MCIMX6D7CZK08AE

IC MPU I.MX6D 800MHZ 569MAPBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 800MHz 569-MAPBGA (12x12)

Quantity 600 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package569-MAPBGA (12x12)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case569-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package569-MAPBGA (12×12)
USBUSB 2.0 + PHY (4)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6D7CZK08AE – IC MPU I.MX6D 800MHz 569-MAPBGA

The MCIMX6D7CZK08AE is a dual-core ARM® Cortex®-A9 microprocessor operating at up to 800 MHz, designed for embedded multimedia-focused applications. It is part of the i.MX 6D series from NXP Semiconductors and combines dual-core processing, integrated multimedia engines, and on-chip power management for efficient system-level integration.

Targeted use cases include high-performance portable and embedded multimedia devices as well as industrial embedded systems that require robust operation across a wide temperature range and comprehensive on-chip security features.

Key Features

  • Processor Core Dual ARM® Cortex®-A9 32-bit cores clocked up to 800 MHz for responsive application processing.
  • Multimedia Acceleration Integrated 2D and 3D graphics processing and 1080p video processing support from the i.MX 6Dual/6Quad family, with Multimedia co-processors and NEON™ SIMD for media and signal processing tasks.
  • Memory Interfaces Built-in memory controllers for LPDDR2, LVDDR3 and DDR3; datasheet specifies a 2 × 32-bit LPDDR2-800 memory interface for high-bandwidth memory access.
  • Broad Peripheral Set Single Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps interface, four USB 2.0 ports with PHY, CAN and display controllers for keypad and LCD connections.
  • Security and Tamper Protection Hardware security features include ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Power Integration Integrated power management features are included in the i.MX 6Dual/6Quad series to support optimized power consumption and system power sequencing.
  • Package and Mounting Supplied in a 569-MAPBGA (12×12 mm) package case (569-LFBGA), surface-mountable for compact board designs.
  • Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • High-end Mobile Internet Devices (MID) — Provides multimedia processing, connectivity and display interfaces suitable for portable internet platforms.
  • High-end PDAs — Dual-core processing and multimedia acceleration support responsive user interfaces and media playback.
  • Portable Media Players (PMP) with HD Video — Enables 1080p video processing and graphics acceleration for HD media playback in portable applications.
  • Industrial Embedded Systems — Industrial qualification, extended temperature range and comprehensive security features make it suitable for rugged embedded installations.

Unique Advantages

  • Highly integrated multimedia platform: On-chip 2D/3D graphics and 1080p video processing reduce external component needs for video-capable designs.
  • Flexible memory support: Multiple DRAM controller options (LPDDR2, LVDDR3, DDR3) and a 2×32-bit LPDDR2-800 interface enable designers to choose memory configurations that match performance and cost targets.
  • Comprehensive I/O connectivity: Gigabit Ethernet, SATA, multiple USB 2.0 ports with PHY and CAN provide a wide set of high-speed peripheral interfaces for storage, networking and I/O expansion.
  • Built-in hardware security: Boot security, cryptography and TrustZone support help protect system integrity and sensitive data at the hardware level.
  • Industrial-grade reliability: Qualified for industrial use and specified for −40 °C to 105 °C operation to support deployment in harsh environments.
  • Compact BGA package: 569-MAPBGA (12×12 mm) package enables dense board layouts for space-constrained embedded designs.

Why Choose MCIMX6D7CZK08AE?

The MCIMX6D7CZK08AE combines dual ARM® Cortex®-A9 processing with dedicated multimedia engines, robust security features, and a broad set of high-speed interfaces to address embedded designs that require both media capability and industrial reliability. As part of the i.MX 6D family from NXP Semiconductors, it offers series-level architectural features such as integrated power management and multimedia acceleration that simplify system design.

This device is particularly well suited for engineers building portable multimedia products, networked embedded systems, and industrial applications that demand extended temperature operation and on-chip security. Its flexible memory support and compact BGA package help balance performance, BOM complexity and board area in commercial designs.

Request a quote or submit a product inquiry for the MCIMX6D7CZK08AE to receive pricing and availability information tailored to your project needs.

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