MCIMX537CVP8C2R2
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19) |
|---|---|
| Quantity | 993 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 537 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-FBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 529-FBGA | RAM Controllers | LPDDR2, DDR2, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 1.5Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 800MHz | Supplier Device Package | 529-FBGA (19×19) | ||
| USB | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.3V, 1.8V, 2.775V, 3.3V |
Overview of MCIMX537CVP8C2R2 – IC MPU I.MX53 800MHz 529-FBGA
The MCIMX537CVP8C2R2 is an ARM® Cortex®-A8 based microprocessor in the i.MX 537 series, featuring a single 32-bit core clocked at 800 MHz and supplied in a 529‑FBGA (19 × 19 mm) package. Designed for embedded and infotainment-class applications, this device combines multimedia acceleration, flexible memory support and a broad set of peripheral interfaces to address display, storage and connectivity needs in compact surface-mount designs.
Key Features
- Core & Performance ARM® Cortex®-A8 single 32-bit core at 800 MHz for general-purpose processing.
- Multimedia Accelerators Integrated 2D/3D graphics acceleration and video processing capabilities, including support for 1080i/p video workflows and dual-display configurations as described in the product documentation.
- Memory Interfaces On-chip controllers for LPDDR2, DDR2 and DDR3 memory types to match a range of system memory designs.
- Connectivity & Storage 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1) and multiple USB 2.0 interfaces (2x USB 2.0, plus USB 2.0 + PHY and USB 2.0 OTG + PHY) for networked and local storage/host device integration.
- Display & Input Display interface controllers for LCD and LVDS plus keypad support to enable rich human‑machine interfaces.
- Security Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, along with tamper detection.
- Package & Mounting 529‑FBGA plastic package, 19 × 19 mm, 0.8 mm pitch; surface-mount mounting type suitable for compact board-level integration.
- Operating Range & Qualification Industrial qualification with operating temperature range from −40 °C to 125 °C and RoHS compliance.
- Additional Interfaces 1‑Wire interface and multimedia-focused co-processors such as NEON™ SIMD for signal processing acceleration.
Typical Applications
- Infotainment & Multimedia Systems Engineered for display-driven systems that require integrated video processing, 2D/3D graphics and audio playback support.
- HMI & Display Controllers Used to drive LCD/LVDS displays and manage keypad inputs for advanced user interfaces in embedded products.
- Networked Embedded Devices Suitable for applications requiring Ethernet connectivity, SATA storage and multiple USB peripherals.
- Industrial Embedded Systems Industrial-grade temperature range and industrial qualification make this device appropriate for robust embedded control and display applications.
Unique Advantages
- Balanced CPU and Multimedia Integration: Combines an 800 MHz Cortex‑A8 core with dedicated graphics and video processing to reduce external processor requirements.
- Flexible Memory Support: Built-in controllers for LPDDR2, DDR2 and DDR3 simplify BOM choices and enable performance scaling.
- Comprehensive I/O Set: Integrated Ethernet, SATA and multiple USB interfaces provide broad connectivity without extensive external controllers.
- Hardened Security Features: Multiple on-chip security mechanisms (TrustZone, secure boot, cryptography, secure JTAG and tamper detection) support secure system designs.
- Industrial Temperature Capability: Rated for −40 °C to 125 °C operation to support deployment in demanding environmental conditions.
- Compact Package: 529‑FBGA (19 × 19 mm, 0.8 mm pitch) enables high-density, surface-mount board designs.
Why Choose MCIMX537CVP8C2R2?
The MCIMX537CVP8C2R2 positions itself as a versatile, industrially qualified embedded processor that pairs a capable ARM® Cortex®-A8 core with integrated multimedia acceleration, flexible memory interfaces and a wide array of connectivity options. Its on-chip security features and extended operating temperature range make it suitable for robust embedded designs that need multimedia and networking capabilities in a compact footprint.
Designers targeting infotainment-class displays, human‑machine interfaces, or networked embedded systems will find the MCIMX537CVP8C2R2 provides a balanced combination of performance, integration and system-level features, supported by detailed package and electrical documentation for engineering integration.
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