MCIMX6D6AVT08ADR

IC MPU I.MX6D 852MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21)

Quantity 1,606 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed852MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT08ADR – IC MPU I.MX6D 852MHz 624FCBGA

The MCIMX6D6AVT08ADR is a dual-core ARM® Cortex®-A9 microprocessor optimized for embedded and industrial multimedia applications. It integrates two 32-bit cores running at up to 852 MHz and combines multimedia acceleration, extensive memory interfaces, and a broad set of peripheral connectivity to support complex embedded designs.

Designed as part of the i.MX 6D family, this device targets applications that require balanced processing performance, multimedia capability, and a high level of I/O integration within a compact 624‑FCBGA (21 × 21 mm) package.

Key Features

  • Processor Core – Dual ARM® Cortex®-A9 cores, 32‑bit architecture running at 852 MHz to deliver responsive application and control processing.
  • Multimedia Acceleration – Integrated graphics acceleration and multimedia coprocessors including NEON™ SIMD to accelerate media and signal processing tasks.
  • Memory Support – Memory controller support for LPDDR2, LVDDR3 and DDR3 memory technologies; datasheet for the i.MX6 series documents a 64‑bit DDR memory interface option for high‑bandwidth designs.
  • Connectivity and I/O – Rich peripheral set including 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), four USB 2.0 ports with PHY, CAN interface and display/keypad controllers for system and user‑interface connectivity.
  • Security and Trusted Boot – On‑chip security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection for hardened device-level protection.
  • Package and Mounting – 624‑FBGA / FCBGA surface‑mount package specified as 624‑FCBGA (21 × 21 mm) for compact, production‑ready board integration.
  • Operating Temperature – Specified operating range from −40 °C to 125 °C to support deployment in demanding thermal environments.
  • Standards and Compliance – RoHS compliant material status.

Typical Applications

  • Industrial Control & Automation – Dual‑core processing and CAN/Ethernet connectivity enable machine control, protocol bridging and real‑time supervisory tasks in industrial systems.
  • Human‑Machine Interfaces (HMI) – Graphics acceleration, display controller support and multiple USB ports make this device suitable for touchscreen panels and operator interfaces.
  • Networking & Communications – Integrated gigabit Ethernet and multiple USB interfaces support networking gateways, protocol converters and communication appliances.
  • Storage and Multimedia Gateways – SATA 3 Gbps plus multimedia coprocessors provide a foundation for multimedia storage appliances, media gateways and content handling devices.

Unique Advantages

  • Highly integrated I/O: Multiple high‑speed interfaces (Ethernet, SATA, USB, CAN) reduce external components and simplify board design.
  • Balanced compute and multimedia: Dual Cortex‑A9 cores with NEON SIMD and graphics acceleration deliver both control performance and media processing in a single device.
  • Comprehensive security features: Built‑in TrustZone, cryptography and secure boot features help protect system IP and enable secure device provisioning.
  • Wide temperature operation: −40 °C to 125 °C rating supports deployment in harsh or industrial thermal environments.
  • Compact production package: 624‑FCBGA (21 × 21 mm) footprint provides a high pin‑count solution in a compact form factor for space‑constrained designs.
  • Part of the i.MX 6 family: Documented in the i.MX6 series technical datasheet, enabling consistent design reference across the i.MX 6 product family.

Why Choose MCIMX6D6AVT08ADR?

The MCIMX6D6AVT08ADR positions itself as a balanced, highly integrated embedded processor for industrial and multimedia‑focused applications. With dual ARM® Cortex®‑A9 cores at 852 MHz, broad memory support, hardware multimedia acceleration and extensive peripheral connectivity, it provides a versatile platform for designs that require both application processing and media handling.

This part is suitable for engineers seeking a compact BGA package with hardened security features and an operating temperature range that accommodates demanding environments. As a member of the i.MX 6D family, it aligns with established series documentation and feature sets to ease system design and integration.

To request a quote or submit an inquiry for purchasing information and availability, please contact sales or request a quote through your preferred procurement channel.

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