MCIMX6D4AVT10AER

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 414 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D4AVT10AER – ARM® Cortex®-A9 2‑Core 1.0GHz MPU

The MCIMX6D4AVT10AER is an i.MX 6D series microprocessor IC featuring dual ARM® Cortex®-A9 cores running at up to 1.0 GHz. Designed for multimedia-focused embedded systems, this MPU integrates processing, graphics acceleration and a broad set of peripheral interfaces to support advanced HMI and display-based applications.

With memory controllers for LPDDR2, LVDDR3 and DDR3, multiple high‑speed interfaces and hardware security features, the device delivers a balanced combination of performance, integration and system-level capability for resource- and I/O‑rich embedded designs.

Key Features

  • Core Dual ARM® Cortex®-A9 processors, 32‑bit, up to 1 GHz for general-purpose and multimedia processing.
  • Co-processors & DSP Multimedia acceleration and NEON™ SIMD support for optimized media and signal processing workloads.
  • Memory Integrated memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory technologies for flexible system memory options.
  • Graphics & Video Graphics acceleration and 2D/3D processing capabilities to support rich user interfaces and display pipelines.
  • Storage & Connectivity Integrated SATA 3 Gbps controller (1) and Gigabit Ethernet (10/100/1000 Mbps, 1) for local storage and network connectivity.
  • USB & Peripheral Interfaces Four USB 2.0 ports with PHY and additional interfaces including CAN, keypad and LCD controller support.
  • Security On-chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection.
  • Package & Mounting 624‑FCBGA package (21 × 21 mm) optimized for surface-mount assembly.
  • Operating Range Extended operating temperature range from −40 °C to 125 °C for use in thermally demanding environments.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment Systems Multimedia processing, display control and interface convergence for integrated infotainment and entertainment devices.
  • Telematics and HMI Handling of human‑machine interfaces, navigation displays and telematics processing with graphics and media acceleration.
  • Display-Based Clusters Driving multiple displays and cluster-style instrument panels where graphics acceleration and interface density are required.
  • Embedded Multimedia Players Local media playback and user interface rendering leveraging integrated video and graphics capabilities.

Unique Advantages

  • Balanced dual-core performance: Dual Cortex‑A9 cores at 1.0 GHz provide headroom for concurrent UI and application processing.
  • Integrated multimedia engine: NEON SIMD and multimedia co-processors reduce external accelerator needs and simplify BOM.
  • Flexible memory support: Support for LPDDR2, LVDDR3 and DDR3 enables designers to choose memory cost/performance tradeoffs.
  • Rich I/O set: Gigabit Ethernet, SATA, multiple USB ports, CAN and display interfaces enable broad peripheral connectivity without extensive glue logic.
  • Hardware security suite: Multiple on-chip security mechanisms protect boot, run-time and sensitive data areas.
  • Industrial temperature performance: −40 °C to 125 °C operating range supports deployment in thermally challenging embedded environments.

Why Choose MCIMX6D4AVT10AER?

The MCIMX6D4AVT10AER delivers a tightly integrated MPU platform that combines dual-core processing, graphics acceleration and a comprehensive set of high-speed interfaces. It is positioned for embedded multimedia applications that need consolidated functionality—reducing external components while maintaining system-level flexibility.

This device suits designers developing infotainment, telematics, HMI and other display-centric embedded systems who require a scalable, well‑featured processor with on‑chip security and broad memory and I/O support.

If you would like pricing, availability or a formal quote for MCIMX6D4AVT10AER, request a quote or submit an inquiry to receive up-to-date information and ordering options.

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