MCIMX6D6AVT10AD
| Part Description |
ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) |
|---|---|
| Quantity | 18 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A9 | Device Package | 624-FCBGA (21x21) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 624-FBGA, FCBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 3Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1.0GHz | Supplier Device Package | 624-FCBGA (21×21) | ||
| USB | USB 2.0 + PHY (4) | Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Overview of MCIMX6D6AVT10AD – IC MPU I.MX6D 1.0GHZ 624FCBGA
The MCIMX6D6AVT10AD is an embedded microprocessor built on the ARM® Cortex®-A9 architecture with two 32-bit cores running at 1.0 GHz. It targets multimedia-focused embedded designs that require integrated processing, graphics acceleration, and broad peripheral connectivity.
Featuring memory controller support for LPDDR2, LVDDR3 and DDR3, multiple high-bandwidth interfaces and integrated security features, this device is suited for embedded systems that combine user interfaces, storage and networked connectivity in a compact package.
Key Features
- CPU Core & Acceleration Dual ARM® Cortex®-A9 cores (32-bit) at 1 GHz with multimedia DSP and NEON™ SIMD support for accelerated media and signal processing.
- Memory Interfaces Integrated controllers for LPDDR2, LVDDR3 and DDR3 memories to support a range of system performance and cost targets.
- Graphics & Display Graphics acceleration is supported and display interface controllers include LCD and keypad support for HMI applications.
- High-Speed Connectivity Built-in 10/100/1000 Mbps Ethernet (single port), SATA 3 Gbps (single port) and four USB 2.0 ports with PHY provide broad I/O for networking, storage and peripheral attachments.
- Automotive-related interfaces Includes a CAN interface for robust vehicle or industrial fieldbus communications.
- Security & Boot On-chip security features include ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC plus tamper detection for protected system operation.
- Package & Mounting 624-FCBGA package (21 × 21 mm, 0.8 mm pitch) in a surface-mount format for compact board-level integration.
- Operating Range & Compliance Rated for operation from -40 °C to 125 °C and RoHS compliant for environmental compliance.
Typical Applications
- Human–Machine Interfaces (HMI) Drive LCD panels and keypad-based controls while offloading multimedia tasks to the integrated graphics and NEON SIMD engine.
- Industrial Control & Automation Utilize Ethernet and CAN connectivity along with wide temperature tolerance for embedded control systems and field devices.
- Networked Storage & Gateway Devices Combine SATA and USB ports with Gigabit Ethernet to implement storage gateways, data-loggers and communication bridges.
- Multimedia Embedded Systems Leverage dual cores and multimedia DSP capabilities for audio/video processing, user interfaces and peripheral aggregation.
Unique Advantages
- Highly integrated multimedia processing: Dual ARM® Cortex®-A9 cores with NEON™ SIMD and multimedia DSP support reduce the need for external accelerators.
- Flexible memory support: On-chip controllers for LPDDR2, LVDDR3 and DDR3 simplify BOM choices across performance and cost targets.
- Broad native connectivity: Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CAN provide direct interfaces to networking, storage and field buses.
- Comprehensive security features: Hardware TrustZone, secure boot and cryptographic capabilities support secure system architectures and protected storage.
- Compact, production-ready package: 624-FCBGA (21 × 21 mm, 0.8 mm pitch) surface-mount package enables dense, industrial-strength board designs.
- Wide operating temperature: -40 °C to 125 °C supports deployment in thermally demanding embedded environments.
Why Choose MCIMX6D6AVT10AD?
The MCIMX6D6AVT10AD delivers a balanced combination of dual-core processing, multimedia acceleration and a wide set of integrated interfaces in a compact BGA package. Its flexible memory support and security feature set make it suitable for embedded designs that require media handling, storage and network connectivity while retaining a small board footprint.
This part is appropriate for engineers specifying embedded platforms that must integrate display and HMI functionality, connect to wired networks and storage, and operate across a broad temperature range. The combination of integrated peripherals and security primitives helps simplify system architecture and reduce external component count.
Request a quote or submit an inquiry to learn more about availability and lead times for MCIMX6D6AVT10AD.

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