MCIMX537CVV8C2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 306 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 537
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX537CVV8C2 – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX537CVV8C2 is a single‑core ARM® Cortex®‑A8 microprocessor running at up to 800 MHz in a 529‑FBGA (19 × 19 mm) package. It integrates multimedia acceleration, a NEON™ SIMD engine and a broad set of peripheral interfaces to address display‑centric and multimedia embedded systems.

Targeted for infotainment, telematics, HMI and display‑based applications, the device delivers a balance of processing performance, graphics/video capabilities and industrial qualification for designs that require sustained operation across a wide temperature range.

Key Features

  • Core & Performance  ARM® Cortex®‑A8 32‑bit single core operating at 800 MHz for application processing and control tasks.
  • Multimedia & Acceleration  Integrated multimedia co‑processors including NEON™ SIMD and graphics acceleration with 2D/3D and 1080i/p video processing capabilities described in the i.MX53xA family documentation.
  • Memory Support  On‑chip controllers for LPDDR2, DDR2 and DDR3 memory types (LPDDR2‑800, DDR2/DDR3 support indicated).
  • Display & HMI  Display interface controllers including LCD and keypad support, with dual‑display and advanced video/display handling referenced in the device family material.
  • Connectivity & I/O  Ethernet 10/100 Mbps (1), SATA 1.5 Gbps (1), multiple USB 2.0 ports (including USB 2.0 + PHY), and an additional 1‑Wire interface for external device connectivity.
  • Storage & Peripherals  Integrated host interfaces for common peripherals and storage devices suitable for multimedia and HMI systems.
  • Security & Trust  Security features include ARM TZ, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Package & Mounting  529‑FBGA package (19 × 19 mm) in a surface‑mount form factor for compact board designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of -40 °C to 85 °C. RoHS compliant.

Typical Applications

  • Infotainment Systems  Use the integrated multimedia engines, graphics acceleration and display controllers to drive rich user interfaces and video playback.
  • Telematics & Navigation  Leverage the Cortex‑A8 processing and memory support for map rendering, routing and connected navigation functions.
  • Human‑Machine Interfaces (HMI)  Deliver responsive touch and display control for instrument clusters, control panels and information displays.
  • Video and Multimedia Processing  Apply the device’s 1080i/p video processing and 2D/3D graphics for camera, video playback and multimedia streaming applications.

Unique Advantages

  • Balanced Processing & Multimedia: A single Cortex‑A8 core with NEON SIMD and documented video/graphics capabilities enables combined application and media workloads.
  • Flexible Memory Interfaces: Support for LPDDR2, DDR2 and DDR3 memory types simplifies BOM choices for different performance and cost targets.
  • Comprehensive Connectivity: Built‑in Ethernet, SATA and multiple USB interfaces reduce the need for external bridge components.
  • Robust Security Suite: Multiple hardware security features (ARM TZ, secure boot, cryptography, secure JTAG, secure memory and tamper detection) help protect system integrity and sensitive data.
  • Industrial Temperature Range: Qualified for -40 °C to 85 °C operation to meet industrial deployment requirements.
  • Compact Packaging: 529‑FBGA (19 × 19 mm) surface‑mount package enables high‑density board layouts for compact systems.

Why Choose MCIMX537CVV8C2?

The MCIMX537CVV8C2 combines a proven ARM® Cortex®‑A8 core with dedicated multimedia and graphics capabilities, broad memory support and a wide set of I/O options to address display‑centric embedded designs. Its industrial qualification and integrated security features make it suitable for long‑running, connected applications that demand multimedia performance and system protection.

As a fully documented device from NXP Semiconductors, it is suited for teams building infotainment, telematics, HMI and multimedia products that require compact packaging, flexible memory options and diverse peripheral interfaces.

Request a quote or submit an inquiry to obtain pricing and availability for the MCIMX537CVV8C2 and to discuss how it fits your next embedded multimedia design.

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