MCIMX6D4AVT08AD

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 238 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT08AD – IC MPU I.MX6D 852MHz 624-FCBGA

The MCIMX6D4AVT08AD is a dual-core ARM® Cortex®-A9 microprocessor operating at 852 MHz, designed for multimedia-focused embedded applications. It combines dual 32-bit cores with dedicated multimedia and NEON™ SIMD co‑processing to handle graphics and video workloads in compact, high-integration designs.

Built for embedded and industrial product use, the device offers a broad set of peripheral interfaces, a 64-bit memory interface, and hardware security features to support secure boot and cryptography needs while operating across an extended temperature range.

Key Features

  • Processor Core Dual ARM® Cortex®-A9 cores, 32-bit architecture running at 852 MHz for balanced application and multimedia processing.
  • Multimedia & SIMD Integrated multimedia co-processors and NEON™ SIMD acceleration to support graphics and media processing tasks.
  • Memory Subsystem 64-bit memory interface with support for LPDDR2, LVDDR3 and DDR3 memory types for flexible memory design options.
  • Display & UI On-chip display interface controllers including LCD and keypad support and video processing capabilities suitable for display-driven applications.
  • Rich I/O and Storage Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps interface, and four USB 2.0 + PHY ports enable high-bandwidth connectivity and storage options. Additional CAN interface available.
  • Security Hardware security suite including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection for secure system designs.
  • Package & Mounting 624-FCBGA surface-mount package (21 × 21 mm, 0.8 mm pitch) providing a compact high-density footprint for board-level integration.
  • Environmental Range & Compliance Extended operating temperature range of -40°C to 125°C and RoHS compliance for broad environmental use and regulatory alignment.

Typical Applications

  • Industrial HMI and Control: Drives display, input and communication subsystems for human-machine interfaces and embedded controllers requiring multimedia and network connectivity.
  • Multimedia Embedded Devices: Powers devices with displays, video processing and camera interfaces where on-chip graphics acceleration and NEON SIMD help offload media workloads.
  • Networked Storage and Peripherals: Supports products that require SATA storage, multiple USB ports and Gigabit Ethernet for data transfer and peripheral connectivity.

Unique Advantages

  • Balanced Dual-Core Performance: Dual ARM Cortex-A9 cores at 852 MHz provide a mix of application throughput and real-time responsiveness for multimedia workloads.
  • Integrated Multimedia Acceleration: On-chip multimedia processors and NEON SIMD reduce system-level processing requirements and simplify multimedia system design.
  • Comprehensive I/O Set: Built-in Ethernet, SATA, USB, CAN and display interfaces minimize external bridging components and reduce BOM complexity.
  • Robust Security Feature Set: Multiple hardware security elements support secure booting, cryptography and tamper detection to protect sensitive applications and data.
  • Compact High-Density Package: 624-FCBGA (21 × 21 mm) provides a space-efficient, surface-mount solution for compact system boards.
  • Extended Temperature Operation: -40°C to 125°C rating supports deployment in thermally challenging embedded environments.

Why Choose MCIMX6D4AVT08AD?

The MCIMX6D4AVT08AD combines dual ARM Cortex-A9 processing, multimedia acceleration and a wide array of integrated interfaces to deliver a versatile platform for embedded multimedia and industrial applications. Its 64-bit memory interface and support for multiple DRAM types allow designers to match system memory to performance and cost targets.

Backed by NXP documentation and designed for high-integration board layouts, this device is suited for engineers building compact, connected products that require graphics/video capability, robust I/O and hardware security while operating across an extended temperature range.

Request a quote or submit your project requirements to get pricing and availability for the MCIMX6D4AVT08AD today.

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