub or gateway in embedded networks.
- Storage-enabled Embedded Systems – SATA and USB interfaces enable local storage and mass‑storage applications such as data loggers and appliance controllers.
Unique Advantages
- Highly integrated I/O: Ethernet, SATA, multiple USB ports and display interfaces reduce external components and simplify system design.
- Flexible memory support: Native controllers for LPDDR2, DDR2 and DDR3 allow designers to choose memory solutions that match cost and performance targets.
- Built-in security stack: Extensive security features including TrustZone, secure boot and tamper detection help protect system integrity and IP.
- Industrial readiness: Qualified for −40 °C to 85 °C operation, matching the environmental needs of industrial embedded deployments.
- Power scaling capabilities: DVFS support enables reduced power consumption for lower‑load tasks while maintaining available performance when needed.
- Compact BGA package: 529‑FBGA (19 × 19 mm) offers a compact surface‑mount footprint for space‑constrained designs.
Why Choose MCIMX537CVV8B?
The MCIMX537CVV8B positions itself as a balanced embedded application processor offering a robust mix of compute, multimedia acceleration, secure boot and broad peripheral integration. Its single ARM® Cortex®‑A8 core at 800 MHz, flexible memory options and integrated I/O make it suitable for industrial HMI, imaging, connectivity and storage applications where system-level integration and security are priorities.
Designed by NXP and backed by detailed technical documentation, the device supports scalable designs that benefit from industry‑grade temperature range and on‑chip power management. It is well suited to engineering teams seeking a proven i.MX53‑series processor for long‑lifecycle embedded products.
Request a quote or submit a purchase inquiry for MCIMX537CVV8B to receive pricing, availability and lead‑time information for your project needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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