MCIMX537CVV8CR2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 1,410 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVV8CR2 – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX537CVV8CR2 is an NXP Semiconductors i.MX53 series applications processor featuring a single ARM® Cortex®-A8 core running at up to 800 MHz. It is an industrially qualified, surface-mount microprocessor packaged in a 529‑FBGA (19 × 19 mm) footprint.

Designed for embedded and industrial systems, this device integrates a multilevel memory system with L1/L2 caches, wide DRAM support and abundant peripheral interfaces to connect cameras, displays, storage and networking peripherals while offering hardware security features and power-management mechanisms such as dynamic voltage and frequency scaling (DVFS).

Key Features

  • Processor Core — Single ARM® Cortex®-A8 core, 32‑bit architecture running up to 800 MHz.
  • Memory Subsystem — Multilevel memory system with L1 and L2 caches; supports DDR2/LVDDR2‑800, LPDDR2‑800 and DDR3‑800 external memories.
  • Multimedia and DSP — Multimedia co‑processors with NEON™ SIMD support for enhanced media processing and signal tasks.
  • Display and Graphics — Graphics acceleration plus display controllers for LCD and keypad interfaces suitable for human‑machine interfaces.
  • Connectivity and Storage — Built‑in 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1) and multiple USB 2.0 interfaces (two USB 2.0 and two USB 2.0 + PHY).
  • Peripheral Interfaces — Additional interfaces including 1‑Wire, and general support for camera sensors and external peripherals as shown in the i.MX53 architecture.
  • Security Features — ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Power Management — Dynamic Voltage and Frequency Scaling (DVFS) support for reduced power consumption during lower workload conditions; integrated LDO regulators included in the device architecture.
  • Package and Mounting — 529‑FBGA package (19 × 19 mm, 0.8 mm pitch), surface mount.
  • Operating Range — Industrial operating temperature range: −40 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial HMI and Control — Drive LCD-based user interfaces and keypad input with integrated graphics acceleration and display controllers in industrial systems within the −40 °C to 85 °C range.
  • Multimedia Devices — Support multimedia applications using the NEON™ SIMD engines and graphics acceleration for audio/video processing.
  • Storage and Imaging Subsystems — Interface with SATA drives and camera sensors for embedded storage and imaging solutions.
  • Networking and Connectivity Appliances — Serve as the application processor in gateways and networked devices leveraging integrated Ethernet and multiple USB interfaces.

Unique Advantages

  • Highly integrated I/O set: Native Ethernet, SATA, multiple USB ports, display controllers and 1‑Wire interface reduce system BOM and simplify board design.
  • Security‑hardened platform: Comprehensive security features including TrustZone, secure boot and tamper detection support secure embedded deployments.
  • Memory flexibility: Supports DDR2, LPDDR2 and DDR3 memory standards to match different performance and cost targets.
  • Power-scalable operation: DVFS capability enables lower power operation during light workloads, helping optimize energy use in battery‑sensitive or heat‑constrained designs.
  • Industrial durability: Qualified for industrial temperature operation (−40 °C to 85 °C) for reliable use in demanding environments.
  • Compact packaging: 529‑FBGA 19 × 19 mm package offers a small footprint for space-constrained embedded systems.

Why Choose MCIMX537CVV8CR2?

The MCIMX537CVV8CR2 positions itself as a robust, industrially qualified application processor for embedded designs that require balanced compute performance, multimedia capability and broad peripheral integration. Its ARM® Cortex®‑A8 core combined with multimedia accelerators, a flexible memory subsystem and extensive security features makes it suitable for industrial HMI, multimedia, storage and networking applications.

Backed by NXP Semiconductors documentation and technical detail provided in the i.MX53 datasheet, the MCIMX537CVV8CR2 is a practical choice for designs that need long-term availability, industrial temperature operation and a compact package with a wide set of integrated interfaces.

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