MCIMX6D7CVT08AD

IC MPU I.MX6D 800MHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 624-FCBGA (21x21)

Quantity 1,211 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP Semiconductors
Manufacturing StatusActive
Manufacturer Standard Lead Time0 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D7CVT08AD – IC MPU I.MX6D 800MHZ 624FCBGA

The MCIMX6D7CVT08AD is an ARM® Cortex®-A9 dual-core microprocessor in the i.MX 6D series, running at 800 MHz and supplied in a 624-FCBGA (21×21) package. Designed for embedded and industrial applications, it combines dual-core 32-bit processing with multimedia acceleration and a broad set of high-speed interfaces.

Its combination of connectivity, storage and display interfaces, along with integrated security features and an industrial operating temperature range, makes it suitable for robust embedded systems where integration and reliability are required.

Key Features

  • Core and Performance Dual ARM® Cortex®-A9 cores, 32-bit, operating at 800 MHz for balanced compute performance in embedded workloads.
  • Multimedia and DSP Includes multimedia co-processing and NEON™ SIMD for accelerated media processing and signal operations.
  • Memory Support Integrated controllers for DDR3, DDR3L and LPDDR2 memory types to support flexible system memory configurations.
  • Connectivity and I/O Rich interface set including 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1), four USB 2.0 ports with PHY, and CANbus for industrial communications.
  • Display and HMI Display interface controllers for LCD and keypad integration to support human-machine interface designs.
  • Security On-chip security features including ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Mounting 624-FCBGA (21×21) package, surface-mount format suitable for compact embedded assemblies.
  • Qualification and Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
  • Graphics Acceleration Graphics acceleration is provided to assist display and multimedia applications.

Typical Applications

  • Industrial Control & Automation — Dual-core processing, CANbus and industrial qualification make it suitable for control nodes and automation gateways.
  • Human-Machine Interfaces (HMIs) — LCD and keypad controllers plus graphics acceleration support operator panels and touchscreen displays.
  • Networked Embedded Systems — Gigabit Ethernet, multiple USB ports and SATA support enable networked appliances, gateways and edge devices.
  • Data Logging & Storage Appliances — Integrated SATA and robust memory controller support storage and data acquisition applications.

Unique Advantages

  • Highly Integrated Connectivity: Includes Gigabit Ethernet, SATA 3 Gbps, multiple USB 2.0 ports and CANbus to reduce external interface components.
  • Security-Ready Platform: Extensive on-chip security features (ARM TZ, boot security, cryptography, secure JTAG, secure memory, secure RTC and tamper detection) for protected boot and runtime.
  • Industrial Temperature Range: Rated for −40 °C to 105 °C to meet the thermal demands of harsh embedded environments.
  • Multimedia Acceleration: NEON™ SIMD and multimedia co-processing capabilities to offload media and signal processing tasks.
  • Memory Flexibility: Support for DDR3, DDR3L and LPDDR2 enables designers to choose memory types that match performance and power targets.
  • Compact Surface-Mount Package: 624-FCBGA (21×21) package for space-constrained board designs.

Why Choose MCIMX6D7CVT08AD?

The MCIMX6D7CVT08AD from NXP Semiconductors positions itself as a versatile embedded processor combining dual-core ARM® Cortex®-A9 performance, multimedia acceleration and a comprehensive set of connectivity and security features. Its industrial qualification and wide operating temperature range make it appropriate for robust, long-life embedded systems.

This device is well suited for customers building industrial controls, HMI panels, networked edge devices and storage-enabled appliances that require integrated interfaces, on-chip security and flexible memory options in a compact package.

Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6D7CVT08AD. Our team can provide the information you need to evaluate this processor for your embedded design.

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