MCIMX537CVP8C2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 222 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCD, LVDSECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVP8C2 – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX537CVP8C2 is an ARM® Cortex®-A8 32-bit microprocessor running at up to 800 MHz in a 529‑FBGA (19 × 19 mm) package. It integrates multimedia acceleration, multiple memory controllers, and a broad set of high-speed and legacy peripheral interfaces to support advanced display, audio and I/O-centric embedded systems.

Designed for industrial-grade operation, the device targets infotainment, HMI and display-oriented applications where performance, integration and secure boot/cryptographic capability are required. The i.MX53 architecture combines CPU performance with graphics and video processing to enable feature-rich human‑machine interfaces and multimedia systems.

Key Features

  • Core and Performance ARM® Cortex®-A8 single core, 32-bit processor operating at up to 800 MHz for compute and control tasks.
  • Multimedia and DSP Integrated multimedia co-processing with NEON™ SIMD support and dedicated 2D/3D graphics processors for accelerated UI and media rendering; datasheet references 1080i/p video processing and dual display capability.
  • Memory Controllers Supports LPDDR2, DDR2 and DDR3 memory interfaces to match system memory performance and density requirements.
  • Display and UI Interfaces On-chip controllers for keypad, LCD and LVDS display interfaces to simplify HMI and display subsystem design.
  • High-Speed Connectivity Integrated interfaces include 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1), multiple USB 2.0 ports (USB 2.0, USB 2.0 + PHY, USB 2.0 OTG + PHY) for external storage and peripheral connectivity.
  • Security and Boot Hardware security features including ARM TrustZone, boot security, cryptography engines, secure fusebox, secure JTAG, secure memory and tamper detection for system integrity and secure boot chains.
  • Additional I/O Includes 1‑Wire interface and a variety of peripheral interfaces for sensor and system integration.
  • Package and Mounting 529‑FBGA package (19 × 19 mm, 0.8 mm pitch) in a surface-mount form factor suitable for compact embedded boards.
  • Operating Range and Compliance Industrial qualification and RoHS compliance with an operating temperature range of −40 °C to 125 °C for demanding environments.

Typical Applications

  • Infotainment Systems — Multimedia processing, dual-display support and interface integration enable rich audio/video and user interface designs.
  • Human‑Machine Interfaces (HMI) — Graphics acceleration and LCD/LVDS controllers support responsive touchscreens and instrument cluster displays.
  • Telematics and Navigation — CPU performance and peripheral connectivity (Ethernet, USB, SATA) support navigation, data logging and map/database processing.
  • Multimedia Gateways and Media Players — 1080i/p video processing, USB and SATA interfaces facilitate media playback and storage subsystems.

Unique Advantages

  • Integrated Multimedia Subsystem: On-chip 2D/3D graphics and video processing reduce external component count and simplify multimedia system design.
  • Flexible Memory Support: LPDDR2, DDR2 and DDR3 controllers allow designers to choose memory technology based on cost, performance and power trade-offs.
  • Comprehensive I/O Suite: Ethernet, SATA and multiple USB options provide ready-made interfaces for connectivity, storage and peripheral expansion.
  • Hardware Security Primitives: Built-in TrustZone, cryptography and secure boot features help protect firmware and critical assets in deployed systems.
  • Industrial Temperature Range: −40 °C to 125 °C operation supports deployment in temperature-challenging environments.
  • Compact FBGA Package: 529‑FBGA (19 × 19 mm) delivers a high pin-count footprint in a compact surface-mount form factor for space-constrained boards.

Why Choose MCIMX537CVP8C2?

The MCIMX537CVP8C2 combines an ARM Cortex‑A8 core with integrated graphics/video acceleration, a broad set of memory options and extensive peripheral connectivity to address display-driven and multimedia embedded designs. Its security features and industrial temperature rating make it suitable for robust, long‑lifecycle applications where both performance and system integrity matter.

This processor is well suited for designers who need a balanced platform for HMI, infotainment and data‑centric embedded systems, offering scalability through flexible memory support and a dense package that keeps BOM and board area considerations in check.

Request a quote or submit a purchase inquiry to receive pricing and availability for the MCIMX537CVP8C2. Our team can provide lead‑time information and support for your procurement and design-in process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up