MCIMX6DP4AVT1ABR

IC MPU I.MX6DP 1.0GHZ 624FCBGA
Part Description

ARM® Cortex®-A9 Microprocessor IC i.MX6DP 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21)

Quantity 1,856 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6DP
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A9Device Package624-FCBGA (21x21)
Display & Interface ControllersHDMI, Keypad, LCD, LVDS, MIPI/DSI, ParallelECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case624-FBGA, FCBGARAM ControllersLPDDR2, DDR3L, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesARM TZ, A-HAB, CAAM, CSU, SJC, SNVSSpeed1.0GHzSupplier Device Package624-FCBGA (21×21)
USBUSB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)Voltage – I/O1.8V, 2.5V, 2.8V, 3.3V

Overview of MCIMX6DP4AVT1ABR – IC MPU I.MX6DP 1.0GHZ 624FCBGA

The MCIMX6DP4AVT1ABR is a dual-core ARM® Cortex®-A9 microprocessor operating at 1.0 GHz, offered in a 624-FCBGA (21 × 21 mm) package. Designed for graphics- and multimedia-focused embedded designs, it combines dual Cortex‑A9 cores with dedicated multimedia and NEON™ SIMD acceleration and integrated system features for high-performance display, video and peripheral control.

As a member of the i.MX 6DP series, this device targets graphics-intensive and high-performance infotainment-type applications where integrated display interfaces, storage and networking peripherals are required along with system-level security and power management features.

Key Features

  • Core — Dual ARM® Cortex®-A9 32-bit processors running at 1 GHz for responsive application processing.
  • Multimedia & SIMD — Multimedia co-processors and NEON™ SIMD acceleration, plus updated 2D/3D graphics and 1080p video processing capabilities referenced in the series datasheet.
  • Memory Support — Integrated memory controller supporting LPDDR2, DDR3L and DDR3 memory technologies with a 64-bit interface noted in the datasheet.
  • Display Interfaces — Support for HDMI, LCD parallel, LVDS, MIPI/DSI and keypad interfaces for rich HMI and display configurations.
  • Connectivity & Storage — Integrated Gigabit Ethernet (10/100/1000 Mbps), one SATA 3 Gbps port, multiple USB 2.0 + PHY ports and one USB 2.0 OTG + PHY port; CAN interface also available.
  • Security & System Management — Security features including ARM TrustZone (ARM TZ), A‑HAB, CAAM, CSU, SJC and SNVS for system integrity and secure boot options referenced in the product data.
  • Package & Mounting — 624‑FCBGA (21 × 21 mm) surface‑mount package suitable for compact system boards.
  • Operating Range & Compliance — Extended operating temperature range from −40 °C to 125 °C and RoHS compliance.
  • Integrated Power Management — The series datasheet references integrated power management to support system-level power optimization.

Typical Applications

  • High‑performance Infotainment Systems — Drives multimedia, display and audio subsystems with HDMI, MIPI/DSI and 1080p video processing capabilities.
  • Graphics‑Intensive Embedded Devices — Suitable for devices requiring 2D/3D acceleration and NEON SIMD for enhanced graphics and media processing.
  • Connected Storage and Networking Appliances — Integrated Gigabit Ethernet, SATA and multiple USB ports enable networked storage and connectivity-focused applications.
  • Advanced HMI and Display Controllers — Multi‑interface display support (LVDS, parallel LCD, HDMI) for rich human‑machine interfaces and camera sensor integration.

Unique Advantages

  • Balanced CPU and Multimedia Compute: Dual Cortex‑A9 cores paired with multimedia co-processors and NEON SIMD deliver a practical blend of application and media processing performance.
  • Extensive I/O Integration: On-chip support for Ethernet, SATA, multiple USB ports, CAN and a broad set of display interfaces reduces external component count and simplifies board design.
  • Flexible Memory Options: Support for LPDDR2, DDR3L and DDR3 memory systems enables designers to match system cost and performance requirements.
  • System Security Building Blocks: Multiple security modules (ARM TZ, A‑HAB, CAAM, CSU, SJC, SNVS) provide layered mechanisms for secure boot and runtime protection.
  • Wide Thermal Range: −40 °C to 125 °C operating range supports deployment in thermally demanding environments.
  • Industry‑Standard Package: 624‑FCBGA (21 × 21 mm) surface-mount package fits compact designs while enabling high pin density.

Why Choose MCIMX6DP4AVT1ABR?

The MCIMX6DP4AVT1ABR combines dual ARM Cortex‑A9 processing, dedicated multimedia acceleration and a comprehensive set of peripheral interfaces in a single, RoHS‑compliant 624‑FCBGA package. It is positioned for embedded designs that require integrated display, storage and connectivity capabilities alongside security features and integrated power management referenced in the series documentation.

As part of the i.MX 6DP family from NXP Semiconductors, this device suits projects that need a compact, integrated MPU platform with scalable multimedia and I/O options, enabling efficient BOM reduction and concentrated system design effort.

Request a quote or submit your requirements to get pricing and availability for MCIMX6DP4AVT1ABR. Our team can provide lead-time and ordering information to support your design schedule.

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