MCIMX6D5EYM12AC

IC MPU I.MX6D 1.2GHZ 624FCPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.2GHz 624-FCPBGA (21x21)

Quantity 190 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCPBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case624-LFBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.2GHzSupplier Device Package624-FCPBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D5EYM12AC – ARM Cortex-A9 Dual-Core 1.2GHz MPU

The MCIMX6D5EYM12AC is an NXP i.MX 6D series microprocessor featuring two ARM® Cortex®-A9 cores running at up to 1.2 GHz. It delivers integrated multimedia processing, NEON™ SIMD acceleration and a broad set of on-chip interfaces for connected embedded applications.

Targeted use cases include human‑machine interfaces, industrial control, multimedia and connected gateway devices where multicore processing, rich I/O and robust security features are required.

Key Features

  • Core & Performance  Dual ARM® Cortex®-A9 cores, 32-bit, up to 1.2 GHz for responsive application and multimedia workloads.
  • Co-processors & Acceleration  Multimedia DSP support and NEON™ SIMD for accelerated signal and media processing.
  • Memory Controllers  Integrated controllers supporting LPDDR2, LVDDR3 and DDR3 memory technologies for flexible system memory choices.
  • Graphics & Display  Graphics acceleration plus display interface controllers including keypad and LCD support for rich user interfaces.
  • Connectivity  Gigabit Ethernet (10/100/1000 Mbps, 1), SATA 3 Gbps (1) and four USB 2.0 ports with PHY enable high-bandwidth I/O and storage options.
  • Additional Interfaces  On-chip CAN interface for in-vehicle and industrial networking requirements.
  • Security Features  ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection provide layered device protection.
  • Package & Mounting  624‑FCPBGA (21×21) package (624‑LFBGA, FCBGA family); surface-mount mounting type for compact board designs.
  • Operating Range  Rated for operation from -20 °C to 105 °C.

Typical Applications

  • Automotive Infotainment  Multimedia processing and multiple display interfaces support infotainment head units and in-cabin entertainment systems.
  • Digital Signage & HMI  Graphics acceleration and LCD interface enable high-quality displays and interactive kiosks.
  • Industrial Control  Dual-core processing and CAN connectivity suit intelligent control systems and industrial automation gateways.
  • IoT Gateways & Embedded Networking  Gigabit Ethernet, SATA and multiple USB ports support networked gateway devices and local storage for edge applications.

Unique Advantages

  • Highly integrated connectivity: Gigabit Ethernet, SATA 3 Gbps, four USB 2.0 + PHY ports and CAN reduce external interface components and simplify BOM.
  • Balanced multicore performance: Dual ARM® Cortex®-A9 cores at up to 1.2 GHz with NEON SIMD deliver efficient application and multimedia processing.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 allow designers to choose memory technology that fits performance and cost targets.
  • Layered device security: Comprehensive security features including TrustZone, secure boot and secure JTAG protect boot and runtime environments.
  • Compact, surface-mount package: 624‑FCPBGA (21×21) packaging supports dense PCB layouts for space-constrained embedded designs.
  • Wide operating temperature: −20 °C to 105 °C supports deployment in a broad range of embedded environments.

Why Choose MCIMX6D5EYM12AC?

The MCIMX6D5EYM12AC combines dual-core ARM® Cortex®-A9 processing, multimedia acceleration and a rich set of integrated interfaces to simplify system architecture for embedded products that demand multimedia and network connectivity. Its flexible memory support and comprehensive security features make it suitable for designs that require both performance and device protection.

This MPU is positioned for engineers and product teams building connected HMIs, industrial controllers, multimedia systems and gateway devices who need a compact, well‑featured processor with broad I/O and security capabilities backed by the i.MX 6 series platform.

Request a quote or submit an inquiry to get pricing and availability for MCIMX6D5EYM12AC and discuss how it can meet your product requirements.

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