MCIMX6D6AVT10AD

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 18 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT10AD – IC MPU I.MX6D 1.0GHZ 624FCBGA

The MCIMX6D6AVT10AD is an embedded microprocessor built on the ARM® Cortex®-A9 architecture with two 32-bit cores running at 1.0 GHz. It targets multimedia-focused embedded designs that require integrated processing, graphics acceleration, and broad peripheral connectivity.

Featuring memory controller support for LPDDR2, LVDDR3 and DDR3, multiple high-bandwidth interfaces and integrated security features, this device is suited for embedded systems that combine user interfaces, storage and networked connectivity in a compact package.

Key Features

  • CPU Core & Acceleration  Dual ARM® Cortex®-A9 cores (32-bit) at 1 GHz with multimedia DSP and NEON™ SIMD support for accelerated media and signal processing.
  • Memory Interfaces  Integrated controllers for LPDDR2, LVDDR3 and DDR3 memories to support a range of system performance and cost targets.
  • Graphics & Display  Graphics acceleration is supported and display interface controllers include LCD and keypad support for HMI applications.
  • High-Speed Connectivity  Built-in 10/100/1000 Mbps Ethernet (single port), SATA 3 Gbps (single port) and four USB 2.0 ports with PHY provide broad I/O for networking, storage and peripheral attachments.
  • Automotive-related interfaces  Includes a CAN interface for robust vehicle or industrial fieldbus communications.
  • Security & Boot  On-chip security features include ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection for protected system operation.
  • Package & Mounting  624-FCBGA package (21 × 21 mm, 0.8 mm pitch) in a surface-mount format for compact board-level integration.
  • Operating Range & Compliance  Rated for operation from -40 °C to 125 °C and RoHS compliant for environmental compliance.

Typical Applications

  • Human–Machine Interfaces (HMI)  Drive LCD panels and keypad-based controls while offloading multimedia tasks to the integrated graphics and NEON SIMD engine.
  • Industrial Control & Automation  Utilize Ethernet and CAN connectivity along with wide temperature tolerance for embedded control systems and field devices.
  • Networked Storage & Gateway Devices  Combine SATA and USB ports with Gigabit Ethernet to implement storage gateways, data-loggers and communication bridges.
  • Multimedia Embedded Systems  Leverage dual cores and multimedia DSP capabilities for audio/video processing, user interfaces and peripheral aggregation.

Unique Advantages

  • Highly integrated multimedia processing: Dual ARM® Cortex®-A9 cores with NEON™ SIMD and multimedia DSP support reduce the need for external accelerators.
  • Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 simplify BOM choices across performance and cost targets.
  • Broad native connectivity: Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CAN provide direct interfaces to networking, storage and field buses.
  • Comprehensive security features: Hardware TrustZone, secure boot and cryptographic capabilities support secure system architectures and protected storage.
  • Compact, production-ready package: 624-FCBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package enables dense, industrial-strength board designs.
  • Wide operating temperature: -40 °C to 125 °C supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6D6AVT10AD?

The MCIMX6D6AVT10AD delivers a balanced combination of dual-core processing, multimedia acceleration and a wide set of integrated interfaces in a compact BGA package. Its flexible memory support and security feature set make it suitable for embedded designs that require media handling, storage and network connectivity while retaining a small board footprint.

This part is appropriate for engineers specifying embedded platforms that must integrate display and HMI functionality, connect to wired networks and storage, and operate across a broad temperature range. The combination of integrated peripherals and security primitives helps simplify system architecture and reduce external component count.

Request a quote or submit an inquiry to learn more about availability and lead times for MCIMX6D6AVT10AD.

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