MCIMX536AVV8C2R2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 110 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 536
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX536AVV8C2R2 – ARM® Cortex®-A8 800 MHz Microprocessor (529-FBGA)

The MCIMX536AVV8C2R2 is a single‑core ARM® Cortex®‑A8 microprocessor running at up to 800 MHz in a 529‑FBGA (19×19 mm) package. Designed for embedded and industrial applications, it combines a high‑performance application core with integrated multimedia accelerators, broad memory support, and a wide range of peripheral interfaces.

This device targets embedded systems that require graphics and video processing, robust connectivity, and hardware security features while operating across an extended temperature range.

Key Features

  • Core & Performance  Single ARM® Cortex®‑A8 core operating at up to 800 MHz, delivering 32‑bit application processing for embedded workloads.
  • Multimedia & DSP  Integrated multimedia and NEON™ SIMD support for accelerated media processing and optimized signal/codec workloads.
  • Memory Support  On‑chip controllers supporting LPDDR2, DDR2 and DDR3 memory types to match a variety of system memory architectures.
  • Graphics & Video  Graphics acceleration with documented 2D/3D capabilities and video processing up to 1080i/p for display and HMI applications.
  • Interfaces & Connectivity  Rich peripheral set including 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1), multiple USB 2.0 ports (2) and USB 2.0 + PHY (2), plus keypad and LCD display controllers and 1‑Wire support.
  • Security & System Integrity  Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting  529‑FBGA package (19×19 mm, 0.8 mm pitch) optimized for surface‑mount applications and compact board designs.
  • Operating Range & Compliance  Industrial qualification with an operating temperature range of −40°C to 125°C and RoHS compliance for regulated environments.

Typical Applications

  • Industrial HMI and Displays  Drives LCD panels and user interfaces with built‑in display controllers and graphics acceleration for responsive visual output.
  • Multimedia Embedded Systems  Supports audio/video playback and media processing using NEON SIMD and video acceleration capabilities.
  • Embedded Gateways and Connectivity Appliances  Integrates Ethernet, USB and SATA interfaces for networking and local storage in industrial and embedded gateway designs.
  • Secure Embedded Controllers  Implements secure boot and cryptographic features for applications that require hardware‑assisted security and tamper detection.

Unique Advantages

  • Integrated multimedia acceleration: Reduces external accelerators by providing on‑chip 2D/3D graphics and video processing capabilities.
  • Flexible memory support: LPDDR2, DDR2 and DDR3 controller support enables designers to choose memory types that match performance and cost targets.
  • Comprehensive I/O set: Ethernet, SATA, multiple USB ports and display interfaces simplify system integration for connected embedded products.
  • Hardware security suite: Built‑in TrustZone, secure boot and cryptographic features provide a layered approach to platform security.
  • Extended temperature operation: −40°C to 125°C rating supports deployment in demanding industrial environments.
  • Compact BGA footprint: 529‑FBGA (19×19 mm) package balances thermal performance and board space for compact embedded designs.

Why Choose MCIMX536AVV8C2R2?

The MCIMX536AVV8C2R2 positions itself as a balanced embedded application processor that pairs an ARM® Cortex®‑A8 core with multimedia acceleration, broad memory compatibility, and a comprehensive peripheral set. It is well suited to embedded and industrial designs that require graphics/video capabilities, secure boot and communications interfaces while operating across an extended temperature range.

Engineers and procurement teams benefit from the device’s integration—reducing BOM complexity and simplifying system design—while retaining flexibility through multiple memory and interface options supported by the documented package and thermal profile.

Request a quote or submit a procurement inquiry to evaluate MCIMX536AVV8C2R2 for your embedded design needs.

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