MCIMX6D7CZK08AD

IC MPU I.MX6D 800MHZ 569MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 569-MAPBGA (12x12)

Quantity 1,672 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package569-MAPBGA (12x12)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case569-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package569-MAPBGA (12×12)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D7CZK08AD – IC MPU I.MX6D 800MHZ 569MAPBGA

The MCIMX6D7CZK08AD is an industrial-grade ARM® Cortex®-A9 microprocessor in the i.MX 6D series, featuring a dual-core, 32-bit architecture running at up to 800 MHz. It integrates multimedia acceleration, a broad set of I/O controllers, and a range of security features to support embedded designs that require performance and system-level integration.

Designed for multimedia-focused embedded systems, this device offers memory controller support, display interfaces, wired connectivity and storage interfaces suitable for applications such as high-end mobile internet devices and portable media systems where processing efficiency and integrated peripherals reduce system complexity.

Key Features

  • Core & Performance Dual ARM® Cortex®-A9 cores, 32-bit, up to 800 MHz, delivering multi-threaded application processing for embedded multimedia workloads.
  • Co-processors Multimedia accelerator and NEON™ SIMD support for enhanced media and signal processing performance.
  • Memory Integrated memory controller support for LPDDR2, LVDDR3 and DDR3, including a 2 × 32-bit LPDDR2-800 interface as described in the series datasheet.
  • Display & User I/O On-chip display interface controllers for keypad and LCD connectivity to drive local user interfaces.
  • Connectivity & Storage Integrated 10/100/1000 Mbps Ethernet (1), SATA 3 Gbps (1) and four USB 2.0 ports with PHY; additional CAN interface for deterministic networking.
  • Security & System Protection ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection for robust platform security.
  • Package & Temperature 569-MAPBGA package (12 × 12 mm) in a 569-LFBGA footprint; surface-mount package qualified for industrial temperature range of −40 °C to 105 °C.
  • Qualification & Compliance Industrial qualification and RoHS compliance for use in industrial embedded systems.

Typical Applications

  • High-end mobile Internet devices — System processing and multimedia support for portable internet-enabled platforms, as cited in the i.MX 6Dual/6Quad series documentation.
  • Portable media players and PDAs — Hardware acceleration and NEON SIMD support for HD-capable media playback and responsive user interfaces.
  • Embedded industrial systems — Industrial temperature qualification and integrated interfaces (Ethernet, SATA, CAN, USB) for robust control, HMI and data-logging applications.

Unique Advantages

  • Integrated multimedia and SIMD acceleration: Reduces external processing requirements for audio/video and signal processing tasks.
  • Comprehensive connectivity: On-chip Gigabit Ethernet, SATA and multiple USB ports simplify board design and reduce BOM count.
  • Security-rich feature set: Multiple hardware security mechanisms—TrustZone, secure JTAG, secure memory and fusebox—support secure boot and runtime protection.
  • Memory flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to choose memory that matches performance and cost targets.
  • Industrial temperature and qualification: −40 °C to 105 °C rating and industrial qualification support deployment in temperature-demanding embedded environments.

Why Choose MCIMX6D7CZK08AD?

The MCIMX6D7CZK08AD positions itself as a highly integrated dual-core application processor for embedded and multimedia-focused systems. With ARM® Cortex®-A9 cores, hardware multimedia and SIMD acceleration, broad memory interface support and a wide range of on-chip peripherals, it enables designers to implement compact, feature-rich systems while minimizing external components.

This device is well suited to engineers and product teams building industrially qualified embedded products that require secure boot, networked connectivity, local storage and display/user interface capabilities. Its package and environmental ratings support deployment in temperature-challenging applications while leveraging the i.MX 6 series architecture and documentation for system integration.

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