MCIMX537CVV8C

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 1,713 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVV8C – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX537CVV8C is an NXP i.MX53 series application processor integrating a single ARM® Cortex®-A8 32‑bit core running at up to 800 MHz. It is designed for industrial and embedded systems that require multimedia processing, flexible memory support, and a broad set of peripheral interfaces.

With integrated security features, graphics acceleration, and support for common memory technologies, this 529‑FBGA (19 × 19 mm) surface‑mount package targets industrial applications and embedded designs needing balanced performance, interface integration, and extended temperature operation.

Key Features

  • Core  Single ARM® Cortex®-A8 32‑bit core operating up to 800 MHz, providing a compact compute engine for embedded and multimedia tasks.
  • Memory Support  Integrated controllers for LPDDR2, DDR2 and DDR3 memories; datasheet notes a multilevel memory system with L1 and L2 caches supporting external DDR and flash types.
  • Multimedia & DSP  Multimedia co‑processor support and NEON™ SIMD acceleration for optimized media and signal processing workloads.
  • Display & Graphics  Includes graphics acceleration and display interface controllers for LCD and keypad interfaces suitable for HMI and display subsystems.
  • Connectivity  Ethernet 10/100 Mbps (1), SATA 1.5 Gbps (1), plus multiple USB 2.0 interfaces (2 USB 2.0 and 2 USB 2.0 with PHY) and a 1‑Wire interface for peripheral connectivity.
  • Security  Comprehensive security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC, and tamper detection.
  • Power & Performance Management  Datasheet references Dynamic Voltage and Frequency Scaling (DVFS) capability to reduce power consumption during lower performance states.
  • Package & Temperature  529‑FBGA package (19 × 19 mm, 0.8 mm pitch), surface mount; industrial qualification with operating range from −40 °C to 85 °C.
  • Compliance  RoHS‑compliant device suitable for industrial electronics manufacturing.

Typical Applications

  • Industrial HMI and Control  Use the i.MX53 core and display interfaces to drive LCD user interfaces and manage control logic in industrial systems within the specified industrial temperature range.
  • Embedded Multimedia Devices  NEON™ SIMD and multimedia co‑processing support enable audio/video and media playback features for portable or fixed multimedia applications.
  • Networking and Storage Appliances  Integrated Ethernet and SATA interfaces allow deployment in networked embedded devices, compact NAS, and storage‑connected appliances.
  • Connectivity Hubs and Peripherals  Multiple USB ports, 1‑Wire, and support for common external memory/flash types make it suitable for gateway and peripheral controller designs.

Unique Advantages

  • Balanced compute and multimedia acceleration  ARM Cortex‑A8 plus NEON™ enables efficient handling of both control and media tasks without separate processors.
  • Flexible memory options  Support for LPDDR2, DDR2 and DDR3 plus compatibility with a range of external flash and NAND types simplifies BOM choices across product families.
  • Rich peripheral set  On‑chip Ethernet, SATA, multiple USB interfaces, and display controllers reduce external interface components and lower system complexity.
  • Industrial readiness  Qualified for industrial operation and specified for −40 °C to 85 °C, suitable for robust embedded deployments.
  • Comprehensive security  Built‑in TrustZone and multiple secure boot and tamper features help protect system integrity and sensitive data.
  • Compact package  529‑FBGA (19 × 19 mm) delivers a high level of integration in a compact, surface‑mount form factor.

Why Choose MCIMX537CVV8C?

The MCIMX537CVV8C combines a single 800 MHz ARM® Cortex®‑A8 core with multimedia acceleration, extensive memory and peripheral support, and a suite of security features—positioning it as a versatile choice for industrial and embedded systems that require integrated connectivity and media capabilities. Its industrial qualification and extended temperature range offer reliability for fielded products.

This part is suitable for designers seeking a compact, integrated processor solution that balances compute, multimedia, and I/O integration while providing the security and power‑management features referenced in the datasheet.

Request a quote or contact sales to discuss pricing, availability, and design‑in support for the MCIMX537CVV8C for your next embedded or industrial design.

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