MCIMX537CVP8C2R2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 993 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVP8C2R2 – IC MPU I.MX53 800MHz 529-FBGA

The MCIMX537CVP8C2R2 is an ARM® Cortex®-A8 based microprocessor in the i.MX 537 series, featuring a single 32-bit core clocked at 800 MHz and supplied in a 529‑FBGA (19 × 19 mm) package. Designed for embedded and infotainment-class applications, this device combines multimedia acceleration, flexible memory support and a broad set of peripheral interfaces to address display, storage and connectivity needs in compact surface-mount designs.

Key Features

  • Core & Performance  ARM® Cortex®-A8 single 32-bit core at 800 MHz for general-purpose processing.
  • Multimedia Accelerators  Integrated 2D/3D graphics acceleration and video processing capabilities, including support for 1080i/p video workflows and dual-display configurations as described in the product documentation.
  • Memory Interfaces  On-chip controllers for LPDDR2, DDR2 and DDR3 memory types to match a range of system memory designs.
  • Connectivity & Storage  10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1) and multiple USB 2.0 interfaces (2x USB 2.0, plus USB 2.0 + PHY and USB 2.0 OTG + PHY) for networked and local storage/host device integration.
  • Display & Input  Display interface controllers for LCD and LVDS plus keypad support to enable rich human‑machine interfaces.
  • Security  Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, along with tamper detection.
  • Package & Mounting  529‑FBGA plastic package, 19 × 19 mm, 0.8 mm pitch; surface-mount mounting type suitable for compact board-level integration.
  • Operating Range & Qualification  Industrial qualification with operating temperature range from −40 °C to 125 °C and RoHS compliance.
  • Additional Interfaces  1‑Wire interface and multimedia-focused co-processors such as NEON™ SIMD for signal processing acceleration.

Typical Applications

  • Infotainment & Multimedia Systems  Engineered for display-driven systems that require integrated video processing, 2D/3D graphics and audio playback support.
  • HMI & Display Controllers  Used to drive LCD/LVDS displays and manage keypad inputs for advanced user interfaces in embedded products.
  • Networked Embedded Devices  Suitable for applications requiring Ethernet connectivity, SATA storage and multiple USB peripherals.
  • Industrial Embedded Systems  Industrial-grade temperature range and industrial qualification make this device appropriate for robust embedded control and display applications.

Unique Advantages

  • Balanced CPU and Multimedia Integration: Combines an 800 MHz Cortex‑A8 core with dedicated graphics and video processing to reduce external processor requirements.
  • Flexible Memory Support: Built-in controllers for LPDDR2, DDR2 and DDR3 simplify BOM choices and enable performance scaling.
  • Comprehensive I/O Set: Integrated Ethernet, SATA and multiple USB interfaces provide broad connectivity without extensive external controllers.
  • Hardened Security Features: Multiple on-chip security mechanisms (TrustZone, secure boot, cryptography, secure JTAG and tamper detection) support secure system designs.
  • Industrial Temperature Capability: Rated for −40 °C to 125 °C operation to support deployment in demanding environmental conditions.
  • Compact Package: 529‑FBGA (19 × 19 mm, 0.8 mm pitch) enables high-density, surface-mount board designs.

Why Choose MCIMX537CVP8C2R2?

The MCIMX537CVP8C2R2 positions itself as a versatile, industrially qualified embedded processor that pairs a capable ARM® Cortex®-A8 core with integrated multimedia acceleration, flexible memory interfaces and a wide array of connectivity options. Its on-chip security features and extended operating temperature range make it suitable for robust embedded designs that need multimedia and networking capabilities in a compact footprint.

Designers targeting infotainment-class displays, human‑machine interfaces, or networked embedded systems will find the MCIMX537CVP8C2R2 provides a balanced combination of performance, integration and system-level features, supported by detailed package and electrical documentation for engineering integration.

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