MCIMX6D6AVT10AE

IC MPU I.MX6D 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 980 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D6AVT10AE – IC MPU I.MX6D 1.0GHZ 624FCBGA

The MCIMX6D6AVT10AE is a dual‑core ARM® Cortex®‑A9 microprocessor IC in the i.MX 6D series, operating at up to 1.0 GHz. It is a multimedia‑focused embedded processor that combines CPU performance with integrated 2D/3D graphics and video processing to address display‑centric and HMI applications.

Built with a broad set of memory and peripheral interfaces, extensive security features, and a compact 624‑FCBGA (21 × 21 mm) package, this device targets embedded systems requiring integrated multimedia, connectivity, and secure boot capability.

Key Features

  • CPU Core — Dual ARM® Cortex®‑A9 cores, 32‑bit architecture running up to 1.0 GHz for balanced compute performance in embedded multimedia workloads.
  • Multimedia & Graphics — Integrated 2D and 3D graphics processors and 1080p video processing to support sophisticated display and user‑interface designs.
  • Memory Interfaces — Multi‑type memory controller support including LPDDR2, LVDDR3 and DDR3 enabling flexible system memory configurations.
  • Connectivity & Storage — Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps interface, and up to four USB 2.0 ports with integrated PHY provide versatile networking and storage options.
  • Additional I/O — Integrated CAN interface plus display controllers for LCD and keypad support to simplify board‑level integration.
  • Security — Comprehensive security feature set including ARM TrustZone, boot security, cryptography, secure JTAG, secure fusebox, secure memory, secure RTC and tamper detection for device integrity and protected boot flows.
  • Package & Mounting — 624‑FCBGA (21 × 21 mm) surface‑mount package with 0.8 mm ball pitch suitable for compact embedded designs.
  • Operating Range — Rated for operation from −40 °C to 125 °C to support deployment in temperature‑demanding environments.
  • Compliance — RoHS‑compliant manufacturing status.

Typical Applications

  • Infotainment & Multimedia Systems — Use the integrated graphics and 1080p video processing to drive in‑device displays and media playback functions.
  • Human‑Machine Interfaces (HMI) — Dual cores and graphics acceleration enable responsive user interfaces and display control for embedded panels.
  • Networked Embedded Gateways — Gigabit Ethernet, SATA and multiple USB ports support network connectivity and local storage for embedded gateway appliances.
  • Telematics & Display Systems — Multi‑interface connectivity and wide operating temperature range make the device suitable for display‑based systems and telematics controllers.

Unique Advantages

  • Balanced dual‑core processing: Two ARM® Cortex®‑A9 cores at up to 1.0 GHz deliver the compute capacity needed for concurrent UI, media, and control tasks.
  • Integrated multimedia engine: On‑chip 2D/3D graphics and 1080p video processing reduce external component count for display and video applications.
  • Flexible memory support: Native controllers for LPDDR2, LVDDR3 and DDR3 allow designers to select memory types that match performance and cost targets.
  • Rich peripheral set: Gigabit Ethernet, SATA 3Gbps, four USB 2.0 ports with PHY, and CAN provide broad connectivity without extensive external bridging.
  • Comprehensive security: Multiple hardware security features—TrustZone, secure boot, cryptography and tamper detection—support secure system architectures and boot integrity.
  • Rugged operating range: −40 °C to 125 °C capability supports use in thermally challenging embedded environments.

Why Choose MCIMX6D6AVT10AE?

The MCIMX6D6AVT10AE positions itself as a highly integrated embedded microprocessor that combines dual‑core ARM® performance with dedicated multimedia acceleration and a broad peripheral set. Its memory flexibility, comprehensive security features, and compact 624‑FCBGA package make it suitable for designs that need a tightly integrated solution for display, media, and networked embedded systems.

Engineers and procurement teams seeking a processor that simplifies BOM and supports robust, design‑focused deployments will find the MCIMX6D6AVT10AE fits applications where integrated graphics, storage and connectivity are central to the system architecture.

Request a quote or submit an inquiry to start the evaluation process and obtain pricing and availability for the MCIMX6D6AVT10AE.

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