MCIMX6D5EYM12AC
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21) |
|---|---|
| Quantity | 190 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCPBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 624-LFBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1.2GHz | Supplier Device Package | 624-FCPBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D5EYM12AC – ARM Cortex-A9 Dual-Core 1.2GHz MPU
The MCIMX6D5EYM12AC is an NXP i.MX 6D series microprocessor featuring two ARM® Cortex®-A9 cores running at up to 1.2 GHz. It delivers integrated multimedia processing, NEON™ SIMD acceleration and a broad set of on-chip interfaces for connected embedded applications.
Targeted use cases include human‑machine interfaces, industrial control, multimedia and connected gateway devices where multicore processing, rich I/O and robust security features are required.
Key Features
- Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit, up to 1.2 GHz for responsive application and multimedia workloads.
- Co-processors & Acceleration Multimedia DSP support and NEON™ SIMD for accelerated signal and media processing.
- Memory Controllers Integrated controllers supporting LPDDR2, LVDDR3 and DDR3 memory technologies for flexible system memory choices.
- Graphics & Display Graphics acceleration plus display interface controllers including keypad and LCD support for rich user interfaces.
- Connectivity Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1) and four USB 2.0 ports with PHY enable high-bandwidth I/O and storage options.
- Additional Interfaces On-chip CAN interface for in-vehicle and industrial networking requirements.
- Security Features ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection provide layered device protection.
- Package & Mounting 624‑FCPBGA (21×21) package (624‑LFBGA, FCBGA family); surface-mount mounting type for compact board designs.
- Operating Range Rated for operation from -20 °C to 105 °C.
Typical Applications
- Automotive Infotainment Multimedia processing and multiple display interfaces support infotainment head units and in-cabin entertainment systems.
- Digital Signage & HMI Graphics acceleration and LCD interface enable high-quality displays and interactive kiosks.
- Industrial Control Dual-core processing and CAN connectivity suit intelligent control systems and industrial automation gateways.
- IoT Gateways & Embedded Networking Gigabit Ethernet, SATA and multiple USB ports support networked gateway devices and local storage for edge applications.
Unique Advantages
- Highly integrated connectivity: Gigabit Ethernet, SATA 3 Gbps, four USB 2.0 + PHY ports and CAN reduce external interface components and simplify BOM.
- Balanced multicore performance: Dual ARM® Cortex®-A9 cores at up to 1.2 GHz with NEON SIMD deliver efficient application and multimedia processing.
- Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 allow designers to choose memory technology that fits performance and cost targets.
- Layered device security: Comprehensive security features including TrustZone, secure boot and secure JTAG protect boot and runtime environments.
- Compact, surface-mount package: 624‑FCPBGA (21×21) packaging supports dense PCB layouts for space-constrained embedded designs.
- Wide operating temperature: −20 °C to 105 °C supports deployment in a broad range of embedded environments.
Why Choose MCIMX6D5EYM12AC?
The MCIMX6D5EYM12AC combines dual-core ARM® Cortex®-A9 processing, multimedia acceleration and a rich set of integrated interfaces to simplify system architecture for embedded products that demand multimedia and network connectivity. Its flexible memory support and comprehensive security features make it suitable for designs that require both performance and device protection.
This MPU is positioned for engineers and product teams building connected HMIs, industrial controllers, multimedia systems and gateway devices who need a compact, well‑featured processor with broad I/O and security capabilities backed by the i.MX 6 series platform.
Request a quote or submit an inquiry to get pricing and availability for MCIMX6D5EYM12AC and discuss how it can meet your product requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016