MCIMX6D5EYM12AE

IC MPU I.MX6D 1.2GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21)

Quantity 958 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.2GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM12AE – IC MPU I.MX6D 1.2GHZ 624FCPBGA

The MCIMX6D5EYM12AE is an NXP Semiconductors i.MX 6D series embedded microprocessor based on the ARM® Cortex®-A9 architecture. It provides a dual-core, 32-bit processing subsystem running at 1.2 GHz designed for multimedia-focused embedded applications.

With integrated memory controllers, a broad set of I/O and high-speed connectivity options, plus on-chip security features and graphics acceleration, this device targets industrial and embedded systems that need balanced compute, multimedia and interface integration in a compact 624‑FCPBGA package.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit, running at 1.2 GHz for responsive application and multimedia processing.
  • Memory Interfaces Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types to support flexible system memory configurations.
  • Graphics & Multimedia Graphics acceleration is included and the i.MX6 family datasheet references integrated 2D/3D processing and 1080p video processing for multimedia-capable designs.
  • High-Speed Connectivity Built-in 10/100/1000 Mbps Ethernet (1) and a SATA 3 Gbps interface (1) provide wired networking and storage connectivity options.
  • USB & Peripheral Interfaces Four USB 2.0 ports with PHY and additional interfaces including CAN support a wide range of peripherals and system functions.
  • Security & Trusted Boot Multiple on-chip security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection for enhanced device protection.
  • Package & Mounting Supplied in a 624‑FCPBGA (21 × 21 mm) surface-mount package for compact board designs.
  • Operating Range & Compliance Operating temperature range from –20 °C to 105 °C and RoHS compliance for regulatory conformance in many embedded applications.

Typical Applications

  • Industrial HMI and Operator Panels Graphics acceleration, LCD/keypad display interfaces and dual-core processing make this device suitable for interactive human‑machine interfaces and control panels.
  • Networked Embedded Systems Integrated Gigabit Ethernet and CAN support enable gateway, router or industrial communication nodes requiring robust wired connectivity.
  • Storage-Enabled Appliances On-chip SATA 3 Gbps and multiple USB 2.0 ports support embedded appliances and devices that require local storage or external media connectivity.
  • Multimedia and Video Devices Graphics acceleration and the i.MX6 series multimedia capabilities support video playback and rich user interface applications.

Unique Advantages

  • Highly Integrated Feature Set: Memory controllers, multiple high-speed interfaces, USB PHYs, Ethernet and SATA reduce external component count and simplify BOM.
  • Security-Focused Design: On-chip TrustZone, secure boot and cryptography features provide a foundation for secure system designs and protected firmware deployment.
  • Flexible Memory Support: Support for LPDDR2, LVDDR3 and DDR3 lets designers choose the most appropriate memory technology for performance, cost and power trade-offs.
  • Compact Surface-Mount Package: The 624‑FCPBGA (21×21 mm) package enables high-density board layouts while providing the I/O required by complex embedded systems.
  • Wide Operating Temperature: Rated from –20 °C to 105 °C for deployment in a range of industrial and commercial environments.

Why Choose MCIMX6D5EYM12AE?

The MCIMX6D5EYM12AE combines dual ARM® Cortex®-A9 processing at 1.2 GHz with a comprehensive set of interfaces and security features, delivering a balanced platform for multimedia-enabled embedded systems. Its integration of memory controllers, Ethernet, SATA, multiple USB ports, CAN and graphics acceleration helps reduce system complexity and BOM while enabling feature-rich products.

This part is well suited to designers seeking a compact, industrial-capable MPU from NXP’s i.MX 6D series for applications that demand multimedia capability, secure boot and a broad peripheral set. The device’s packaging, temperature range and RoHS compliance support long-term deployment in embedded product lines.

Request a quote or submit a sales inquiry to receive pricing and availability for MCIMX6D5EYM12AE and discuss how it fits your design requirements.

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